JEDEC
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JEDEC JESD46D
CUSTOMER NOTIFICATION OF PRODUCT/PROCESS CHANGES BY ELECTRONIC PRODUCT SUPPLIERS
4/12/2023 - PDF - English - JEDEC
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€395.00
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€223.00
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€60.00
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€79.00
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JEDEC JESD91B:2022
Method for Developing Acceleration Models for Electronic Device Failure Mechanisms
3/1/2022 - PDF - English - JEDEC
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JEDEC JESD402-1A:2022
Temperature Range and Measurement Standards for Components and Module
3/1/2022 - PDF - English - JEDEC
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JEDEC JESD302-1:2022
TS5111, TS5110 Serial Bus Thermal Sensor Device Standard
1/1/2022 - PDF - English - JEDEC
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JEDEC JESD305:2022
DDR5 Load Reduced (LRDIMM) and Registered Dual Inline Memory Module (RDIMM) Common Specification
1/1/2022 - PDF - English - JEDEC
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JEDEC JESD22-A120C:2022
Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Electronic Devices
1/1/2022 - PDF - English - JEDEC
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JEDEC JESD315:2021
Backup Energy Module Standard for NVDIMM Memory Devices (BEM)
12/1/2021 - PDF - English - JEDEC
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€223.00
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JEDEC JEP187:2021
Guidelines for Representing Switching Losses of SIC Mosfets in Datasheets
12/1/2021 - PDF - English - JEDEC
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JEDEC JEP186:2021
Guideline to Specify a Transient Off-State Withstand Voltage Robustness Indicator in Datasheets for Lateral GaN Power Conversion Devices, Version 1.0
12/1/2021 - PDF - English - JEDEC
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€97.00
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€304.00
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JEDEC JESD22-B118A:2021
SEMICONDUCTOR WAFER AND DIE BACKSIDE EXTERNAL VISUAL INSPECTION
11/1/2021 - PDF - English - JEDEC
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€58.24
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€55.12
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€74.00
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€58.24
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JEDEC JESD89-2B:2021
Test Method for Alpha Source Accelerated Soft Error Rate
7/1/2021 - PDF - English - JEDEC
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€350.00
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€395.00
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JEDEC JESD22-A110E.01:2021
HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST)
5/1/2021 - PDF - English - JEDEC
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€55.12
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JEDEC JESD260:2021
Replay Protected Monotonic Counter (RPMC) For Serial Flash Devices
4/1/2021 - PDF - English - JEDEC
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€57.00
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JEDEC JEP178:2021
Electrostatic Discharge (ESD) Sensitivity Testing - Reporting ESD Withstand Levels on Datasheets
4/1/2021 - PDF - English - JEDEC
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€64.00
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€244.00
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JEDEC JESD209-4-1A:2021
Addendum No. 1 to JESD209-4 - Low Power Double Data Rate 4 (LPDDR4)
2/1/2021 - PDF - English - JEDEC
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€264.00
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€113.00
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€55.12
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€64.00
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JEDEC JEP167A:2020
Characterization of Interfacial Adhesion in Semiconductor Packages
11/1/2020 - PDF - English - JEDEC
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JEDEC JESD22-A100E:2020
Cycled Temperature Humidity-Bias with Surface Condensation Life Test
11/1/2020 - PDF - English - JEDEC
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€204.00
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JEDEC JESD22-A113I:2020
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
4/1/2020 - PDF - English - JEDEC
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JEDEC JESD251A:2020
Expanded Serial Peripheral Interface (xSPI) for Non Volatile Memory Devices
2/1/2020 - PDF - English - JEDEC
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JEDEC JESD300-5:2020
