31.190 : Electronic component assemblies
-
PD IEC TR 60068-3-15:2024
Environmental testing Supporting documentation and guidance. Vacuum-assisted reflow soldering
4/8/2024 - PDF - English - BSI
Learn More€250.00 -
€301.42 -
IPC J-STD-001J:2024
Requirements for Soldered Electrical and Electronic Assemblies
3/1/2024 - PDF sécurisé - English - IPC
Learn More€231.00 -
PD IEC TR 61760-5-1:2024
Surface mounting technology strain on circuit board. Strain gauge measurement applied to chip components
2/7/2024 - PDF - English - BSI
Learn More€250.00 -
PD IEC TS 62878-2-10:2024
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
2/7/2024 - PDF - English - BSI
Learn More€151.00 -
IEC TR 60068-3-15:2024
IEC TR 60068-3-15:2024 Environmental testing - Part 3-15: Supporting documentation and guidance - Vacuum-assisted reflow soldering
2/6/2024 - PDF - English - IEC
Learn More€219.00 -
IEC TR 61760-5-1:2024
IEC TR 61760-5-1:2024 Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components
1/31/2024 - PDF - English - IEC
Learn More€173.00 -
IEC TS 62878-2-10:2024
IEC TS 62878-2-10:2024 Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
1/31/2024 - PDF - English - IEC
Learn More€46.00 -
IPC 7711/7721D:2023
Rework, Modification and Repair of Electronic Assemblies
1/1/2024 - Papier - English - IPC
Learn More€585.00 -
IPC 7711/7721D:2023
Rework, Modification and Repair of Electronic Assemblies
1/1/2024 - PDF sécurisé - English - IPC
Learn More€404.00 -
BS EN IEC 63215-2:2023
Endurance test methods for die attach materials Temperature cycling method applied to discrete type power electronic devices
12/5/2023 - PDF - English - BSI
Learn More€250.00 -
NF EN IEC 63215-2, C93-745-2 (12/2023)
Méthodes d'essai d'endurance pour les matériaux de fixation de puce - Partie 2 : méthode d'essai de cycle thermique pour les matériaux de fixation de puce, appliquée aux dispositifs électroniques de puissance de type discret
12/1/2023 - Paper - French - AFNOR
Learn More€93.50 -
DIN EN IEC 61189-2-501:2023-12
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (IEC 61189-2-501:2022), German version EN IEC 61189-2-501:2022
12/1/2023 - PDF - German - DIN
Learn More€92.62 -
IEC 63215-2:2023
IEC 63215-2:2023 Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices
10/24/2023 - PDF - English, French - IEC
Learn More€173.00 -
PD IEC TR 61191-9:2023
Printed board assemblies Electrochemical reliability and ionic contamination on printed circuit for use in automotive applications. Best practices
6/19/2023 - PDF - English - BSI
Learn More€377.00 -
IEC TR 61191-9:2023
IEC TR 61191-9:2023 Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices
6/7/2023 - PDF - English - IEC
Learn More€397.00 -
DIN EN IEC 61188-6-2:2023-03
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (IEC 61188-6-2:2021), German version EN IEC 61188-6-2:2021
3/1/2023 - PDF - German - DIN
Learn More€110.00 -
DIN EN IEC 61189-2-807:2023-01
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA (IEC 61189-2-807:2021), German version EN IEC 61189-2-807:2021
1/1/2023 - PDF - German - DIN
Learn More€72.80 -
PD IEC TR 60068-3-12:2022 + Redline
Tracked Changes. Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
12/20/2022 - PDF - English - BSI
Learn More€382.00 -
PD IEC TR 60068-3-12:2022
Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
11/30/2022 - PDF - English - BSI
Learn More€293.00 -
NF EN 16602-70-61, L90-200-70-61 (11/2022)
Assurance produit des projets spatiaux - Soudure haute fiabilité pour les connexions électriques à montage en surface, à technologie combinée et montées à la main
11/1/2022 - Paper - French - AFNOR
Learn More€223.50 -
PD IEC TR 61760-3-1:2022
Surface mounting technology Standard method for the specification of components through hole reflow (THR) soldering. Guidelines diameter design with solder paste surface printing
10/31/2022 - PDF - English - BSI
Learn More€250.00 -
IEC TR 60068-3-12:2022
IEC TR 60068-3-12:2022 Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
10/14/2022 - PDF - English - IEC
Learn More€270.00 -
PD IEC PAS 61191-10:2022
Printed board assemblies Application and utilization of protective coatings for electronic
9/13/2022 - PDF - English - BSI
Learn More€449.00 -
PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic industries
8/23/2022 - PDF - English - BSI
Learn More€180.00 -
DIN EN IEC 62878-2-602:2022-08
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 62878-2-602:2021), German version EN IEC 62878-2-602:2021
8/1/2022 - PDF - German - DIN
Learn More€79.72 -
DIN EN IEC 61188-6-1:2022-08
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (IEC 61188-6-1:2021), German version EN IEC 61188-6-1:2021.
