| Name | Support | Language | Availability | Edition date | Price | ||
|---|---|---|---|---|---|---|---|
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PDF |
English |
Active |
7/1/2008 |
€66.00 |
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Details
This document specifies the definition and construction of a two-resistor compact thermal model (CTM) from the JEDEC junction-to-case and junction-to-board thermal metrics. The guidance provided in this document only applies to thermal metrics defined in JEDEC standards JESD51-8 and JESD51-12. The scope of this document is limited to single-die packages that can be effectively represented by a single junction temperature.
Additional Info
| Author | JEDEC Solid State Technology Association |
|---|---|
| Published by | JEDEC |
| Document type | Standard |
| Theme | /subgroups/36160 |
| Number of pages | 21 |
| Keyword | JEDEC JESD15-3 |
