TIA TSB 144:2003 (R2012)

TIA TSB 144:2003 (R2012)

Adhesive Bubbles and Voids in Fiber Optic Components: Guidance, Issues and Challenges

€92.40

Details

The bulletin is applicable to fiber optic component reliability. The document is written for fiber optic component manufacturers, as well as end-users, and was prepared by TIA Working Group FO-6.3.1, Adhesives Reliability under the cognizance of FO-6.3 SC Subcommittee on Interconnecting Devices and Passive Products.

Additional Info

Author Telecommunications Industry Association (TIA)
Published by TIA
Document type Standard
Confirmation date 2012-01-01
ICS 33.180.20 : Fibre optic interconnecting devices
Number of pages 24
Document history
Keyword EIA 144,144,EIA TSB-144