8/1/2022 - PDF - German - DIN
Learn More€115.33 -
IEC PAS 61191-10:2022
IEC PAS 61191-10:2022 Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies
7/18/2022 - PDF - English - IEC
Learn More€489.00 -
IEC TR 61760-3-1:2022
IEC TR 61760-3-1:2022 Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
6/17/2022 - PDF - English - IEC
Learn More€219.00 -
IEC TR 62878-2-9:2022
IEC TR 62878-2-9:2022 Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
4/27/2022 - PDF - English - IEC
Learn More€92.00 -
BS EN IEC 62435-9:2021
Electronic components. Long-term storage of electronic semiconductor devices Special cases
10/11/2021 - PDF - English - BSI
Learn More€180.00 -
DIN EN IEC 62878-1:2021-10
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (IEC 62878-1:2019), German version EN IEC 62878-1:2019
10/1/2021 - PDF - German - DIN
Learn More€99.35 -
UNE-EN IEC 62878-2-602:2021
Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (Endorsed by Asociación Española de Normalización in October of 2021.)
10/1/2021 - PDF - English - AENOR
Learn More€63.00 -
UNE-EN IEC 60068-2-21:2021
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices (Endorsed by Asociación Española de Normalización in October of 2021.)
10/1/2021 - PDF - English - AENOR
Learn More€87.00 -
BS EN IEC 60068-2-21:2021
Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
9/13/2021 - PDF - English - BSI
Learn More€331.00 -
NF EN IEC 60068-2-21, C20-700-2-21 (09/2021)
Essais d'environnement - Partie 2-21 : essais - Essai U : robustesse des sorties et des dispositifs de montage incorporés
9/1/2021 - Paper - French - AFNOR
Learn More€141.33 -
€570.00 -
BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
8/20/2021 - PDF - English - BSI
Learn More€180.00 -
€301.00
-
NF EN IEC 62878-2-602, C93-778-2-602 (08/2021)
Techniques d'assemblage avec appareil(s) intégré(s) - Partie 2-602 : lignes directrices pour un empilement de modules électroniques - Méthode d'évaluation de la connectivité électrique entre modules
8/1/2021 - Paper - French - AFNOR
Learn More€88.33 -
PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
7/29/2021 - PDF - English - BSI
Learn More€180.00 -
IEC 60068-2-21:2021
IEC 60068-2-21:2021 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
7/8/2021 - PDF - English, French - IEC
Learn More€311.00 -
IEC TR 62878-2-8:2021
IEC TR 62878-2-8:2021 Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
7/7/2021 - PDF - English - IEC
Learn More€92.00 -
IEC 62878-2-602:2021
IEC 62878-2-602:2021 Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
6/22/2021 - PDF - English, French - IEC
Learn More€92.00 -
UNE-EN IEC 61188-6-1:2021
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (Endorsed by Asociación Española de Normalización in May of 2021.)
5/1/2021 - PDF - English - AENOR
Learn More€75.00 -
BS EN IEC 61188-6-1:2021
Circuit boards and circuit board assemblies. Design use Land pattern design. Generic requirements for land on
4/7/2021 - PDF - English - BSI
Learn More€293.00 -
NF EN IEC 61188-6-1, C93-711-6-1 (04/2021)
Circuit boards and circuit board assemblies - Design and use - Part 6-1 : land pattern design - Generic requirements for land pattern on circuit boards - Cartes à circuit imprimé et cartes à circuit imprimé équipées - Conception et utilisation - Partie 6-1 : Conception de la zone de report - Exigences génériques pour la zone de report sur les cartes à circuit imprimé
4/1/2021 - Paper - French - AFNOR
Learn More€116.33 -
DIN EN IEC 62878-2-5:2021-04
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate (IEC 62878-2-5:2019), German version EN IEC 62878-2-5:2019
4/1/2021 - PDF - German - DIN
Learn More€148.04 -
UNE-EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (Endorsed by Asociación Española de Normalización in April of 2021.)
4/1/2021 - PDF - English - AENOR
Learn More€72.00 -
UNE-EN IEC 61760-3:2021
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (Endorsed by Asociación Española de Normalización in April of 2021.)
