IPC 6018D:2022

IPC 6018D:2022

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

€195.00

Details

This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores. The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers.

Additional Info

Author Association Connecting Electronics Industries (IPC)
Published by IPC
Document type Standard
Theme /subgroups/55721
EAN ISBN 9781638160601
ICS 31.180 : Printed circuits and boards
Number of pages 60
Replace IPC 6018C,IPC 6018B,IPC 6018A,IPC 6016
Modified by IPC 6018DS:2022
Keyword IPC 6018D