JEDEC JESD22-B106E:2016

JEDEC JESD22-B106E:2016

RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES

€58.00

Details

This test method is used to determine whether solid state devices can withstand the effect of the temperature shock to which they will be subjected during soldering of their leads in a solder wave process and/or solder fountain (rework/replacement) process. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.

Additional Info

Author JEDEC Solid State Technology Association
Published by JEDEC
Document type Standard
Theme /subgroups/36080
Number of pages 14
Replace JEDEC JESD22-B106D
Keyword JEDEC JESD22-B106E