31.190 : Electronic component assemblies
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JIS C 62137-3:2014
Electronics Assembly Technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
9/22/2014 - PDF - Japanese - JSA
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UNE-EN 61190-1-2:2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (Endorsed by AENOR in July of 2014.)
7/1/2014 - PDF - English - AENOR
Learn More€68.00 -
BS EN 61190-1-2:2014
Attachment materials for electronic assembly Requirements soldering pastes high-quality interconnects in electronics
6/30/2014 - PDF - English - BSI
Learn More€250.00 -
€33.33
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NF EN 62137-1-1, C93-704-1-1 (03/2014)
Surface-mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1 : pull strength test - Technique du montage en surface
3/1/2014 - Paper - French - AFNOR
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NF EN 62137-1-2, C93-704-1-2 (03/2014)
Surface-mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2 : shear strength test - Technique du montage en surface
3/1/2014 - Paper - French - AFNOR
Learn More€103.33 -
IEC 61190-1-2:2014
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
2/19/2014 - PDF - English, French - IEC
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UNE-EN 62739-1:2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing (Endorsed by AENOR in October of 2013.)
10/1/2013 - PDF - English - AENOR
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BS EN 62739-1:2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test metal materials without surface processing
9/30/2013 - PDF - English - BSI
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NF EN 60068-2-21, C20-700-2-21 (09/2013)
Environmental testing - Part 2-21 : tests - Test U : robustness of terminations and integral mounting devices
9/1/2013 - Paper - English, French - AFNOR
Learn More€105.00 -
BS EN 61193-3:2013
Quality assessment systems Selection and use of sampling plans for printed board laminate end-product in-process auditing
6/30/2013 - PDF - English - BSI
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IEC 62739-1:2013
IEC 62739-1:2013 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
6/18/2013 - PDF - English, French - IEC
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UNE-EN 61193-3:2013
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing (Endorsed by AENOR in June of 2013.)
6/1/2013 - PDF - English - AENOR
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IEC 61193-3:2013
IEC 61193-3:2013 Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
1/24/2013 - PDF - English, French - IEC
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DIN EN 62137-3:2012-08
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011), German version EN 62137-3:2012
8/1/2012 - PDF - German - DIN
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NF EN 62137-3, C93-704-3 (07/2012)
Electronics assembly technology - Part 3 : selection guidance of environmental and endurance test methods for solder joints
7/1/2012 - Paper - French - AFNOR
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12/30262664 DC:2012
BS EN 62588. Marking and Labeling of Components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-free) and other attributes
4/4/2012 - PDF - English - BSI
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UNE-EN 62137-3:2012
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (Endorsed by AENOR in April of 2012.)
4/1/2012 - PDF - English - AENOR
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BS EN 61869-3:2011
Instrument transformers Additional requirements for inductive voltage
3/31/2012 - PDF - English - BSI
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BS EN 62137-3:2012
Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
3/31/2012 - PDF - English - BSI
Learn More€331.00 -
€64.10
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€195.00 -
IPC JEDEC-9704A:2012
Printed Circuit Assembly Strain Gage Test Guideline
2/3/2012 - PDF sécurisé - English - IPC
Learn More€195.00 -
NF EN 60068-2-83, C20-783 (01/2012)
Environmental testing - Part 2-83 : tests - Test Tf : solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
1/1/2012 - Paper - French - AFNOR
Learn More€127.67 -
BS EN 60068-2-83:2011
Environmental testing Tests. Test Tf: Solderability of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
11/30/2011 - PDF - English - BSI
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IEC 62137-3:2011
IEC 62137-3:2011 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
11/8/2011 - PDF - English, French - IEC
Learn More€311.00 -
IEC 60068-2-83:2011
IEC 60068-2-83:2011 Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
9/7/2011 - PDF - English, French - IEC
Learn More€270.00 -
EIA-933-A:2011
Standard for Preparing a COTS Assembly Management Plan
8/1/2011 - PDF sécurisé - English - EIA
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BS EN 62129-2:2011
Calibration of wavelength/optical frequency measurement instruments Michelson interferometer single wavelength meters
7/31/2011 - PDF - English - BSI
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BS EN 62417:2010
Semiconductor devices. Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
6/30/2010 - PDF - English - BSI
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NF EN 62137-1-3, C93-704-1-3 (12/2009)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3 : cyclic drop test - Technique de montage en surface
12/1/2009 - Paper - French - AFNOR
Learn More€103.33 -
NF EN 62137-1-5, C93-704-1-5 (08/2009)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-5 : mechanical shear fatigue test - Technologie du montage en surface
8/1/2009 - Paper - French - AFNOR
Learn More€103.33 -
UNE-EN 62137-1-5:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints -- Part 1-5: Mechanical shear fatigue test (Endorsed by AENOR in August of 2009.)