SPD5118, SPD5108 Hub and Serial Presence Detect Device Standard
2/1/2020 - PDF - English - JEDEC
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JEDEC JEP180:2020
Guideline for Switching Reliability Evaluation Procedures for Gallium Nitride Power Conversion Devices
2/1/2020 - PDF - English - JEDEC
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€54.33
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€57.00
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€57.00
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€395.00
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€60.00
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JEDEC JESD220-3:2020
Universal Flash Storage (UFS) Host Performance Booster (HPB) Extension
1/1/2020 - PDF - English - JEDEC
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JEDEC JEP162A:2019
System Level ESD Part II: Implementation of Effective ESD Robust Designs
9/1/2019 - PDF - English - JEDEC
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€244.00
-
€58.00
-
€72.00
-
€72.00
-
€64.00
-
€204.00
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JEDEC JESD84-B51A:2019
Embedded Multi-media card (e*MMC), Electrical Standard (5.1)
1/1/2019 - PDF - English - JEDEC
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ESDA/JEDEC JS-002:2018
ESDA/JEDEC Joint Standard for Electrostatic Discharge Sensitivity Testing - Charged Device Model (CDM) - Device Level
1/1/2019 - PDF - English - JEDEC
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JEDEC JEP143D:2019
SOLID STATE RELIABILITY ASSESSMENT QUALIFICATION METHODOLOGIES
1/1/2019 - PDF - English - JEDEC
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€77.00
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JEDEC JESD22-A117E:2018
ELECTRICALLY ERASABLE PROGRAMMABLE ROM (EEPROM) PROGRAM/ERASE ENDURANCE AND DATA RETENTION TEST
11/1/2018 - PDF - English - JEDEC
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€57.00
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JEDEC JESD251-1:2018
Addendum No. 1 to JESD251, Optional x4 Quad I/O With Data Strobe
10/1/2018 - PDF - English - JEDEC
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JEDEC JEP001-3A:2018
FOUNDRY PROCESS QUALIFICATION GUIDELINES - PRODUCT LEVEL (Wafer Fabrication Manufacturing Sites)
9/1/2018 - PDF - English - JEDEC
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JEDEC JEP001-2A:2018
FOUNDRY PROCESS QUALIFICATION GUIDELINES - FRONT END TRANSISTOR LEVEL (Wafer Fabrication Manufacturing Sites)
9/1/2018 - PDF - English - JEDEC
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JEDEC JEP001-1A:2018
FOUNDRY PROCESS QUALIFICATION GUIDELINES - BACKEND OF LINE (Wafer Fabrication Manufacturing Sites)
9/1/2018 - PDF - English - JEDEC
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JEDEC JESD22-B113B:2018
BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF SMT ICS FOR HANDHELD ELECTRONIC PRODUCTS
8/1/2018 - PDF - English - JEDEC
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€77.00
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€97.00
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JEDEC JESD671C:2018
Component Quality Problem Analysis and Corrective Action Requirements (Including Administrative Quality Problems)
7/1/2018 - PDF - English - JEDEC
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JEDEC JESD22-A111B:2018
EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
3/1/2018 - PDF - English - JEDEC
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JEDEC JESD72A:2018
TEST METHODS AND ACCEPTANCE PROCEDURES FOR THE EVALUATION OF POLYMERIC MATERIALS
3/1/2018 - PDF - English - JEDEC
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JEDEC JEP156A:2018
CHIP-PACKAGE INTERACTION UNDERSTANDING, IDENTIFICATION AND EVALUATION
3/1/2018 - PDF - English - JEDEC
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JEDEC JS709C:2018
Joint JEDEC/ECA Standard: Definition of "Low-Halogen" for Electronic Products
3/1/2018 - PDF - English - JEDEC
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€86.00
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€51.00
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JEDEC JESD88F:2018
JEDEC Dictionary of Terms for Solid-State Technology, 7th Edition
2/1/2018 - PDF - English - JEDEC
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€66.00
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€66.00
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€66.00
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JEDEC JESD50C:2018
SPECIAL REQUIREMENTS FOR MAVERICK PRODUCT ELIMINATION AND OUTLIER MANAGEMENT
1/1/2018 - PDF - English - JEDEC
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JEDEC JESD223D:2018
Universal Flash Storage Host Controller Interface (UFSHCI)
1/1/2018 - PDF - English - JEDEC
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JEDEC JESD69C:2017
