IEC 62047-25:2016

IEC 62047-25:2016

IEC 62047-25:2016 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

€173.00

Details

IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.

Additional Info

Author International Electrotechnical Commission (IEC)
Committee TC 47/SC 47F
Published by IEC
Document type Standard
Edition 1.0
ICS 31.080.99 : Other semiconductor devices
Number of pages 45
Keyword IEC62047-25,IEC 62047-25:2016,IEC 62047-25,TC 47/SC 47F