8/1/2009 - PDF - English - AENOR
Learn More€66.00 -
BS EN 62137-1-5:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joints Mechanical shear fatigue
7/31/2009 - PDF - English - BSI
Learn More€250.00 -
NF EN 62137-1-4, C93-704-1-4 (05/2009)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4 : cyclic bending test - Technologie de montage en surface
5/1/2009 - Paper - French - AFNOR
Learn More€88.33 -
UNE-EN 62137-1-3:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-3: Cyclic drop test (Endorsed by AENOR in May of 2009.)
5/1/2009 - PDF - English - AENOR
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UNE-EN 62137-1-4:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-4: Cyclic bending test (Endorsed by AENOR in May of 2009.)
5/1/2009 - PDF - English - AENOR
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BS EN 62137-1-3:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop
3/31/2009 - PDF - English - BSI
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BS EN 62137-1-4:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic bending
3/31/2009 - PDF - English - BSI
Learn More€180.00 -
IEC 62137-1-5:2009
IEC 62137-1-5:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
2/11/2009 - PDF - English, French - IEC
Learn More€173.00 -
IEC 62137-1-4:2009
IEC 62137-1-4:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
1/26/2009 - PDF - English, French - IEC
Learn More€92.00 -
IEC 62137-1-3:2008
IEC 62137-1-3:2008 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
11/27/2008 - PDF - English, French - IEC
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DD IEC/PAS 62588:2008
Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
10/31/2008 - PDF - English - BSI
Learn More€180.00 -
DIN EN 62421:2008-06
Electronics assembly technology - Electronic modules (IEC 62421:2007); German version EN 62421:2007
6/1/2008 - PDF - German - DIN
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UNE-EN 62421:2007
Electronics assembly technology - Electronic modules (IEC 62421:2007). (Endorsed by AENOR in March of 2008.)
3/1/2008 - PDF - English - AENOR
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UNE-EN 61193-2:2007
Quality assessment systems -- Part 2: Selection and use of sampling plans for inspection of electronic components and packages (IEC 61193-2:2007). (Endorsed by AENOR in March of 2008.)
3/1/2008 - PDF - English - AENOR
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BS EN 61193-2:2007
Quality assessment systems Selection and use of sampling plans for inspection electronic components packages
12/31/2007 - PDF - English - BSI
Learn More€180.00 -
€180.00 -
UNE-EN 62137-1-1:2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-1: Pull strength test (IEC 62137-1-1:2007). (Endorsed by AENOR in December of 2007.)
12/1/2007 - PDF - English - AENOR
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UNE-EN 62137-1-2:2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-2: Shear strength test (IEC 62137-1-2:2007). (Endorsed by AENOR in December of 2007.)
