31.200 : Integrated circuits. Microelectronics
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DIN EN 60747-16-3:2018-04
Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (IEC 60747-16-3:2002 + A1:2009 + A2:2017), German version EN 60747-16-3:2002 + A1:2009 + A2:2017.
4/1/2018 - PDF - German - DIN
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DIN EN 62090:2017-12
Product package labels for electronic components using bar code and two- dimensional symbologies (IEC 62090:2017), German version EN 62090:2017.
12/1/2017 - PDF - German - DIN
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DIN 51456:2013-10
Testing of materials for semiconductor technology - Surface analysis of silicon wafers by multielement determination in aqueous analysis solutions using mass spectrometry with inductively coupled plasma (ICP-MS)
10/1/2013 - PDF - German - DIN
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DIN EN 61967-6 Berichtigung 1:2011-02
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method (IEC 61967-6:2002 + A1:2008), German version EN 61967-6:2002 + A1:2008, Corrigendum to DIN EN 61967-6:2008-10, (IEC-Cor. :2010 to IEC 61967-6:2002)
2/1/2011 - PDF - German - DIN
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DIN EN 62417:2010-12
Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) (IEC 62417:2010), German version EN 62417:2010
12/1/2010 - PDF - German - DIN
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DIN EN 61967-6:2008-10
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method (IEC 61967-6:2002 + A1:2008), German version EN 61967-6:2002 + A1:2008.
10/1/2008 - PDF - German - DIN
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DIN EN 62132-3:2008-04
Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 3: Bulk current injection (BCI) method (IEC 62132-3:2007); German version EN 62132-3:2007
4/1/2008 - PDF - German - DIN
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DIN EN 62258-5:2007-02
Semiconductor die products - Part 5: Requirements for information concerning electrical simulation (IEC 62258-5:2006); German version EN 62258-5:2006
2/1/2007 - PDF - German - DIN
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DIN EN 62258-6:2007-02
Semiconductor die products - Part 6: Requirements for information concerning thermal simulation (IEC 62258-6:2006); German version EN 62258-6:2006
2/1/2007 - PDF - German - DIN
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DIN EN 62132-4:2006-10
Integrated circuits - Measurement of electromagnetic immunity 150 kHz to 1 GHz - Part 4: Direct RF power injection method (IEC 62132-4:2006); German version EN 62132-4:2006
10/1/2006 - PDF - German - DIN
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DIN EN 62132-5:2006-05
Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 5: Workbench Faraday cage method (IEC 62132-5:2005); German version EN 62132-5:2006
5/1/2006 - PDF - German - DIN
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DIN EN 61967-2:2006-03
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method (IEC 61967-2:2005); German version EN 61967-2:2005
3/1/2006 - PDF - German - DIN
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DIN EN 60747-16-10:2005-03
Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits (IEC 60747-16-10:2004); German version EN 60747-16-10:2004
3/1/2005 - PDF - German - DIN
Learn More€136.82 -
DIN EN 61967-5:2003-10
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 5: Measurement of conducted emissions; Workbench Faraday Cage method (IEC 61967-5:2003); German version EN 61967-5:2003
10/1/2003 - PDF - German - DIN
Learn More€92.62 -
DIN EN 61523-2:2003-06
Delay and power calculation standards - Part 2: Pre-layout delay calculation specification for CMOS ASIC libraries (IEC 61523-2:2002); German version EN 61523-2:2002, text in English
6/1/2003 - PDF - English, German - DIN
Learn More€110.00 -
DIN EN 62014-1:2002-11
Electronic design automation libraries - Part 1: Input/output buffer information specifications (IBIS version 3.2) (IEC 62014-1:2001), German version EN 62014-1:2002
11/1/2002 - PDF - English - DIN
Learn More€163.74 -
DIN EN 61523-1:2002-10
Delay and power calculation standards - Part 1: Integrated circuit delay and power calculation systems (IEC 61523-1:2001), German version EN 61523-1:2002, text in English
