| Name | Support | Language | Availability | Edition date | Price | ||
|---|---|---|---|---|---|---|---|
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PDF |
English |
Active |
9/1/2016 |
€174.00 |
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Details
This publication provides a list of failure mechanisms and their associated activation energies or acceleration factors that may be used in making system failure rate estimations when the only available data is based on tests performed at accelerated stress test conditions. The method to be used is the Sum-of-the-Failure-Rates method. This publication also provides guidance in the selection of reliability modeling parameters, namely functional form, apparent thermal activation energy values and sensitivity to stresses such as power supply voltage, substrate current, current density, gate voltage, relative humidity, temperature cycling range, mobile ion concentration, etc.
Additional Info
| Author | JEDEC Solid State Technology Association |
|---|---|
| Published by | JEDEC |
| Document type | Standard |
| Theme | /subgroups/13660 |
| Edition | H |
| ICS | 31.080.01 : Semiconductor devices in general
|
| Number of pages | 114 |
| Replace | JEDEC JEP122G,JEDEC JEP 122F,JEDEC JEP 122E |
| Keyword | JEDEC JEP122H |
