IEC 61189-2-807:2021

IEC 61189-2-807:2021

IEC 61189-2-807:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

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Details

IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).

Additional Info

Author International Electrotechnical Commission (IEC)
Committee TC 91
Published by IEC
Document type Standard
Edition 1.0
ICS 31.180 : Printed circuits and boards
Number of pages 17
Keyword IEC61189-2-807,IEC 61189-2-807:2021,IEC 61189-2-807,TC 91