INFORMATION REQUIREMENTS FOR THE QUALIFICATION OF SILICON DEVICES
11/1/2017 - PDF - English - JEDEC
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JEDEC JESD16B:2017
ASSESSMENT OF AVERAGE OUTGOING QUALITY LEVELS IN PARTS PER MILLION (PPM)
11/1/2017 - PDF - English - JEDEC
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JEDEC JESD30H:2017
Descriptive Designation System for Semiconductor-device Packages
8/1/2017 - PDF - English - JEDEC
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JEDEC JESD37A:2017
Lognormal Analysis of Uncensored Data, and of Singly Right-Censored Data Utilizing the Persson and Rootzen Method
8/1/2017 - PDF - English - JEDEC
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JEDEC JESD214.01:2017
CONSTANT-TEMPERATURE AGING METHOD TO CHARACTERIZE COPPER INTERCONNECT METALLIZATIONS FOR STRESS-INDUCED VOIDING
8/1/2017 - PDF - English - JEDEC
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€326.00
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€60.00
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€304.00
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JEDEC JS-001-2017
ESDA/JEDEC Joint Standard for Electrostatic Discharge Sensitivity Testing - Human Body Modal (HBM) - Component Level
5/12/2017 - PDF - English - JEDEC
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€79.00
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JEDEC JESD9C:2017
Inspection Criteria for Microelectronic Packages and Covers
5/1/2017 - PDF - English - JEDEC
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€60.00
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JEDEC JESD213A:2017
STANDARD TEST METHOD UTILIZING X-RAY FLUORESCENCE (XRF) FOR ANALYZING COMPONENT FINISHES AND SOLDER ALLOYS TO DETERMINE TIN (Sn) - LEAD (Pb) CONTENT
4/1/2017 - PDF - English - JEDEC
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JEDEC JESD210A:2017
AVALANCHE BREAKDOWN DIODE (ABD) TRANSIENT VOLTAGE SUPPRESSORS
3/1/2017 - PDF - English - JEDEC
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€58.00
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€72.00
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JEDEC JESD31E:2016
GENERAL REQUIREMENTS FOR DISTRIBUTORS OF COMMERCIAL AND MILITARY SEMICONDUCTOR DEVICES
11/1/2016 - PDF - English - JEDEC
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€83.00
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JEDEC JESD22-B111A:2016
BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
11/1/2016 - PDF - English - JEDEC
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JEDEC JESD22-B106E:2016
RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES
11/1/2016 - PDF - English - JEDEC
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€174.00
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€60.00
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€223.00
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€72.00
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JEDEC JESD218B.01:2016
SOLID STATE DRIVE (SSD) REQUIREMENTS AND ENDURANCE TEST METHOD
6/1/2016 - PDF - English - JEDEC
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€72.00
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€64.00
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JEDEC J-STD-609B:2016
MARKING, SYMBOLS, AND LABELS OF LEADED AND LEAD-FREE TERMINAL FINISHED MATERIALS USED IN ELECTRONIC ASSEMBLY
4/1/2016 - PDF - English - JEDEC
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€97.00
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JEDEC JESD223-1A:2016
Universal Flash Storage Host Controller Interface (UFSHCI), Unified Memory Extension
3/1/2016 - PDF - English - JEDEC
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JEDEC JESD243:2016
COUNTERFEIT ELECTRONIC PARTS: NON-PROLIFERATION FOR MANUFACTURERS
3/1/2016 - PDF - English - JEDEC
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JEDEC JESD241:2015
Procedure for Wafer-Level DC Characterization of Bias Temperature Instabilities
12/1/2015 - PDF - English - JEDEC
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JEDEC JESD94B:2015 (R2021)
APPLICATION SPECIFIC QUALIFICATION USING KNOWLEDGE BASED TEST METHODOLOGY
10/1/2015 - PDF - English - JEDEC
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€57.00
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€55.00
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€224.00
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JEDEC JEP172A:2015
DISCONTINUING USE OF THE MACHINE MODEL FOR DEVICE ESD QUALIFICATION
7/1/2015 - PDF - English - JEDEC
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€57.00
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€57.00
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JEDEC JESD22-A110E:2015
HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST)