4/1/2021 - PDF - English - AENOR
Learn More€75.00 -
PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed for use automotive electronic control units. Best practices
3/25/2021 - PDF - English - BSI
Learn More€293.00 -
BS EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies. Design use Land pattern design. Description of land for the most common surface mounted components (SMD)
3/19/2021 - PDF - English - BSI
Learn More€250.00 -
IEC TR 61191-8:2021
IEC TR 61191-8:2021 Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
3/19/2021 - PDF - English - IEC
Learn More€270.00 -
BS EN IEC 61760-3:2021
Surface mounting technology Standard method for the specification of components through-hole reflow (THR) soldering
3/18/2021 - PDF - English - BSI
Learn More€293.00 -
NF EN IEC 61760-3, C90-710-3 (03/2021)
Surface mounting technology - Part 3 : Standard method for the specification of components for through hole reflow (THR) soldering
3/1/2021 - Paper - French - AFNOR
Learn More€116.33 -
NF EN IEC 61188-6-2, C93-711-6-2 (03/2021)
Printed boards and printed board assemblies - Design and use - Part 6-2 : land pattern design - Description of land pattern for the most common surface mounted components (SMD) - Cartes à circuit imprimé et cartes à circuit imprimé équipées - Conception et utilisation - Partie 6-2 : conception de la zone de report - Description de la zone de report pour les composants montés en surface (CMS) les plus courants
3/1/2021 - Paper - French - AFNOR
Learn More€88.33 -
IEC 61188-6-1:2021
IEC 61188-6-1:2021 Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
2/23/2021 - PDF - English, French - IEC
Learn More€270.00 -
IEC 60194-1:2021
IEC 60194-1:2021 Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies
2/9/2021 - PDF - English, French - IEC
Learn More€489.00 -
IEC 61188-6-2:2021
IEC 61188-6-2:2021 Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
2/4/2021 - PDF - English, French - IEC
Learn More€173.00 -
IEC 61760-3:2021
IEC 61760-3:2021 Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
2/3/2021 - PDF - English, French - IEC
Learn More€219.00 -
PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design use 3D shape data for CAD component library
1/22/2021 - PDF - English - BSI
Learn More€180.00 -
IEC TR 61188-8:2021
IEC TR 61188-8:2021 Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library
1/14/2021 - PDF - English - IEC
Learn More€132.00 -
IEEE 370:2020
IEEE Standard for Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz
1/8/2021 - PDF - English - IEEE
Learn More€152.00 -
IEEE 370:2020
IEEE Standard for Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz
1/8/2021 - Paper - English - IEEE
Learn More€189.00 -
NF EN IEC 61760-1, C90-710-1 (09/2020)
Surface mounting technology - Part 1 : standard method for the specification of surface mounting components (SMDs)
9/1/2020 - Paper - French - AFNOR
Learn More€170.00 -
IPC J-STD-001H:2020
Requirements for Soldered Electrical and Electronic Assemblies
9/1/2020 - Papier - English - IPC
Learn More€318.00 -
€387.00 -
€101.00 -
BS EN 61760-4:2015+A1:2018
Surface mounting technology Classification, packaging, labelling and handling of moisture sensitive devices
6/16/2020 - PDF - English - BSI
Learn More€293.00 -
DIN EN IEC 61188-6-4:2020-04
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (IEC 61188-6-4:2019), German version EN IEC 61188-6-4:2019
4/1/2020 - PDF - German - DIN
Learn More€131.96 -
PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed
3/23/2020 - PDF - English - BSI
Learn More€398.00 -
IEC TR 61191-7:2020
IEC TR 61191-7:2020 Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
3/11/2020 - PDF - English - IEC
Learn More€431.00 -
BS EN IEC 61190-1-3:2018 + Redline
Tracked Changes. Attachment materials for electronic assembly Requirements grade solder alloys and fluxed non-fluxed solid soldering applications
2/27/2020 - PDF - English - BSI
Learn More€432.00 -
BS EN IEC 61191-1:2018 + Redline
Tracked Changes. Printed board assemblies Generic specification. Requirements for soldered electrical and electronic using surface mount related assembly technologies
2/27/2020 - PDF - English - BSI
Learn More€432.00 -
BS EN IEC 60068-2-82:2019 + Redline
Tracked Changes. Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
2/24/2020 - PDF - English - BSI
Learn More€382.00 -
NF EN 61191-2, C90-704 (02/2020)
Printed board assemblies - Part 2 : sectional specification - Requirements for surface mount soldered assemblies
2/1/2020 - Paper - French - AFNOR
Learn More€127.67 -
UNE-EN IEC 62878-1:2019
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (Endorsed by Asociación Española de Normalización in January of 2020.)
