31.190 : Electronic component assemblies
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UNE-EN IEC 62878-2-602:2021
Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (Endorsed by Asociación Española de Normalización in October of 2021.)
10/1/2021 - PDF - English -
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UNE-EN IEC 60068-2-21:2021
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices (Endorsed by Asociación Española de Normalización in October of 2021.)
10/1/2021 - PDF - English -
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UNE-EN IEC 61188-6-1:2021
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (Endorsed by Asociación Española de Normalización in May of 2021.)
5/1/2021 - PDF - English -
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UNE-EN IEC 61760-3:2021
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (Endorsed by Asociación Española de Normalización in April of 2021.)
4/1/2021 - PDF - English -
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UNE-EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (Endorsed by Asociación Española de Normalización in April of 2021.)
4/1/2021 - PDF - English -
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UNE-EN IEC 62878-1:2019
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (Endorsed by Asociación Española de Normalización in January of 2020.)
1/1/2020 - PDF - English -
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UNE-EN IEC 62878-2-5:2019
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate (Endorsed by Asociación Española de Normalización in December of 2019.)
12/1/2019 - PDF - English -
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UNE-EN 61191-2:2017/AC:2019-10
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in December of 2019.)
12/1/2019 - PDF - English -
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UNE-EN 60068-2-69:2017/A1:2019
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (Endorsed by Asociación Española de Normalización in October of 2019.)
10/1/2019 - PDF - English -
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UNE-EN IEC 60068-2-82:2019
Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for components and parts used in electronic assemblies (Endorsed by Asociación Española de Normalización in August of 2019.)
8/1/2019 - PDF - English -
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UNE-EN IEC 61191-1:2018
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (Endorsed by Asociación Española de Normalización in December of 2018.)
12/1/2018 - PDF - English -
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UNE-EN 61760-4:2015/A1:2018
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (Endorsed by Asociación Española de Normalización in June of 2018.)
6/1/2018 - PDF - English -
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UNE-EN 60068-2-58:2015/A1:2018
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (Endorsed by Asociación Española de Normalización in May of 2018.)
5/1/2018 - PDF - English -
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UNE-EN IEC 61190-1-3:2018
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (Endorsed by Asociación Española de Normalización in April of 2018.)
4/1/2018 - PDF - English -
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UNE-EN 60068-2-69:2017/AC:2018-03
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (Endorsed by Asociación Española de Normalización in April of 2018.)
4/1/2018 - PDF - English -
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UNE-EN 61191-2:2017
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in November of 2017.)
11/1/2017 - PDF - English -
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UNE-EN 62090:2017
Product package labels for electronic components using bar code and two- dimensional symbologies (Endorsed by Asociación Española de Normalización in August of 2017.)
8/1/2017 - PDF - English -
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UNE-EN 60068-2-69:2017
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (Endorsed by Asociación Española de Normalización in July of 2017.)
7/1/2017 - PDF - English -
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UNE-EN 62739-3:2017
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods (Endorsed by Asociación Española de Normalización in May of 2017.)
5/1/2017 - PDF - English -
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UNE-EN 62739-2:2016
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing (Endorsed by AENOR in November of 2016.)
11/1/2016 - PDF - English -
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UNE-EN 62878-1-1:2015
Device embedded substrate - Part 1-1: Generic specification - Test methods (Endorsed by AENOR in August of 2015.)
8/1/2015 - PDF - English -
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UNE-EN 61760-4:2015
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (Endorsed by AENOR in August of 2015.)
8/1/2015 - PDF - English -
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UNE-EN 60068-2-58:2015
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (Endorsed by AENOR in June of 2015.)
6/1/2015 - PDF - English -
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UNE-EN 62137-4:2014
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (Endorsed by AENOR in February of 2015.)
2/1/2015 - PDF - English -
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UNE-EN 61190-1-2:2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (Endorsed by AENOR in July of 2014.)
7/1/2014 - PDF - English -
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UNE-EN 62739-1:2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing (Endorsed by AENOR in October of 2013.)
10/1/2013 - PDF - English -
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UNE-EN 61193-3:2013
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing (Endorsed by AENOR in June of 2013.)
6/1/2013 - PDF - English -
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UNE-EN 62137-3:2012
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (Endorsed by AENOR in April of 2012.)
4/1/2012 - PDF - English -
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UNE-EN 62137-1-5:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints -- Part 1-5: Mechanical shear fatigue test (Endorsed by AENOR in August of 2009.)
8/1/2009 - PDF - English -
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UNE-EN 62137-1-3:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-3: Cyclic drop test (Endorsed by AENOR in May of 2009.)
5/1/2009 - PDF - English -
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UNE-EN 62137-1-4:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-4: Cyclic bending test (Endorsed by AENOR in May of 2009.)
5/1/2009 - PDF - English -
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UNE-EN 62421:2007
Electronics assembly technology - Electronic modules (IEC 62421:2007). (Endorsed by AENOR in March of 2008.)
3/1/2008 - PDF - English -
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UNE-EN 61193-2:2007
Quality assessment systems -- Part 2: Selection and use of sampling plans for inspection of electronic components and packages (IEC 61193-2:2007). (Endorsed by AENOR in March of 2008.)
3/1/2008 - PDF - English -
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UNE-EN 62137-1-2:2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-2: Shear strength test (IEC 62137-1-2:2007). (Endorsed by AENOR in December of 2007.)
12/1/2007 - PDF - English -
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UNE-EN 62137-1-1:2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-1: Pull strength test (IEC 62137-1-1:2007). (Endorsed by AENOR in December of 2007.)
12/1/2007 - PDF - English -
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UNE-EN 60939-2-1:2004
Complete filter units for radio interference suppression -- Part 2-1: Blank detail specification - Passive filter units for electromagnetic interference suppression - Filters for which safety tests are required (assessment level D/DZ) (Endorsed by AENOR in April of 2005.)
4/1/2005 - PDF - English -
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UNE-EN 61188-5-2:2003
Printed boards and printed board assemblies - Design and use -- Part 5-2: Attachment (land/joint) considerations - Discrete components (Endorsed by AENOR in January of 2004.)
1/1/2004 - PDF - English -
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UNE-EN 61188-5-6:2003
Printed boards and printed board assemblies - Design and use -- Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides (Endorsed by AENOR in July of 2003.)
7/1/2003 - PDF - English -
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UNE-EN 61190-1-1:2002
Attachment materials for electronic assembly -- Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (Endorsed by AENOR in November of 2002.)
11/1/2002 - PDF - English -
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UNE-EN 61193-1:2002
Quality assessment systems -- Part 1: Registration and analysis of defects on printed board assemblies (Endorsed by AENOR in July of 2002.)
7/1/2002 - PDF - English -
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UNE-EN IEC 63215-2:2023
Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices (Endorsed by Asociación Española de Normalización in January of 2024.)
4/24/2024 - PDF - English -
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