7/1/2015 - PDF - English - JEDEC
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JEDEC JEP159A:2015
PROCEDURE FOR THE EVQLUQTION OF LOW-k/METAL INTER/INTRA-LEVEL DIELECTRIC INTEGRITY
7/1/2015 - PDF - English - JEDEC
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€55.00
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€79.00
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JEDEC JEP166A:2014
JC-42.6 MANUFACTURER IDENTIFICATION (ID) CODE FOR LOW POWER MEMORIES
12/1/2014 - PDF - English - JEDEC
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€55.00
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€124.00
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€60.00
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€66.00
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€83.00
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JEDEC JEP153A:2014 (R2019)
CHARACTERIZATION AND MONITORING OF THERMAL STRESS TEST OVEN TEMPURATURES
3/1/2014 - PDF - English - JEDEC
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€72.00
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JEDEC JP001A:2014
FOUNDRY PROCESS QUALIFICATION GUIDELINES (Wafer Fabrication Manufacturing Sites)
2/1/2014 - PDF - English - JEDEC
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€81.00
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JEDEC JEP148B:2014
RELIABILITY QUALIFICATION OF SEMICONDUCTOR DEVICES BASED ON PHYSICS OF FAILURE RISK AND OPPORTUNITY ASSESSMENT
1/1/2014 - PDF - English - JEDEC
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€124.00
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JEDEC JESD234:2013
Test Standard for the Measurement of Proton Radiation Single Event Effects in Electronic Devices
10/1/2013 - PDF - English - JEDEC
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€77.00
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JEDEC JEP70C:2013
Guide to Standards and Publications Relating to Quality and Reliability of Electronic Hardware
10/1/2013 - PDF - English - JEDEC
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JEDEC JESD84-B50:2013
Embedded Multi-media card (e*MMC), Electrical Standard 5.0
9/1/2013 - PDF - English - JEDEC
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€326.00
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JEDEC JEP150.01:2013
STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE MECHANISMS ASSOCIATED WITH ASSEMBLED SOLID STATE SURFACE-MOUNT COMPONENTS
6/1/2013 - PDF - English - JEDEC
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€51.00
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€64.00
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JEDEC JESD79-3-1A:2013
Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, and DDR3L-1600
1/1/2013 - PDF - English - JEDEC
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JEDEC JEP170:2013
Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA)
1/1/2013 - PDF - English - JEDEC
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JEDEC JESD99C:2012
Terms, Definitions, and Letter Symbols for Microelectronic Devices
12/1/2012 - PDF - English - JEDEC
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JEDEC JESD211.01:2012
ZENER AND VOLTAGE REGULATOR DIODE RATING VERIFICATION AND CHARACTERIZATION TESTING
11/1/2012 - PDF - English - JEDEC
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JEDEC JESD51-12.01:2012
GUIDELINES FOR REPORTING AND USING ELECTRONIC PACKAGE THERMAL INFORMATION
11/1/2012 - PDF - English - JEDEC
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JEDEC JESD77D:2012
Terms, Definitions, and Letter Symbols for Discrete Semiconductor and Optoelectronic Devices
8/1/2012 - PDF sécurisé - English - JEDEC
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€72.00
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€72.00
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€72.00
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JEDEC JESD51-53:2012
TERMS, DEFINITIONS AND UNITS GLOSSARY FOR LED THERMAL TESTING
5/1/2012 - PDF - English - JEDEC
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JEDEC JEP144A:2011
GUIDELINE FOR RESIDUAL GAS ANALYSIS (RGA) FOR MICROELECTRONIC PACKAGES
11/1/2011 - PDF - English - JEDEC
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JEDEC JEP160:2011
Long-Term Storage for Electronic Solid-State Wafers, Dice, and Devices
11/1/2011 - PDF - English - JEDEC
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€51.00
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JEDEC JESD79-3-2:2011
Addendum No. 2 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, and DDR3L-1600
10/1/2011 - PDF - English - JEDEC
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€51.00
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€60.00
-
€304.00
-
€79.00
-
€58.00
