IPC 6012E-AM1:2022

IPC 6012E-AM1:2022

IPC-6012E-AM1: Qualification and Performance Specification for Rigid Printed Boards

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Details

IPC-6012E-AM1 is an Amendent to the IPC-6012E that clarifes the distinction between receding and dewetting solder in reflowed SPb or HASL coatings. The Amendment also provides amended criteria for minimum external conductor thickness of the finished printed board and new acceptance criteria for the minimum thickness of internal plated layers

Additional Info

Author Association Connecting Electronics Industries (IPC)
Published by IPC
Document type Norms amendments
Edition E
EAN ISBN 978-1-63816-067-0
ICS 31.180 : Printed circuits and boards
Number of pages 12
Modify IPC 6012E:2020
Keyword IPC 6012EA