| Name | Support | Language | Availability | Edition date | Price | ||
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PDF sécurisé |
Spanish |
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3/1/2018 |
€108.00 |
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Paper |
Spanish |
Active |
3/1/2018 |
€173.00 |
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PDF sécurisé |
Chinese |
Active |
3/1/2018 |
€108.00 |
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Paper |
English |
Active |
3/1/2018 |
€173.00 |
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PDF sécurisé |
English |
Active |
3/1/2018 |
€108.00 |
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Paper |
Japanese |
Active |
3/1/2018 |
€220.00 |
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PDF sécurisé |
Japanese |
Active |
3/1/2018 |
€161.00 |
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Details
IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.
Additional Info
| Author | Association Connecting Electronics Industries (IPC) |
|---|---|
| Published by | IPC |
| Document type | Standard |
| Theme | General |
| ICS | 31.240 : Mechanical structures for electronic equipment
|
| Number of pages | 32 |
| Replace | IPC J-STD-033C-1,IPC J-STD-033C,IPC J-STD-033B,IPC J-STD-033 |
| Keyword | IPC J-STD-033D |