12/1/2007 - PDF - English - AENOR
Learn More€63.00 -
BS EN 62137-1-1:2007
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength
10/31/2007 - PDF - English - BSI
Learn More€180.00 -
BS EN 62137-1-2:2007
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength
10/31/2007 - PDF - English - BSI
Learn More€180.00 -
IEC 61193-2:2007
IEC 61193-2:2007 Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
8/30/2007 - PDF - English - IEC
Learn More€132.00 -
IEC 62421:2007
IEC 62421:2007 Electronics assembly technology - Electronic modules
8/24/2007 - PDF - English, French - IEC
Learn More€92.00 -
IEC 62421:2007
IEC 62421:2007 Electronics assembly technology - Electronic modules
8/24/2007 - PDF - English - IEC
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IEC 62137-1-2:2007
IEC 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
7/25/2007 - PDF - English, French - IEC
Learn More€132.00 -
IEC 62137-1-2:2007
IEC 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
7/25/2007 - PDF - English - IEC
Learn More€132.00 -
IEC 62137-1-1:2007
IEC 62137-1-1:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
7/11/2007 - PDF - English, French - IEC
Learn More€92.00 -
IEC 62137-1-1:2007
IEC 62137-1-1:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
7/11/2007 - PDF - English - IEC
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BS EN 61189-6:2006
Test methods for electrical materials, interconnection structures and assemblies materials used in manufacturing electronic
9/29/2006 - PDF - English - BSI
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BS EN 60194:2006
Printed board design, manufacture and assembly. Terms and definitions
9/29/2006 - PDF - English - BSI
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JIS C 0807:2005 (R2015)
Product package labels for electronic components using bar code and two-dimensional symbologies
12/20/2005 - PDF - Japanese - JSA
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UNE-EN 60939-2-1:2004
Complete filter units for radio interference suppression -- Part 2-1: Blank detail specification - Passive filter units for electromagnetic interference suppression - Filters for which safety tests are required (assessment level D/DZ) (Endorsed by AENOR in April of 2005.)
4/1/2005 - PDF - English - AENOR
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BS EN 60939-2-1:2004
Complete filter units for radio interference suppression Blank detail specification. Passive electromagnetic suppression. Filters which safety tests are required (Assessment level D/DZ)
2/9/2005 - PDF - English - BSI
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BS EN 60939-2-2:2004
Complete filter units for radio interference suppression Blank detail specification. Passive electromagnetic suppression. Filters which safety tests are required (safety only)
2/8/2005 - PDF - English - BSI
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NF EN 61188-5-2, C93-711-5-2 (04/2004)
Printed boards and printed board assemblies - Design and use - Part 5-2 : attachment (land/joint) considerations - Discrete components - Cartes imprimées et cartes imprimées équipées
4/1/2004 - Paper - French - AFNOR
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UNE-EN 61188-5-2:2003
Printed boards and printed board assemblies - Design and use -- Part 5-2: Attachment (land/joint) considerations - Discrete components (Endorsed by AENOR in January of 2004.)
1/1/2004 - PDF - English - AENOR
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€195.00 -
BS EN 61188-5-2:2003
Printed boards and assemblies. Design use. Attachment (land/joint) considerations Discrete components
10/16/2003 - PDF - English - BSI
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UNE-EN 61188-5-6:2003
Printed boards and printed board assemblies - Design and use -- Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides (Endorsed by AENOR in July of 2003.)
7/1/2003 - PDF - English - AENOR
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BS EN 61188-5-6:2003
Printed boards and assemblies. Design use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
6/26/2003 - PDF - English - BSI
Learn More€180.00 -
IEC 61188-5-2:2003
IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
6/24/2003 - PDF - English, French - IEC
Learn More€345.00 -
IEC 61188-5-6:2003
IEC 61188-5-6:2003 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
1/23/2003 - PDF - English, French - IEC
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DIN EN 61190-1-1:2003-01
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (IEC 61190-1-1:2002); German version EN 61190-1-1:2002
1/1/2003 - PDF - German - DIN
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UNE-EN 61190-1-1:2002
Attachment materials for electronic assembly -- Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (Endorsed by AENOR in November of 2002.)