1/1/2020 - PDF - English - AENOR
Learn More€70.00 -
BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
12/17/2019 - PDF - English - BSI
Learn More€250.00 -
NF EN IEC 62878-1, C93-778-1 (12/2019)
Device embedding assembly technology - Part 1 : generic specification for device embedded substrates - Techniques d'assemblage avec appareil(s) intégré(s) - Partie 1 : Spécification générique pour substrats avec appareil(s) intégré(s)
12/1/2019 - Paper - French - AFNOR
Learn More€103.33 -
UNE-EN IEC 62878-2-5:2019
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate (Endorsed by Asociación Española de Normalización in December of 2019.)
12/1/2019 - PDF - English - AENOR
Learn More€98.00 -
BS EN IEC 62878-2-5:2019
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
11/18/2019 - PDF - English - BSI
Learn More€348.00 -
NF EN IEC 62878-2-5, C93-778-2-5 (11/2019)
Device embedding assembly technology - Part 2-5 : guidelines - Implementation of a 3D data format for device embedded substrate - Substrat avec appareil(s) intégré(s) - Partie 2-5 : Mise en oeuvre d'un format de données 3D pour un substrat avec appareil(s) intégré(s)
11/1/2019 - Paper - French - AFNOR
Learn More€153.50 -
IEC 62878-1:2019
IEC 62878-1:2019 Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
10/14/2019 - PDF - English - IEC
Learn More€132.00 -
IEC 62878-1:2019
IEC 62878-1:2019 Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
10/14/2019 - PDF - English, French - IEC
Learn More€132.00 -
BS EN 61191-2:2017
Printed board assemblies Sectional specification. Requirements for surface mount soldered
10/7/2019 - PDF - English - BSI
Learn More€293.00 -
IEC 62878-2-5:2019
IEC 62878-2-5:2019 Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
9/16/2019 - PDF - English - IEC
Learn More€345.00 -
IEC 62878-2-5:2019
IEC 62878-2-5:2019 Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
9/16/2019 - PDF - English, French - IEC
Learn More€345.00 -
BS EN 60068-2-69:2017+A1:2019
Environmental testing Tests. Test Te/Tc. Solderability of electronic components and printed boards by the wetting balance (force measurement) method
9/11/2019 - PDF - English - BSI
Learn More€348.00 -
UNE-EN IEC 60068-2-82:2019
Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for components and parts used in electronic assemblies (Endorsed by Asociación Española de Normalización in August of 2019.)
8/1/2019 - PDF - English - AENOR
Learn More€76.00 -
BS EN IEC 61188-6-4:2019
Printed boards and printed board assemblies. Design use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint land design
7/12/2019 - PDF - English - BSI
Learn More€331.00 -
BS EN IEC 60068-2-82:2019
Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
7/12/2019 - PDF - English - BSI
Learn More€293.00 -
NF EN IEC 61188-6-4, C93-711-6-4 (07/2019)
Printed boards and printed board assemblies - Design and use - Part 6-4 : land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design - Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 6-4 : Exigences génériques pour les dessins dimensionnels de CMS du point de vue de la conception de la zone de report
7/1/2019 - Paper - French - AFNOR
Learn More€141.33 -
IEC 60068-2-69:2017+AMD1:2019 Edition 3.1
IEC 60068-2-69:2017+AMD1:2019 (Consolidated version) Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
6/19/2019 - PDF - English, French - IEC
Learn More€506.00 -
PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
4/1/2019 - PDF - English - BSI
Learn More€180.00 -
IEC TR 62878-2-7:2019
IEC TR 62878-2-7:2019 Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
3/20/2019 - PDF - English - IEC
Learn More€92.00 -
DIN EN IEC 61189-2-630:2019-03
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning (IEC 61189-2-630:2018), German version EN IEC 61189-2-630:2018
3/1/2019 - PDF - German - DIN
Learn More€59.63 -
UNE-EN IEC 61191-1:2018
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (Endorsed by Asociación Española de Normalización in December of 2018.)
