Name | Support | Language | Availability | Edition date | Price | ||
---|---|---|---|---|---|---|---|
PDF sécurisé |
English |
Active |
9/1/2011 |
€185.00 |
|
||
Paper |
English |
Active |
9/1/2011 |
€231.00 |
|
Details
This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component's board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that can occur during conventional printed board/system assembly, manufacturing and test operations. This method is applicable to surface mounted BGA components larger than 15.0 mm on a side with organically based substrates, attached to printed boards using conventional solder reflow technologies. This document was developed cooperatively with JEDEC.
Additional Info
Author | Association Connecting Electronics Industries (IPC) |
---|---|
Published by | IPC |
Document type | Standard |
Theme | General |
ICS | 31 : Electronics
|
Number of pages | 24 |
Keyword | IPC 9707 |