Name | Support | Language | Availability | Edition date | Price | ||
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PDF |
English |
Active |
4/12/2023 |
€58.00 |
|
Details
This document specifies a method for measuring the thermal resistance between a heater chip and a cold plate with the heater chip mounted on a metalized ceramic substrate, imitating a silicon carbide (SiC) high-output power module. This measurement represents an index of the heat dissipation characteristics of a metallized ceramic substrate used in a high-output power module.
"Directives : Not yet available in DB
Additional Info
Author | Bureau de Normalisation Belge (NBN) |
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Published by | NBN |
Document type | Standard |
ICS | 81.060.30 : Advanced ceramics
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Document history | No |
Keyword | ISO 4825-1, ISO 4825-1:2023 |