| Name | Support | Language | Availability | Edition date | Price | ||
|---|---|---|---|---|---|---|---|
|
PDF sécurisé |
Chinese |
Active |
11/1/2017 |
€158.00 |
|
||
|
Paper |
English |
Active |
11/1/2017 |
€218.00 |
|
||
|
PDF sécurisé |
English |
Active |
11/1/2017 |
€158.00 |
|
||
|
PDF sécurisé |
Japanese |
Active |
11/1/2017 |
€234.00 |
|
||
Details
This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs. This standard also includes a test method for the resistance to dissolution/dewetting of metallization. This standard is intended for use by both supplier and user.
Additional Info
| Author | Association Connecting Electronics Industries (IPC) |
|---|---|
| Published by | IPC |
| Document type | Standard |
| Theme | General |
| EAN ISBN | 9781951577841 |
| ICS | 31 : Electronics
|
| Number of pages | 68 |
| Replace | IPC J-STD-002D,IPC J-STD-002C,IPC J-STD-002B |
| Keyword | IPC J-STD-002E |
