31.190 : Electronic component assemblies
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PD IEC TR 60068-3-15:2024
Environmental testing Supporting documentation and guidance. Vacuum-assisted reflow soldering
4/8/2024 - PDF - English - BSI
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PD IEC TR 61760-5-1:2024
Surface mounting technology strain on circuit board. Strain gauge measurement applied to chip components
2/7/2024 - PDF - English - BSI
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PD IEC TS 62878-2-10:2024
Device embedding assembly technology Part 2-10: Design specification for cavity substrate
2/7/2024 - PDF - English - BSI
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BS EN IEC 63215-2:2023
Endurance test methods for die attach materials Temperature cycling method applied to discrete type power electronic devices
12/5/2023 - PDF - English - BSI
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23/30436874 DC:2023
BS EN IEC 62878-2-603. Device embedding assembly technology Part 2-603. Guideline for stacked electronic module. Test method of intra-module electrical connectivity
10/23/2023 - PDF - English - BSI
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23/30480992 DC:2023
BS EN IEC 60068-2-83. Environmental testing Part 2-83. Tests. Test Tf. Solderability of electronic omponents for surface mounting devices (SMD) by the wetting balance method using solder paste
10/6/2023 - PDF - English - BSI
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PD IEC TR 61191-9:2023
Printed board assemblies Electrochemical reliability and ionic contamination on printed circuit for use in automotive applications. Best practices
6/19/2023 - PDF - English - BSI
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PD IEC TR 60068-3-12:2022 + Redline
Tracked Changes. Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
12/20/2022 - PDF - English - BSI
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22/30453836 DC:2022
BS EN 60194-2. Printed boards design, manufacture and assembly. Vocabulary Part 2. Common usage in electronic technologies as well printed board assembly
12/16/2022 - PDF - English - BSI
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22/30383603 DC:2022
BS IEC 63215-4. Endurance test methods for die attach materials applied to power electronic devices Part 4. Power cycling method (near chip interconnection) module type
12/15/2022 - PDF - English - BSI
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PD IEC TR 60068-3-12:2022
Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
11/30/2022 - PDF - English - BSI
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PD IEC TR 61760-3-1:2022
Surface mounting technology Standard method for the specification of components through hole reflow (THR) soldering. Guidelines diameter design with solder paste surface printing
10/31/2022 - PDF - English - BSI
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PD IEC PAS 61191-10:2022
Printed board assemblies Application and utilization of protective coatings for electronic
9/13/2022 - PDF - English - BSI
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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic industries
8/23/2022 - PDF - English - BSI
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21/30439434 DC:2021
BS EN IEC 63215-5. Endurance test methods for die attach materials Part 5. Temperature cycling (system soldering interconnection) applied to module type power electronic devices
12/3/2021 - PDF - English - BSI
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BS EN IEC 62435-9:2021
Electronic components. Long-term storage of electronic semiconductor devices Special cases
10/11/2021 - PDF - English - BSI
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BS EN IEC 60068-2-21:2021
Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
9/13/2021 - PDF - English - BSI
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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
8/20/2021 - PDF - English - BSI
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PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
7/29/2021 - PDF - English - BSI
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BS EN IEC 61188-6-1:2021
Circuit boards and circuit board assemblies. Design use Land pattern design. Generic requirements for land on
4/7/2021 - PDF - English - BSI
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PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed for use automotive electronic control units. Best practices
3/25/2021 - PDF - English - BSI
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BS EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies. Design use Land pattern design. Description of land for the most common surface mounted components (SMD)
3/19/2021 - PDF - English - BSI
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BS EN IEC 61760-3:2021
Surface mounting technology Standard method for the specification of components through-hole reflow (THR) soldering
3/18/2021 - PDF - English - BSI
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PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design use 3D shape data for CAD component library
1/22/2021 - PDF - English - BSI
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21/30431274 DC:2021
BS EN 61188-6-3. Circuit boards and circuit board assemblies. Design use Part 6-3. Land pattern design. Description of land for through hole components (THT)
