| Name | Support | Language | Availability | Edition date | Price | ||
|---|---|---|---|---|---|---|---|
|
CD-Rom |
English |
Active |
5/29/2023 |
€151.00 |
|
||
Details
Single-sided (4 up) pattern used for evaluating interaction of solder flux & solder paste residues on printed boards. The board contains 4 comb patterns with .4 mm lines & .5 mm spaces. (2 pcs 30 x 45 cm 1:1) Film.
Additional Info
| Author | Association Connecting Electronics Industries (IPC) |
|---|---|
| Published by | IPC |
| Document type | Standard |
| Weight(kg.) | 0.4000 |
| Keyword | IPC A-24 |