12/1/2018 - PDF - English - AENOR
Learn More€84.00 -
BS EN IEC 61191-1:2018
Printed board assemblies Generic specification. Requirements for soldered electrical and electronic using surface mount related assembly technologies
11/13/2018 - PDF - English - BSI
Learn More€331.00 -
NF EN IEC 61191-1, C90-703 (11/2018)
Printed board assemblies - Part 1 : generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
11/1/2018 - Paper - French - AFNOR
Learn More€136.68 -
IEC 61191-1:2018
IEC 61191-1:2018 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
9/14/2018 - PDF - English, French - IEC
Learn More€311.00 -
IEC 61191-1:2018 + Redline
IEC 61191-1:2018 (Redline version) Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
9/14/2018 - PDF - English - IEC
Learn More€404.00 -
DIN EN IEC 61190-1-3:2018-09
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017), German version EN IEC 61190-1-3:2018.
9/1/2018 - PDF - German - DIN
Learn More€131.96 -
BS EN 60068-2-58:2015+A1:2018
Environmental testing Tests. Test Td: methods for solderability, resistance to dissolution of metallization and soldering heat surface mounting devices (SMD)
5/21/2018 - PDF - English - BSI
Learn More€331.00 -
SAE ARP 5890B:2018-05-07
Guidelines for Preparing Reliability Assessment Plans for Electronic Engine Controls
5/7/2018 - PDF - English - SAE
Learn More€142.00 -
DIN EN 61191-2:2018-05
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017), German version EN 61191-2:2017.
5/1/2018 - PDF - German - DIN
Learn More€115.33 -
UNE-EN IEC 61190-1-3:2018
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (Endorsed by Asociación Española de Normalización in April of 2018.)
4/1/2018 - PDF - English - AENOR
Learn More€81.00 -
BS EN IEC 61190-1-3:2018
Attachment materials for electronic assembly Requirements grade solder alloys and fluxed non-fluxed solid soldering applications
3/28/2018 - PDF - English - BSI
Learn More€331.00 -
IEC 61760-4:2015+AMD1:2018 Edition 1.1
IEC 61760-4:2015+AMD1:2018 (Consolidated version) Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
3/13/2018 - PDF - English, French - IEC
Learn More€385.00 -
NF EN IEC 61190-1-3, C90-700-1-3 (03/2018)
Attachment materials for electronic assembly - Part 1-3 : requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
3/1/2018 - Paper - French - AFNOR
Learn More€127.67 -
DIN EN 60068-2-69 VDE 0468-2-69:2018-01
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017), German version EN 60068-2-69:2017
1/1/2018 - Paper - German - VDE
Learn More€121.28 -
IEC 61190-1-3:2017
IEC 61190-1-3:2017 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
12/13/2017 - PDF - English, French - IEC
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IEC 60194-2:2017
IEC 60194-2:2017 Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
12/13/2017 - PDF - English - IEC
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DIN EN 61188-7:2017-12
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2017), German version EN 61188-7:2017.
12/1/2017 - PDF - German - DIN
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DIN EN 62090:2017-12
Product package labels for electronic components using bar code and two- dimensional symbologies (IEC 62090:2017), German version EN 62090:2017.
12/1/2017 - PDF - German - DIN
Learn More€115.33 -
UNE-EN 61191-2:2017
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in November of 2017.)
11/1/2017 - PDF - English - AENOR
Learn More€76.00 -
NF EN 60068-2-69, C20-700-2-69 (08/2017)
Environmental testing - Part 2-69 : tests - Test Te/Tc : solderability testing of electronic components and printed boards by the wetting balance (force measurement) method - Essais d'environnement : Partie 2-69 : Essais - Essai Te : Essai de brasabilité des composants et cartes électroniques par la méthode de la balance de mouillage (mesure de la force)
8/1/2017 - Paper - French - AFNOR
Learn More€153.67 -
UNE-EN 62090:2017
Product package labels for electronic components using bar code and two- dimensional symbologies (Endorsed by Asociación Española de Normalización in August of 2017.)
8/1/2017 - PDF - English - AENOR
Learn More€72.00 -
BS EN 62090:2017
Product package labels for electronic components using bar code and two- dimensional symbologies
7/31/2017 - PDF - English - BSI
Learn More€293.00 -
IEC 60068-2-58:2015+AMD1:2017 Edition 4.1
IEC 60068-2-58:2015+AMD1:2017 (Consolidated version) Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
7/28/2017 - PDF - English - IEC
Learn More€385.00 -
IEC 60068-2-58:2015+AMD1:2017 Edition 4.1
IEC 60068-2-58:2015+AMD1:2017 (Consolidated version) Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
7/28/2017 - PDF - English, French - IEC
Learn More€385.00 -
NF EN 62090, C90-530 (07/2017)
Product package labels for electronic components using bar code and two-dimensional symbologies
7/1/2017 - Paper - French - AFNOR
Learn More€116.33 -
UNE-EN 60068-2-69:2017
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (Endorsed by Asociación Española de Normalización in July of 2017.)