1/6/2021 - PDF - English - BSI
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20/30383597 DC:2020
BS EN IEC 63215-2. Endurance test methods for die attach materials applied to power electronics devices Part 2. Temperature cycling method and reliability performance index Die discrete type electronic
7/29/2020 - PDF - English - BSI
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BS EN 61760-4:2015+A1:2018
Surface mounting technology Classification, packaging, labelling and handling of moisture sensitive devices
6/16/2020 - PDF - English - BSI
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PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed
3/23/2020 - PDF - English - BSI
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BS EN IEC 61190-1-3:2018 + Redline
Tracked Changes. Attachment materials for electronic assembly Requirements grade solder alloys and fluxed non-fluxed solid soldering applications
2/27/2020 - PDF - English - BSI
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BS EN IEC 61191-1:2018 + Redline
Tracked Changes. Printed board assemblies Generic specification. Requirements for soldered electrical and electronic using surface mount related assembly technologies
2/27/2020 - PDF - English - BSI
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BS EN IEC 60068-2-82:2019 + Redline
Tracked Changes. Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
2/24/2020 - PDF - English - BSI
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BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
12/17/2019 - PDF - English - BSI
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BS EN IEC 62878-2-5:2019
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
11/18/2019 - PDF - English - BSI
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BS EN 61191-2:2017
Printed board assemblies Sectional specification. Requirements for surface mount soldered
10/7/2019 - PDF - English - BSI
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BS EN 60068-2-69:2017+A1:2019
Environmental testing Tests. Test Te/Tc. Solderability of electronic components and printed boards by the wetting balance (force measurement) method
9/11/2019 - PDF - English - BSI
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BS EN IEC 61188-6-4:2019
Printed boards and printed board assemblies. Design use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint land design
7/12/2019 - PDF - English - BSI
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BS EN IEC 60068-2-82:2019
Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
7/12/2019 - PDF - English - BSI
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PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
4/1/2019 - PDF - English - BSI
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BS EN IEC 61191-1:2018
Printed board assemblies Generic specification. Requirements for soldered electrical and electronic using surface mount related assembly technologies
11/13/2018 - PDF - English - BSI
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BS EN 60068-2-58:2015+A1:2018
Environmental testing Tests. Test Td: methods for solderability, resistance to dissolution of metallization and soldering heat surface mounting devices (SMD)
5/21/2018 - PDF - English - BSI
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BS EN IEC 61190-1-3:2018
Attachment materials for electronic assembly Requirements grade solder alloys and fluxed non-fluxed solid soldering applications
3/28/2018 - PDF - English - BSI
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17/30365805 DC:2017
BS IEC 60194-1. Printed boards design, manufacture and assembly. Vocabulary. Part 1. Common usage in printed board and electronic assembly technologies
9/1/2017 - PDF - English - BSI
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BS EN 62090:2017
Product package labels for electronic components using bar code and two- dimensional symbologies
7/31/2017 - PDF - English - BSI
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BS EN 62739-3:2017
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance test methods
4/30/2017 - PDF - English - BSI
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BS EN 62739-2:2016
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test metal materials with surface processing
10/31/2016 - PDF - English - BSI
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PD IEC/TR 62878-2-2:2015
Device embedded substrate Guidelines. Electrical testing
12/31/2015 - PDF - English - BSI
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BS EN 62878-1-1:2015
Device embedded substrate Generic specification. Test methods
7/31/2015 - PDF - English - BSI
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BS EN 62137-4:2014
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
6/30/2015 - PDF - English - BSI
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PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology
4/30/2015 - PDF - English - BSI
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PD IEC/TS 62878-2-4:2015
Device embedded substrate Guidelines. Test element groups (TEG)
4/30/2015 - PDF - English - BSI
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€250.00 -
BS EN 61190-1-2:2014
Attachment materials for electronic assembly Requirements soldering pastes high-quality interconnects in electronics
6/30/2014 - PDF - English - BSI
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BS EN 62739-1:2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test metal materials without surface processing
