| Name | Support | Language | Availability | Edition date | Price | ||
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PDF |
English, French |
Active |
11/28/2018 |
€92.00 |
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Details
IEC 63011-3:2018 specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC) to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3-D IC.
Power devices, RF devices and micro-electromechanical systems (MEMS) are not in the scope of this document.
Additional Info
| Author | International Electrotechnical Commission (IEC) |
|---|---|
| Committee | TC 47/SC 47A |
| Published by | IEC |
| Document type | Standard |
| Edition | 1.0 |
| ICS | 31.200 : Integrated circuits. Microelectronics
|
| Number of pages | 28 |
| Keyword | IEC63011-3,IEC 63011-3:2018,IEC 63011-3,TC 47/SC 47A |