7/1/2017 - PDF - English - AENOR
Learn More€90.00 -
NF EN 61188-7, C93-711-7 (06/2017)
Printed boards and printed board assemblies - Design and use - Part 7 : electronic component zero orientation for CAD library construction
6/1/2017 - Paper - French - AFNOR
Learn More€103.33 -
IEC 61191-2:2017
IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
5/23/2017 - PDF - English, French - IEC
Learn More€270.00 -
IEC 61191-2:2017
IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
5/23/2017 - PDF - English - IEC
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UNE-EN 62739-3:2017
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods (Endorsed by Asociación Española de Normalización in May of 2017.)
5/1/2017 - PDF - English - AENOR
Learn More€72.00 -
BS EN 62739-3:2017
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance test methods
4/30/2017 - PDF - English - BSI
Learn More€293.00 -
IEC 62090:2017
IEC 62090:2017 Product package labels for electronic components using bar code and two-dimensional symbologies
4/11/2017 - PDF - English, French - IEC
Learn More€270.00 -
IEC 62090:2017
IEC 62090:2017 Product package labels for electronic components using bar code and two-dimensional symbologies
4/11/2017 - PDF - English - IEC
Learn More€270.00 -
DIN EN 61189-2-719:2017-04
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (IEC 61189-2-719:2016), German version EN 61189-2-719:2016
4/1/2017 - PDF - German - DIN
Learn More€92.62 -
IEC 60068-2-69:2017
IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
3/7/2017 - PDF - English, French - IEC
Learn More€345.00 -
NF EN 62739-3, C93-742-3 (03/2017)
Méthode d'essai de l'érosion de l'équipement de brasage à la vague utilisant un alliage à braser sans plomb fondu - Partie 3 : document d'orientation pour le choix des méthodes d'essai d'érosion
3/1/2017 - Paper - French - AFNOR
Learn More€116.33 -
IEC 62739-3:2017
IEC 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
1/6/2017 - PDF - English - IEC
Learn More€270.00 -
IEC 62739-3:2017
IEC 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
1/6/2017 - PDF - English, French - IEC
Learn More€270.00 -
JIS C 60068-2-58:2016
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
12/20/2016 - PDF - Japanese - JSA
Learn More€46.02 -
UNE-EN 62739-2:2016
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing (Endorsed by AENOR in November of 2016.)
11/1/2016 - PDF - English - AENOR
Learn More€63.00 -
BS EN 62739-2:2016
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test metal materials with surface processing
10/31/2016 - PDF - English - BSI
Learn More€180.00 -
NF EN 61188-5-3, C93-711-5-3 (08/2016)
Printed boards and printed board assemblies - Design and use - Part 5-3 : attachment (land/joint) considerations - Components with gull-wing leads on two sides
8/1/2016 - Paper - French - AFNOR
Learn More€116.33 -
IEC 62739-2:2016
IEC 62739-2:2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
7/13/2016 - PDF - English, French - IEC
Learn More€92.00 -
NF EN 61188-5-5, C93-711-5-5 (07/2016)
Printed boards and printed board assemblies - Design and use - Part 5-5 : Attachment (land/joint) considerations - Components with gull-wing leads on four sides - Cartes imprimées et cartes imprimées équipées
7/1/2016 - Paper - French - AFNOR
Learn More€141.33 -
NF EN 61188-5-4, C93-711-5-4 (07/2016)
Printed boards and printed board assemblies - Design and use - Part 5-4 : attachment (land/joint) consideration - Components with J leads on two sides - Cartes imprimées et cartes imprimées équipées
7/1/2016 - Paper - French - AFNOR
Learn More€88.33 -
JIS C 62137-4:2016
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
3/22/2016 - PDF - Japanese - JSA
Learn More€46.02 -
DIN EN 61189-2-721:2016-03
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator (IEC 61189-2-721:2015), German version EN 61189-2-721:2015
3/1/2016 - PDF - German - DIN
Learn More€104.95 -
PD IEC/TR 62878-2-2:2015
Device embedded substrate Guidelines. Electrical testing
12/31/2015 - PDF - English - BSI
Learn More€180.00 -
IEC TR 62878-2-2:2015
IEC TR 62878-2-2:2015 Device embedded substrate - Part 2-2: Guidelines - Electrical testing
12/4/2015 - PDF - English, French - IEC
Learn More€92.00 -
NF EN 62878-1-1, C93-778-1-1 (10/2015)
Device embedded substrate - Part 1-1 : generic specification - Test methods - Substrat intégré à l'appareil
10/1/2015 - Paper - French - AFNOR
Learn More€148.67 -
NF EN 61760-4, C90-710-4 (10/2015)
Surface mounting technology - Part 4 : classification, packaging, labelling and handling of moisture sensitive devices
10/1/2015 - Paper - French - AFNOR
Learn More€123.33 -
UNE-EN 62878-1-1:2015
Device embedded substrate - Part 1-1: Generic specification - Test methods (Endorsed by AENOR in August of 2015.)
