Name | Support | Language | Availability | Edition date | Price | ||
---|---|---|---|---|---|---|---|
PDF sécurisé |
English |
Active |
2/1/2022 |
€195.00 |
|
Details
This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores. The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers.
Additional Info
Author | Association Connecting Electronics Industries (IPC) |
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Published by | IPC |
Document type | Standard |
Theme | /subgroups/55721 |
EAN ISBN | 9781638160601 |
ICS | 31.180 : Printed circuits and boards
|
Number of pages | 60 |
Replace | IPC 6018C,IPC 6018B,IPC 6018A,IPC 6016 |
Modified by | IPC 6018DS:2022 |
Keyword | IPC 6018D |