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JEDEC JESD51-32:2010
THERMAL TEST BOARD STANDARDS TO ACCOMMODATE MULTI-CHIP PACKAGES
12/1/2010 - PDF - English - JEDEC
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JEDEC JESD51-14:2010
INTERFACE TEST METHOD FOR THE MEASUREMENT OF THE THERMAL RESISTANCE JUNCTION-TO-CASE OF SEMICONDUCTOR DEVICES WITH HEAT FLOW TROUGH A SINGLE PATH
11/1/2010 - PDF - English - JEDEC
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JEDEC JESD22-A115C:2010
ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING MACHINE MODEL (MM)
11/1/2010 - PDF - English - JEDEC
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JEDEC JEP709:2010
A Guideline for Defining "Low-Halogen" Solid State Devices (Removal of BFR/CFR/PVC)
11/1/2010 - PDF - English - JEDEC
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JEDEC JESD22-B108B:2010 (R2016)
Coplanarity Test for Surface-Mount Semiconductor Devices
9/1/2010 - PDF - English - JEDEC
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€55.00
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JEDEC JESD79-3-1:2010
Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, and DDR3L-1600
7/1/2010 - PDF - English - JEDEC
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€93.00
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JEDEC JESD84-A441:2010
EMBEDDED MULTIMEDIACARD(e*MMC) e*MMC/CARD PRODUCT STANDARD, HIGH CAPACITY, including Reliable Write, Boot, Sleep Modes, Dual Data Rate, Multiple Partitions Supports, Security Enhancement, Background Operation and High Priority Interrupt (MMCA, 4.41)
3/1/2010 - PDF - English - JEDEC
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€124.00
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JEDEC JEP133C:2010
GUIDE FOR THE PRODUCTION AND ACQUISITION OF RADIATION-HARDNESS ASSURED MULTICHIP MODULES AND HYBRID MICROCIRCUITS
1/1/2010 - PDF - English - JEDEC
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€204.00
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JEDEC JEP158:2009
3D Chip Stack with Through-Silicon Vias (TSVS): Identifying, Evaluating and Understanding Reliability Interactions
11/1/2009 - PDF - English - JEDEC
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€57.00
-
€64.00
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JEDEC JESD8-23:2009
UNIFIED WIDE POWER SUPPLY VOLTAGE RANGE CMOS DC INTERFACE STANDARD FOR NON-TERMINATED DIGITAL INTEGRATED CIRCUITS
10/1/2009 - PDF - English - JEDEC
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JEDEC JESD22-B112A:2009
PACKAGE WARPAGE MEASUREMENT OF SURFACE-MOUNT INTEGRATED CIRCUITS AT ELEVATED TEMPERATURE
10/1/2009 - PDF - English - JEDEC
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JEDEC JESD 84-C44:2009
EMBEDDED MULTIMEDIACARD (e-MMC) MECHANICAL STANDARD, WITH OPTIONAL RESET SIGNAL
7/1/2009 - PDF - English - JEDEC
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€58.00
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JEDEC JIG 101 Ed. 2.0:2009
Material Composition Declaration for Electronic Products
4/1/2009 - PDF - English - JEDEC
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JEDEC JESD 209A-1:2009
Addendum No. 1 to JESD209A - LOW POWER DOUBLE DATA RATE (LPDDR) SDRAM, 1.2 V I/O
3/1/2009 - PDF - English - JEDEC
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JEDEC JS 9703:2009
IPC/JEDEC-9703: Mechanical Shock Test Guidelines for Solder Joint Reliability
3/1/2009 - PDF - English - JEDEC
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€64.00
-
JEDEC JESD22-A114F:2008
ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING HUMAN BODY MODEL (HBM)
12/1/2008 - PDF - English - JEDEC
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€55.00
-
€72.00
-
JEDEC JESD201A:2008 (R2020)
Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finished
9/1/2008 - PDF - English - JEDEC
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€66.00
-
JEDEC JESD51-31:2008
THERMAL TEST ENVIRONMENT MODIFICATIONS FOR MULTICHIP PACKAGES
7/1/2008 - PDF - English - JEDEC
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JEDEC JESD 22-A121A:2008 (R2019) (R2014)
MEASURING WHISKER GROWTH ON TIN AND TIN ALLOY SURFACE FINISHES
7/1/2008 - PDF - English - JEDEC
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JEDEC JESD8-18A:2008
FBDIMM SPECIFICATION: HIGH SPEED DIFFERENTIAL PTP LINK AT 1.5 V
3/1/2008 - PDF - English - JEDEC
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€151.00
-
JEDEC JEP154:2008
GUIDELINE FOR CHARACTERIZING SOLDER BUMP ELECTROMIGRATION UNDER CONSTANT CURRENT AND TEMPERATURE STRESS
1/1/2008 - PDF - English - JEDEC
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€58.00
-
€72.00
-
JEDEC JESD84-A43:2007
EMBEDDED MULTIMEDIACARD (e*MMC) e*MMC/CARD PRODUCT STANDARD, HIGH CAPACITY, INCLUDING RELIABLE WRITE, BOOT, AND SLEEP MODES (MMCA, 4.3)
12/1/2007 - PDF - English - JEDEC
Learn More€223.00
