IPC J-STD-027:2003

IPC J-STD-027:2003

Mechanical Outline Standard for Flip Chip or Chip Scale Configurations

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Details

THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.

Additional Info

Author Association Connecting Electronics Industries (IPC)
Published by IPC
Document type Standard
Theme Design
ICS 31 : Electronics
Number of pages 20
Document history IPC J-STD-027 (2003-02-20)
Keyword IPC 027,027,J-STD-027