Name | Support | Language | Availability | Edition date | Price | ||
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PDF |
English, French |
Active |
8/29/2016 |
€173.00 |
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Details
IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.
Additional Info
Author | International Electrotechnical Commission (IEC) |
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Committee | TC 47/SC 47F |
Published by | IEC |
Document type | Standard |
Edition | 1.0 |
ICS | 31.080.99 : Other semiconductor devices
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Number of pages | 45 |
Keyword | IEC62047-25,IEC 62047-25:2016,IEC 62047-25,TC 47/SC 47F |