Name | Support | Language | Availability | Edition date | Price | ||
---|---|---|---|---|---|---|---|
PDF sécurisé |
English |
Active |
2/1/2003 |
€108.00 |
|
||
Paper |
English |
Active |
2/1/2003 |
€168.00 |
|
Details
THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.
Additional Info
Author | Association Connecting Electronics Industries (IPC) |
---|---|
Published by | IPC |
Document type | Standard |
Theme | Design |
ICS | 31 : Electronics
|
Number of pages | 20 |
Document history | IPC J-STD-027 (2003-02-20) |
Keyword | IPC 027,027,J-STD-027 |