31.180 : Printed circuits and boards
-
JIS C 61191-1:2015
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
11/20/2015 - PDF - Japanese - JSA
Learn More€50.18 -
JIS C 61191-2:2015
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
11/20/2015 - PDF - Japanese - JSA
Learn More€41.86 -
JIS C 61188-7:2014
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
9/22/2014 - PDF - Japanese - JSA
Learn More€25.00 -
JIS Z 3198-1:2014
Test methods for lead-free solders - Part 1: Methods for measuring of melting temperature ranges
6/20/2014 - PDF - Japanese - JSA
Learn More€25.00 -
JIS Z 3284-2:2014
Solder paste - Part 2: Test methods for solder particle shape, surface condition judgment, and particle size distribution
6/20/2014 - PDF - Japanese - JSA
Learn More€25.00 -
JIS Z 3284-3:2014
Solder paste - Part 3: Test methods for printability, viscosity, slump and tackiness
6/20/2014 - PDF - Japanese - JSA
Learn More€25.00 -
JIS Z 3284-4:2014
Solder paste - Part 4: Test methods for wettability, solderball and spread
6/20/2014 - PDF - Japanese - JSA
Learn More€36.27 -
€64.10
-
JIS C 61191-6:2011 (R2016)
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
12/20/2011 - PDF - Japanese - JSA
Learn More€41.86 -
JIS C 5005-2:2010 (R2015)
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
5/20/2010 - PDF - Japanese - JSA
Learn More€25.00 -
JIS C 6485:2008 (R2017)
Base materials for printed circuits - Paper base, phenolic resin
8/20/2008 - PDF - Japanese - JSA
Learn More€25.00 -
JIS C 61191-3:2006 (R2015)
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
3/25/2006 - PDF - Japanese - JSA
Learn More€25.00 -
JIS C 61191-4:2006 (R2015)
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
3/25/2006 - PDF - Japanese - JSA
Learn More€25.00 -
JIS C 6484:2005 (R2015)
Base materials for printed circuits - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test)
3/20/2005 - PDF - Japanese - JSA
Learn More€36.27 -
JIS C 6493:1999 (R2014)
Base materials for printed circuits - Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board
11/20/1999 - PDF - Japanese - JSA
Learn More€25.00 -
JIS C 6494:1999 (R2014)
Base materials for printed circuits - Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
11/20/1999 - PDF - Japanese - JSA
Learn More€25.00 -
JIS C 6488:1999 (R2014)
Base materials for printed circuits - Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)
11/20/1999 - PDF - Japanese - JSA
Learn More€25.00 -
JIS C 6489:1999 (R2014)
Base materials for printed circuits - Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)
11/20/1999 - PDF - Japanese - JSA
Learn More€25.00 -
JIS C 6490:1998 (R2014)
Base materials for printed circuits - Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
10/20/1998 - PDF - Japanese - JSA
Learn More€25.00 -
JIS C 6492:1998 (R2014)
Base materials for printed circuits - Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
10/20/1998 - PDF - Japanese - JSA
Learn More€25.00 -
€36.27
-
JIS C 6482:1997 (R2015)
Copper-clad laminates for printed wiring boards - Paper base, epoxy resin
2/20/1997 - PDF - Japanese - JSA
Learn More€25.00 -
JIS C 6483:1997 (R2015)
Copper-clad laminates for printed wiring boards - Synthetic fiber fabric base, epoxy resin
2/20/1997 - PDF - Japanese - JSA
Learn More€25.00 -
€25.00
-
JIS C 6481:1996 (R2015)
Test methods of copper-clad laminates for printed wiring boards
1/1/1996 - PDF - Japanese - JSA
Learn More€25.00 -
JIS C 6521:1996 (R2015)
Test methods of prepreg for multilayer printed wiring boards
1/1/1996 - PDF - Japanese - JSA
Learn More€25.00 -
JIS C 6522:1996 (R2015)
Prepreg for multilayer printed wiring boards - Epoxy resin-impregnated glass cloth
1/1/1996 - PDF - Japanese - JSA
Learn More€25.00 -
JIS C 6471:1995 (R2014)
Test methods of copper-clad laminates for flexible printed wiring boards
3/1/1995 - PDF - Japanese - JSA
Learn More€25.00 -
JIS C 6472:1995 (R2014)
Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film)
3/1/1995 - PDF - Japanese - JSA
Learn More€25.00 -
JIS C 6523:1995 (R2015)
Prepreg for multilayer printed wiring boards - Modified or unmodified polyimide resin-impregnated glass cloth
3/1/1995 - PDF - Japanese - JSA
Learn More€25.00 -
JIS C 6524:1995 (R2015)
Prepreg for multilayer printed wiring boards - Bismaleimide/Triazine/Epoxide resin-impregnated glass cloth
3/1/1995 - PDF - Japanese - JSA
Learn More€25.00 -
€25.00
-
€25.00
-
€25.00
-
JIS C 5017:1994 (R2014)
Flexible printed wiring boards - Single-sided, Double-sided
1/1/1994 - PDF - Japanese - JSA
Learn More€25.00 -
JIS C 6480:1994 (R2015)
General rules of copper-clad laminates for printed wiring boards
1/1/1994 - PDF - Japanese - JSA
Learn More€25.00 -
€25.00
-
€25.00
-
JIS C 6520:1993 (R2015)
General rules of prepreg for multilayer printed wiring boards
3/1/1993 - PDF - Japanese - JSA
Learn More€25.00