11/1/2002 - PDF - English - AENOR
Learn More€66.00 -
NF EN 61190-1-1, C90-700-1-1 (09/2002)
Attachment materials for electronic assembly - Part 1-1 : Requirements for soldering fluxes for high-quality interconnections in electronics assembly
9/1/2002 - Paper - French - AFNOR
Learn More€99.50 -
BS EN 61190-1-1:2002
Attachment materials for electronic assembly Requirements soldering fluxes high-quality interconnections in electronics
8/16/2002 - PDF - English - BSI
Learn More€250.00 -
UNE-EN 61193-1:2002
Quality assessment systems -- Part 1: Registration and analysis of defects on printed board assemblies (Endorsed by AENOR in July of 2002.)
7/1/2002 - PDF - English - AENOR
Learn More€66.00 -
BS EN 61189-1:1997
Test methods for electrical materials, printed boards and other interconnection structures assemblies General test methodology
6/21/2002 - PDF - English - BSI
Learn More€250.00 -
BS EN 61193-1:2002
Quality assessment systems Registration and analysis of defects on printed board assemblies
5/14/2002 - PDF - English - BSI
Learn More€250.00 -
IEC 61190-1-1:2002
IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
3/25/2002 - PDF - English, French - IEC
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JIS B 8460:2002 (R2016)
PCB (printed circuit board) assembly robots - Presentation of characteristics and functions
2/20/2002 - PDF - Japanese - JSA
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JIS B 8461:2002 (R2016)
PCB (printed circuit board) assembly robots - Interfaces
2/20/2002 - PDF - Japanese - JSA
Learn More€25.00 -
IEC 61193-1:2001
IEC 61193-1:2001 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
12/19/2001 - PDF - English, French - IEC
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UTE C90-720-1, C90-720-1U (06/2000)
Electronic assembly technology - Manufacturing line certification for electronic boards (QML) - Part 1 : guide for design and manufacturing of electronic assemblies - Technologies d'assemblage en électronique
6/1/2000 - Paper - French - AFNOR
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UTE C90-720-2, C90-720-2U (06/2000)
Electronic assembly technology - Manufacturing line certification for electronic boards (QML) - Part 2 : guide for obtaining QML agreement for electronic boards - Technologies d'assemblage en électronique
6/1/2000 - Paper - French - AFNOR
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BS EN 61188-1-2:1998
Printed boards and assemblies. Design use. Generic requirements requirements. Controlled impedance
12/15/1998 - PDF - English - BSI
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JIS C 6010-2:1998 (R2014)
Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice
10/20/1998 - PDF - Japanese - JSA
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BS EN 160200-2:1998
Harmonized system of quality assessment for electronic components. Sectional specification. Microwave modular units assessed Index test methods
3/15/1998 - PDF - English - BSI
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IPC 6015:1998
Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures
2/1/1998 - PDF sécurisé - English - IPC
Learn More€108.00 -
BS EN 61188-1-1:1997
Printed boards and assemblies. Design use. Generic requirements Flatness considerations for electronic assemblies
12/15/1997 - PDF - English - BSI
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UTE C46-450, C46-450U (03/1997)
Achievement of industrial process measurement and control equipment for electrical production and distribution installations. Electronic components and electronic modules. - Réalisation des équipements de mesure et de commande des processus industriels des installations de production et de distribution électrique
3/1/1997 - Paper - French - AFNOR
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UTE C90-550, C90-550U (01/1995)
Electronic components general. Guide for application of the french document C 90-550. Alloys, fluxes and creams for soft soldering. Definition of products.
1/1/1995 - Paper - French - AFNOR
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UTE C90-551, C90-551U (12/1994)
Electronic components general. Guide for application of the french document C 90-551. Alloys, fluxes and creams for soft soldering test methods.
12/1/1994 - Paper - French - AFNOR
Learn More€154.00 -
DIN EN 60917-2:1994-09
Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification; interface coordination dimensions for the 25 mm equipment practice (IEC 60917-2:1992); German version EN 60917-2:1994
9/1/1994 - PDF - German - DIN
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UNE-EN IEC 63215-2:2023
Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices (Endorsed by Asociación Española de Normalización in January of 2024.)
4/19/2024 - PDF - English - AENOR
Learn More€70.00
