PD IEC TR 61760-3-1:2022

PD IEC TR 61760-3-1:2022

Surface mounting technology Standard method for the specification of components through hole reflow (THR) soldering. Guidelines diameter design with solder paste surface printing

Availability: In stock

€250.00

Details

Components,Electrical components,Circuits,Integrated circuits,Surface mounting devices,Solders

Additional Info

Author British Standards Institution (BSI)
Committee EPL/501 - Electrical
Published by BSI
Document type Standard
EAN ISBN 978 0 539 17936 1
ICS 31.190 : Electronic component assemblies
Number of pages 30
Keyword PD IEC TR 61760-3-1:2022