Name | Support | Language | Availability | Edition date | Price | ||
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PDF |
English |
Active |
11/1/2021 |
€66.00 |
|
Details
This inspection method is for product semiconductor wafers and dice prior to assembly. This test method defines the requirements to execute a standardized external visual inspection and is a non-invasive and nondestructive examination that can be used for qualification, quality monitoring, and lot acceptance.
Additional Info
Author | JEDEC Solid State Technology Association |
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Published by | JEDEC |
Document type | Standard |
Theme | /subgroups/36080 |
ICS | 31.200 : Integrated circuits. Microelectronics
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Number of pages | 18 |
Replace | JEDEC JESD22-B118:2011 (R2016) |
Keyword | JEDEC JESD22-B118A |