8/1/2015 - PDF - English - AENOR
Learn More€94.00 -
UNE-EN 61760-4:2015
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (Endorsed by AENOR in August of 2015.)
8/1/2015 - PDF - English - AENOR
Learn More€74.00 -
BS EN 62878-1-1:2015
Device embedded substrate Generic specification. Test methods
7/31/2015 - PDF - English - BSI
Learn More€348.00 -
DIN EN 62137-4:2015-07
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014), German version EN 62137-4:2014 + AC:2015.
7/1/2015 - PDF - German - DIN
Learn More€131.96 -
NF EN 62137-4, C93-704-4 (07/2015)
Electronics assembly technology - Part 4 : endurance test methods for solder joint of area array type package surface mount devices
7/1/2015 - Paper - French - AFNOR
Learn More€127.67 -
BS EN 62137-4:2014
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
6/30/2015 - PDF - English - BSI
Learn More€331.00 -
UNE-EN 60068-2-58:2015
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (Endorsed by AENOR in June of 2015.)
6/1/2015 - PDF - English - AENOR
Learn More€75.00 -
IEC 62878-1-1:2015
IEC 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
5/20/2015 - PDF - English, French - IEC
Learn More€345.00 -
IEC 61760-4:2015
IEC 61760-4:2015 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
5/19/2015 - PDF - English, French - IEC
Learn More€270.00 -
IPC 9702-WAM1:2015
Monotonic Bend Characterization of Board-Level Interconnects with Amendment 1
5/1/2015 - PDF sécurisé - English - IPC
Learn More€108.00 -
PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology
4/30/2015 - PDF - English - BSI
Learn More€293.00 -
PD IEC/TS 62878-2-4:2015
Device embedded substrate Guidelines. Test element groups (TEG)
4/30/2015 - PDF - English - BSI
Learn More€293.00 -
€250.00 -
IEC TS 62878-2-1:2015
IEC TS 62878-2-1:2015 Device embedded substrate - Part 2-1: Guidelines - General description of technology
3/30/2015 - PDF - English, French - IEC
Learn More€219.00 -
IEC 60068-2-58:2015
IEC 60068-2-58:2015 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
3/27/2015 - PDF - English, French - IEC
Learn More€270.00 -
IEC TS 62878-2-3:2015
IEC TS 62878-2-3:2015 Device embedded substrate - Part 2-3: Guidelines - Design guide
3/27/2015 - PDF - English, French - IEC
Learn More€173.00 -
IEC TS 62878-2-4:2015
IEC TS 62878-2-4:2015 Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
3/27/2015 - PDF - English, French - IEC
Learn More€270.00 -
UNE-EN 62137-4:2014
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (Endorsed by AENOR in February of 2015.)
2/1/2015 - PDF - English - AENOR
Learn More€78.00 -
DIN EN 61190-1-2:2014-11
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014), German version EN 61190-1-2:2014.
11/1/2014 - PDF - German - DIN
Learn More€99.35 -
IEC 62137-4:2014
IEC 62137-4:2014 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
10/9/2014 - PDF - English, French - IEC
Learn More€311.00 -
NF EN 61190-1-2, C90-700-1-2 (10/2014)
Attachment materials for electronic assembly - Part 1-2 : requirements for soldering pastes for high-quality interconnects in electronics assembly
10/1/2014 - Paper - French - AFNOR
Learn More€99.50 -
JIS C 61188-7:2014
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
9/22/2014 - PDF - Japanese - JSA
Learn More€25.00 -
JIS C 62137-3:2014
Electronics Assembly Technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
9/22/2014 - PDF - Japanese - JSA
Learn More€46.02 -
UNE-EN 61190-1-2:2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (Endorsed by AENOR in July of 2014.)
