IEC 61188-6-2:2021

IEC 61188-6-2:2021

IEC 61188-6-2:2021 Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

€173.00

Details

IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191-2:2017.

Additional Info

Author International Electrotechnical Commission (IEC)
Committee TC 91
Published by IEC
Document type Standard
Edition 1.0
ICS 31.180 : Printed circuits and boards
31.190 : Electronic component assemblies
Number of pages 49
Keyword IEC61188-6-2,IEC 61188-6-2:2021,IEC 61188-6-2,TC 91