10/1/2002 - PDF - English - DIN
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DIN EN 61943:2001-10
Integrated circuits - Manufacturing line approval application guideline (IEC 61943:1999), German version EN 61943:1999
10/1/2001 - PDF - German - DIN
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DIN EN 61964:2000-01
Integrated circuits - Memory devices pin configurations (IEC 61964:1999), German version EN 61964:1999
1/1/2000 - PDF - German - DIN
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DIN EN 165000-5:1998-09
Film and hybrid integrated circuits - Part 5: Procedure for qualification approval, German version EN 165000-5:1997
9/1/1998 - PDF - German - DIN
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€0.00
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DIN EN 165000-1:1996-11
Film and hybrid integrated circuits - Part 1: Generic specification - Capability approval procedure; German version EN 165000-1:1996
11/1/1996 - PDF - German - DIN
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DIN EN 190101:1996-11
Family specification - Digital integrated TTL circuits - Series 54, 64, 74, 84; German version EN 190101:1994
11/1/1996 - PDF - German - DIN
Learn More€52.90 -
DIN EN 190102:1996-11
Family specification - TTL Schottky digital integrated circuits - Series 54 S, 64 S, 74 S, 84 S; German version EN 190102:1994
11/1/1996 - PDF - German - DIN
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DIN EN 190103:1996-11
Family specification - Digital integrated TTL low power Schottky circuits - Series 54 LS, 64 LS, 74 LS, 84 LS; German version EN 190103:1994
11/1/1996 - PDF - German - DIN
Learn More€65.89 -
DIN EN 190106:1996-11
Family specification - TTL Advanced Low Power Schottky digital integrated circuits - Series 54 ALS, 74 ALS; German version EN 190106:1994
11/1/1996 - PDF - German - DIN
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DIN EN 190107:1996-11
Family specification - TTL FAST digital integrated circuits - Series 54 F, 74 F; German version EN 190107:1994
11/1/1996 - PDF - German - DIN
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DIN EN 190108:1996-11
Family specification - TTL advanced Schottky digital integrated circuits - Series 54 AS, 74 AS; German version EN 190108:1994
11/1/1996 - PDF - German - DIN
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DIN EN 190109:1996-11
Family specification - Digital integrated HC MOS circuits - Series HC/HCT/HCU; German version EN 190109:1994
11/1/1996 - PDF - German - DIN
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DIN EN 190110:1996-11
Blank detail specification - Digital microprocessor integrated circuits; German version EN 190110:1994
11/1/1996 - PDF - German - DIN
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DIN EN 165000-2:1996-11
Film and hybrid integrated circuits - Part 2: Internal visual inspection and special tests, German version EN 165000-2:1996
11/1/1996 - PDF - German - DIN
Learn More€85.79 -
DIN EN 165000-3:1996-11
Film and hybrid integrated circuits - Part 3: Self-audit checklist and report for film and hybrid integrated circuit manufacturers, German version EN 165000-3:1996
11/1/1996 - PDF - German - DIN
Learn More€169.25 -
DIN EN 165000-4:1996-11
Film and hybrid integrated circuits - Part 4: Customer information, product assessment level schedules and blank detail specification, German version EN 165000-4:1996
11/1/1996 - PDF - German - DIN
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DIN EN 190000:1996-05
Generic specification: Monolithic integrated circuits, German version EN 190000:1995
5/1/1996 - PDF - English - DIN
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DIN EN 190116:1995-06
Family specification: AC MOS digital integrated circuits; German version EN 190116:1993
6/1/1995 - PDF - German - DIN
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DIN EN 190100:1995-02
Sectional specification: Digital monolithic integrated circuits; German version EN 190100:1993
2/1/1995 - PDF - German - DIN
Learn More€115.33 -
DIN EN 60821:1994-09
IEC-821-VMEbus - Microprocessor system bus for 1 byte to 4 byte data (IEC 60821:1991, modified); German version EN 60821:1994
9/1/1994 - PDF - German - DIN
Learn More€297.38