JEDEC J-STD-609B:2016

JEDEC J-STD-609B:2016

MARKING, SYMBOLS, AND LABELS OF LEADED AND LEAD-FREE TERMINAL FINISHED MATERIALS USED IN ELECTRONIC ASSEMBLY

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Details

This standard applies to components and assemblies that contain Pb-free and Pb-containing solders and finishes. This standard describes the marking of components and the labeling of their shipping containers to identify their 2nd level terminal finish or material, and applies to components that are intended to be attached to boards or assemblies with solder or mechanical clamping or are press fit. This standard also applies to 2nd level terminal materials for bumped die that are used for direct board attach.

Additional Info

Author JEDEC Solid State Technology Association
Published by JEDEC
Document type Standard
Theme /subgroups/36080
Number of pages 24
Replace JEDEC J-STD-609A.01,JEDEC J-STD-609
Keyword JEDEC J-STD-609B