Name | Support | Language | Availability | Edition date | Price | ||
---|---|---|---|---|---|---|---|
PDF |
English, French |
Active |
8/17/2020 |
€92.00 |
|
||
PDF |
English |
Active |
8/17/2020 |
€120.00 |
|
Details
IEC 60749-30:2020 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.
The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation.
These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition:
- inclusion of new Clause 3,
- expansion of 6.7 on solder reflow,
- inclusion of explanatory notes and clarifications.
Additional Info
Author | International Electrotechnical Commission (IEC) |
---|---|
Committee | TC 47 |
Published by | IEC |
Document type | Standard |
Edition | 2.0 |
ICS | 31.080.01 : Semiconductor devices in general
|
Number of pages | 41 |
Keyword | IEC60749-30,IEC 60749-30:2020 RLV,IEC 60749-30,TC 47 |