JEDEC JESD22-B118A:2021

JEDEC JESD22-B118A:2021

SEMICONDUCTOR WAFER AND DIE BACKSIDE EXTERNAL VISUAL INSPECTION

€66.00

Details

This inspection method is for product semiconductor wafers and dice prior to assembly. This test method defines the requirements to execute a standardized external visual inspection and is a non-invasive and nondestructive examination that can be used for qualification, quality monitoring, and lot acceptance.

Additional Info

Author JEDEC Solid State Technology Association
Published by JEDEC
Document type Standard
Theme /subgroups/36080
ICS 31.200 : Integrated circuits. Microelectronics
Number of pages 18
Replace JEDEC JESD22-B118:2011 (R2016)
Keyword JEDEC JESD22-B118A