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9/1/2021 |
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Chinese |
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9/1/2021 |
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9/1/2021 |
€255.00 |
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English |
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9/1/2021 |
€255.00 |
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Details
IPC-6013E standard covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias.
The IPC-6013E standard incorporates new and updated requirements for final finishes, rigid-to-flex transition zones, foreign inclusions, surface mount land anomalies, plated internal layers, dielectric removal as a function of wicking and etchback, copper filled via structures microvia structures.
Additional Info
Author | Association Connecting Electronics Industries (IPC) |
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Published by | IPC |
Document type | Standard |
Theme | General |
Edition | E |
EAN ISBN | 978-1-63816-020-5 |
ICS | 31.180 : Printed circuits and boards
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Number of pages | 84 |
Replace | IPC 6013D (2017-09-01), IPC 6013D AMD 1 (2018-04-01) |
Keyword | 6013-STD-0-D-0-EN-E, 6013-STD-0-D-0-EN-E |