Name | Support | Language | Availability | Edition date | Price | ||
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PDF |
English, French |
Active |
2/4/2021 |
€173.00 |
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Details
IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191-2:2017.
Additional Info
Author | International Electrotechnical Commission (IEC) |
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Committee | TC 91 |
Published by | IEC |
Document type | Standard |
Edition | 1.0 |
ICS | 31.180 : Printed circuits and boards
31.190 : Electronic component assemblies |
Number of pages | 49 |
Keyword | IEC61188-6-2,IEC 61188-6-2:2021,IEC 61188-6-2,TC 91 |