9/30/2013 - PDF - English - BSI
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BS EN 61193-3:2013
Quality assessment systems Selection and use of sampling plans for printed board laminate end-product in-process auditing
6/30/2013 - PDF - English - BSI
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12/30262664 DC:2012
BS EN 62588. Marking and Labeling of Components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-free) and other attributes
4/4/2012 - PDF - English - BSI
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BS EN 61869-3:2011
Instrument transformers Additional requirements for inductive voltage
3/31/2012 - PDF - English - BSI
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BS EN 62137-3:2012
Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
3/31/2012 - PDF - English - BSI
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BS EN 60068-2-83:2011
Environmental testing Tests. Test Tf: Solderability of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
11/30/2011 - PDF - English - BSI
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BS EN 62129-2:2011
Calibration of wavelength/optical frequency measurement instruments Michelson interferometer single wavelength meters
7/31/2011 - PDF - English - BSI
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BS EN 62417:2010
Semiconductor devices. Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
6/30/2010 - PDF - English - BSI
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BS EN 62137-1-5:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joints Mechanical shear fatigue
7/31/2009 - PDF - English - BSI
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BS EN 62137-1-3:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop
3/31/2009 - PDF - English - BSI
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BS EN 62137-1-4:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic bending
3/31/2009 - PDF - English - BSI
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DD IEC/PAS 62588:2008
Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
10/31/2008 - PDF - English - BSI
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BS EN 61193-2:2007
Quality assessment systems Selection and use of sampling plans for inspection electronic components packages
12/31/2007 - PDF - English - BSI
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€180.00 -
BS EN 62137-1-1:2007
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength
10/31/2007 - PDF - English - BSI
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BS EN 62137-1-2:2007
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength
10/31/2007 - PDF - English - BSI
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BS EN 61189-6:2006
Test methods for electrical materials, interconnection structures and assemblies materials used in manufacturing electronic
9/29/2006 - PDF - English - BSI
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BS EN 60194:2006
Printed board design, manufacture and assembly. Terms and definitions
9/29/2006 - PDF - English - BSI
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BS EN 60939-2-1:2004
Complete filter units for radio interference suppression Blank detail specification. Passive electromagnetic suppression. Filters which safety tests are required (Assessment level D/DZ)
2/9/2005 - PDF - English - BSI
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BS EN 60939-2-2:2004
Complete filter units for radio interference suppression Blank detail specification. Passive electromagnetic suppression. Filters which safety tests are required (safety only)
2/8/2005 - PDF - English - BSI
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BS EN 61188-5-2:2003
Printed boards and assemblies. Design use. Attachment (land/joint) considerations Discrete components
10/16/2003 - PDF - English - BSI
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BS EN 61188-5-6:2003
Printed boards and assemblies. Design use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
6/26/2003 - PDF - English - BSI
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BS EN 61190-1-1:2002
Attachment materials for electronic assembly Requirements soldering fluxes high-quality interconnections in electronics
8/16/2002 - PDF - English - BSI
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BS EN 61189-1:1997
Test methods for electrical materials, printed boards and other interconnection structures assemblies General test methodology
6/21/2002 - PDF - English - BSI
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BS EN 61193-1:2002
Quality assessment systems Registration and analysis of defects on printed board assemblies
5/14/2002 - PDF - English - BSI
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BS EN 61188-1-2:1998
Printed boards and assemblies. Design use. Generic requirements requirements. Controlled impedance
12/15/1998 - PDF - English - BSI
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BS EN 160200-2:1998
Harmonized system of quality assessment for electronic components. Sectional specification. Microwave modular units assessed Index test methods
3/15/1998 - PDF - English - BSI
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BS EN 61188-1-1:1997
Printed boards and assemblies. Design use. Generic requirements Flatness considerations for electronic assemblies
12/15/1997 - PDF - English - BSI
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