IPC 9707:2011

IPC 9707:2011

Spherical Bend Test Method for Characterization of Board Level Interconnects

€185.00

Details

This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component's board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that can occur during conventional printed board/system assembly, manufacturing and test operations. This method is applicable to surface mounted BGA components larger than 15.0 mm on a side with organically based substrates, attached to printed boards using conventional solder reflow technologies. This document was developed cooperatively with JEDEC.

Additional Info

Author Association Connecting Electronics Industries (IPC)
Published by IPC
Document type Standard
Theme General
ICS 31 : Electronics
Number of pages 24
Keyword IPC 9707