IEC 60749-30:2020 + Redline

IEC 60749-30:2020 + Redline

IEC 60749-30:2020 (Redline version) Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

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Details

IEC 60749-30:2020 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.
The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation.
These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition:
- inclusion of new Clause 3,
- expansion of 6.7 on solder reflow,
- inclusion of explanatory notes and clarifications.

Additional Info

Author International Electrotechnical Commission (IEC)
Committee TC 47
Published by IEC
Document type Standard
Edition 2.0
ICS 31.080.01 : Semiconductor devices in general
Number of pages 41
Keyword IEC60749-30,IEC 60749-30:2020 RLV,IEC 60749-30,TC 47