| Name | Support | Language | Availability | Edition date | Price | ||
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PDF |
English, French |
Active |
11/27/2008 |
€173.00 |
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Details
The test method described in IEC 62137-1-3:2008 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.
Additional Info
| Author | International Electrotechnical Commission (IEC) |
|---|---|
| Committee | TC 91 |
| Published by | IEC |
| Document type | Standard |
| Edition | 1.0 |
| ICS | 31.190 : Electronic component assemblies
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| Number of pages | 46 |
| Keyword | IEC62137-1-3,IEC 62137-1-3:2008,IEC 62137-1-3,TC 91 |
