PD IEC TR 62878-2-7:2019

PD IEC TR 62878-2-7:2019

Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards

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Assembly,Stress,Testing,Boards,Circuits

Additional Info

Author British Standards Institution (BSI)
Committee EPL/501 - Electrical
Published by BSI
Document type Standard
EAN ISBN 978 0 539 03359 5
ICS 31.180 : Printed circuits and boards
31.190 : Electronic component assemblies
Number of pages 16
Cross references IEC/TR 62878-2-7 Ed.1.0
Keyword PD IEC TR 62878-2-7:2019