Normadoc vous propose la nouvelle édition de l'IPC-A-600J Edition 05/2016

IPC A-600J:2016 - Single user CD non printable

PC has released IPC-A-600J, Acceptability of Printed Boards, the definitive illustrated guide to printed circuit board acceptability. This companion document to IPC-6012, Qualification and Performance Specification for Rigid Printed Boards and IPC-6013, Qualification and Performance Specification for Flexible Printed Boards, provides photographs and illustrations that are either internally or externally observable on bare printed boards.

"Revision J to IPC-A-600 contains more than 120 new or modified photographs and illustrations that provide pictorial interpretation of requirements introduced in IPC-6012D from September 2015,” said John Perry, director, printed board standards & technology at IPC. “Most importantly, it addresses copper filled microvias, registration to microvia capture lands, microvia target land dimension, etchback, smear removal and plating requirements for surface mount lands."

Along with descriptions for target, acceptable, and nonconforming conditions that are either externally or internally observable on printed boards, this document provides many updates, including:

  • Process Indicators Condition Further Defined
  • Haloing Penetration Distance Updated
  • Nicks and Penetration Further Defined
  • Crazing Penetration Criteria Updated
  • Voids – Copper Plating, Finished Coating Photos Updated
  • Surface Plating – Edge Connector Lands, Further Defined and new photos
  • Surface Plating – Rectangular Surface Mount Lands, Defined and new photos

On top of that, photographs and illustrations provide coverage on topics ranging from copper wrap plating, copper cap plating of filled holes, and hole wall/barrel separation. It also includes updated and expanded coverage for measling of printed boards, delamination and haloing, laminate voids/cracks, etchback, blind and buried via fill, and flexible circuits. Basically, it represents the visual interpretation of minimum requirements set forth in various printed board specifications.


IPC 6012DA:2016 - Hard Copy

IPC 6012DA:2016 - Single-user CD non printable

IPC 6012DA:2016 - Kit (hard copy and CD non printable)

Automotive Applications Addendum to IPC-6012D, Qualficiation and Performance Specification for Rigid Printed Boards.

This Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012D, Revision D, for rigid printed boards that must survive the vibration and thermal cycling environments of electronic interconnects within the automotive industry. Released April 2016.

IPC 6012D:2015 - Hard Copy

IPC 6012D:2015 - Single-user CD non printable

IPC 6012D:2015 - Kit (hard copy and CD non printable)

Qualification and Performance Specification for Rigid Printed Boards.
This specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. Revision D incorporates many new requirements in areas such as HASL coatings, alternative surface finishes, edge plating, marking, microvia capture and target lands, copper cap plating of filled holes, copper filled microvias and dielectric removal. For use with IPC-6011. Supersedes IPC-6012C and IPC-6016

IPC 6013C:2013 - Hard Copy

IPC 6013C:2013 - Single-user CD non printable

IPC 6013C:2013 - Kit (hard copy and CD non printable)

Covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias. Revision C incorporates new and updated requirements for final finishes, surface and hole plating, stiffeners, copper filled microvias, cap plating of holes, thermal stress testing, smear removal, and conductor thickness. Supersedes IPC-6013B. For use with IPC-6011. Included in IPC-C-102, IPC-C-1000 collections and the 6010 Series.