| Name | Support | Language | Availability | Edition date | Price | ||
|---|---|---|---|---|---|---|---|
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PDF sécurisé |
English |
Active |
2/1/2022 |
€109.00 |
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Details
This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict field lifetime of solder attachments for the use environments and conditions of electronic assemblies.
Additional Info
| Author | Association Connecting Electronics Industries (IPC) |
|---|---|
| Published by | IPC |
| Document type | Standard |
| Theme | /subgroups/19420 |
| EAN ISBN | 9781638160724 |
| ICS | 25.160.50 : Brazing and soldering
|
| Number of pages | 24 |
| Replace | IPC 9701A,IPC 9701 |
| Keyword | IPC 9701B |
