| Name | Support | Language | Availability | Edition date | Price | ||
|---|---|---|---|---|---|---|---|
|
Paper |
English |
Active |
6/1/1998 |
€135.00 |
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|
PDF sécurisé |
English |
Active |
6/1/1998 |
€104.00 |
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Details
This document is another in a series and specifically addresses preconditioning of non-IC components used in electronic assembly. Do the components work with your process? That determination is the goal of these manufacturing process simulations, to ensure that the components chosen meet expected reliability requirements after exposure to factory processes. Developed for users and manufacturers, the procedure consists of a set of simulations, for non-IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes, and exposure to often-used cleaning materials.
Additional Info
| Author | Association Connecting Electronics Industries (IPC) |
|---|---|
| Published by | IPC |
| Document type | Standard |
| ICS | 31 : Electronics
|
| Number of pages | 27 |
| Weight(kg.) | 0.1459 |
| Keyword | IPC 9504 |
| ANSI Approved |
