| Name | Support | Language | Availability | Edition date | Price | ||
|---|---|---|---|---|---|---|---|
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PDF |
English |
Active |
6/17/2022 |
€219.00 |
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Details
IEC TR 61760-3-1:2022(E) supplements IEC 61760-3 to describe examples of solder paste supply methods, the relationship between the terminal position tolerance and the through hole diameter, and provides guidelines for the design of printed circuit boards with solder paste surface printing method, including specific examples.
Additional Info
| Author | International Electrotechnical Commission (IEC) |
|---|---|
| Committee | TC 91 |
| Published by | IEC |
| Document type | Standard |
| Edition | 1.0 |
| ICS | 31.190 : Electronic component assemblies
|
| Number of pages | 26 |
| Keyword | IEC61760-3-1,IEC TR 61760-3-1:2022,IEC/TR 61760-3-1,TC 91 |