7/1/2014 - PDF - English - AENOR
Learn More€68.00 -
BS EN 61190-1-2:2014
Attachment materials for electronic assembly Requirements soldering pastes high-quality interconnects in electronics
6/30/2014 - PDF - English - BSI
Learn More€250.00 -
€33.33
-
NF EN 62137-1-1, C93-704-1-1 (03/2014)
Surface-mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1 : pull strength test - Technique du montage en surface
3/1/2014 - Paper - French - AFNOR
Learn More€88.33 -
NF EN 62137-1-2, C93-704-1-2 (03/2014)
Surface-mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2 : shear strength test - Technique du montage en surface
3/1/2014 - Paper - French - AFNOR
Learn More€103.33 -
IEC 61190-1-2:2014
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
2/19/2014 - PDF - English, French - IEC
Learn More€173.00 -
UNE-EN 62739-1:2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing (Endorsed by AENOR in October of 2013.)
10/1/2013 - PDF - English - AENOR
Learn More€65.00 -
BS EN 62739-1:2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test metal materials without surface processing
9/30/2013 - PDF - English - BSI
Learn More€180.00 -
NF EN 60068-2-21, C20-700-2-21 (09/2013)
Environmental testing - Part 2-21 : tests - Test U : robustness of terminations and integral mounting devices
9/1/2013 - Paper - English, French - AFNOR
Learn More€105.00 -
BS EN 61193-3:2013
Quality assessment systems Selection and use of sampling plans for printed board laminate end-product in-process auditing
6/30/2013 - PDF - English - BSI
Learn More€348.00 -
IEC 62739-1:2013
IEC 62739-1:2013 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
6/18/2013 - PDF - English, French - IEC
Learn More€132.00 -
UNE-EN 61193-3:2013
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing (Endorsed by AENOR in June of 2013.)
6/1/2013 - PDF - English - AENOR
Learn More€100.00 -
IEC 61193-3:2013
IEC 61193-3:2013 Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
1/24/2013 - PDF - English, French - IEC
Learn More€397.00 -
DIN EN 62137-3:2012-08
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011), German version EN 62137-3:2012
8/1/2012 - PDF - German - DIN
Learn More€136.82 -
NF EN 62137-3, C93-704-3 (07/2012)
Electronics assembly technology - Part 3 : selection guidance of environmental and endurance test methods for solder joints
7/1/2012 - Paper - French - AFNOR
Learn More€141.33 -
UNE-EN 62137-3:2012
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (Endorsed by AENOR in April of 2012.)
4/1/2012 - PDF - English - AENOR
Learn More€78.00 -
BS EN 61869-3:2011
Instrument transformers Additional requirements for inductive voltage
3/31/2012 - PDF - English - BSI
Learn More€293.00 -
BS EN 62137-3:2012
Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
3/31/2012 - PDF - English - BSI
Learn More€331.00 -
€64.10
-
IPC JEDEC-9704A:2012
Printed Circuit Assembly Strain Gage Test Guideline
2/3/2012 - PDF sécurisé - English - IPC
Learn More€195.00 -
NF EN 60068-2-83, C20-783 (01/2012)
Environmental testing - Part 2-83 : tests - Test Tf : solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
1/1/2012 - Paper - French - AFNOR
Learn More€127.67 -
BS EN 60068-2-83:2011
Environmental testing Tests. Test Tf: Solderability of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
11/30/2011 - PDF - English - BSI
Learn More€293.00 -
IEC 62137-3:2011
IEC 62137-3:2011 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
11/8/2011 - PDF - English, French - IEC
Learn More€311.00 -
IEC 60068-2-83:2011
IEC 60068-2-83:2011 Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
9/7/2011 - PDF - English, French - IEC
Learn More€270.00 -
EIA-933-A:2011
Standard for Preparing a COTS Assembly Management Plan
8/1/2011 - PDF sécurisé - English - EIA
Learn More€102.90 -
BS EN 62129-2:2011
Calibration of wavelength/optical frequency measurement instruments Michelson interferometer single wavelength meters
7/31/2011 - PDF - English - BSI
Learn More€348.00 -
BS EN 62417:2010
Semiconductor devices. Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
6/30/2010 - PDF - English - BSI
Learn More€151.00 -
NF EN 62137-1-3, C93-704-1-3 (12/2009)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3 : cyclic drop test - Technique de montage en surface
12/1/2009 - Paper - French - AFNOR
Learn More€103.33 -
NF EN 62137-1-5, C93-704-1-5 (08/2009)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-5 : mechanical shear fatigue test - Technologie du montage en surface
8/1/2009 - Paper - French - AFNOR
Learn More€103.33 -
UNE-EN 62137-1-5:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints -- Part 1-5: Mechanical shear fatigue test (Endorsed by AENOR in August of 2009.)
8/1/2009 - PDF - English - AENOR
Learn More€66.00
