31.180 : Printed circuits and boards
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IEC TS 62878-2-10:2024
IEC TS 62878-2-10:2024 Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
1/31/2024 - PDF - English - IEC
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IEC 63251:2023
IEC 63251:2023 Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
11/1/2023 - PDF - English, French - IEC
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IEC 63055:2023
IEC 63055:2023 Format for LSI-Package-Board Interoperable design
10/11/2023 - PDF - English - IEC
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IEC 61189-2-804:2023
IEC 61189-2-804:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
8/25/2023 - PDF - English, French - IEC
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IEC 62899-202-10:2023
IEC 62899-202-10:2023 Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer
8/16/2023 - PDF - English - IEC
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IEC 62899-202-9:2023
IEC 62899-202-9:2023 Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test
8/3/2023 - PDF - English - IEC
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IEC 61189-2-801:2023
IEC 61189-2-801:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
7/26/2023 - PDF - English, French - IEC
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IEC 61189-2-803:2023
IEC 61189-2-803:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
7/26/2023 - PDF - English, French - IEC
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IEC 61249-6-3:2023
IEC 61249-6-3:2023 Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards
6/14/2023 - PDF - English, French - IEC
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IEC TR 61191-9:2023
IEC TR 61191-9:2023 Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices
6/7/2023 - PDF - English - IEC
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IEC 61249-2-51:2023
IEC 61249-2-51:2023 Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
5/11/2023 - PDF - English, French - IEC
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IEC 62899-202:2023
IEC 62899-202:2023 Printed electronics - Part 202: Materials - Conductive ink
5/2/2023 - PDF - English - IEC
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IEC 62899-202:2023 + Redline
IEC 62899-202:2023 (Redline version) Printed electronics - Part 202: Materials - Conductive ink
5/2/2023 - PDF - English - IEC
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IEC PAS 61191-10:2022
IEC PAS 61191-10:2022 Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies
7/18/2022 - PDF - English - IEC
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IEC TR 62878-2-9:2022
IEC TR 62878-2-9:2022 Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
4/27/2022 - PDF - English - IEC
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IEC 61189-2-501:2022
IEC 61189-2-501:2022 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
2/3/2022 - PDF - English, French - IEC
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IEC 62899-202-4:2021
IEC 62899-202-4:2021 Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers (conductive and insulating)
10/22/2021 - PDF - English - IEC
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IEC 62899-201-2:2021
IEC 62899-201-2:2021 Printed electronics - Part 201-2: Materials - Substrates - Measurement methods for properties of stretchable substrates
10/14/2021 - PDF - English - IEC
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IEC TR 62899-402-4:2021
IEC TR 62899-402-4:2021 Printed electronics - Part 402-4: Printability - Measurement of qualities - Classification and measurement methods for morphology
9/21/2021 - PDF - English - IEC
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IEC 61189-2-807:2021
IEC 61189-2-807:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
9/3/2021 - PDF - English, French - IEC
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IEC TR 62878-2-8:2021
IEC TR 62878-2-8:2021 Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
7/7/2021 - PDF - English - IEC
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IEC 62878-2-602:2021
IEC 62878-2-602:2021 Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
6/22/2021 - PDF - English, French - IEC
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IEC 62899-402-3:2021
IEC 62899-402-3:2021 Printed electronics - Part 402-3: Printability - Measurement of qualities - Voids in printed pattern using a two-dimensional optical image
4/7/2021 - PDF - English - IEC
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IEC TR 61191-8:2021
IEC TR 61191-8:2021 Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
3/19/2021 - PDF - English - IEC
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IEC 61189-5-301:2021
IEC 61189-5-301:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
3/17/2021 - PDF - English, French - IEC
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IEC 62899-202-7:2021
IEC 62899-202-7:2021 Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method
3/3/2021 - PDF - English - IEC
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IEC 61188-6-1:2021
IEC 61188-6-1:2021 Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
2/23/2021 - PDF - English, French - IEC
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IEC 60194-1:2021
IEC 60194-1:2021 Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies
2/9/2021 - PDF - English, French - IEC
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IEC 61188-6-2:2021
IEC 61188-6-2:2021 Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
2/4/2021 - PDF - English, French - IEC
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IEC 61189-5-502:2021
IEC 61189-5-502:2021 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies
2/3/2021 - PDF - English, French - IEC
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IEC 61189-5-601:2021
IEC 61189-5-601:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
2/3/2021 - PDF - English, French - IEC
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IEC 61189-5-501:2021
IEC 61189-5-501:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes
1/26/2021 - PDF - English, French - IEC
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IEC TR 61188-8:2021
IEC TR 61188-8:2021 Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library
1/14/2021 - PDF - English - IEC
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IEC 62899-202-6:2020
IEC 62899-202-6:2020 Printed electronics - Part 202-6: Materials - Conductive ink - Measurement method for resistance changes under high temperature and humidity - Printed conductive layer on a flexible substrate
12/4/2020 - PDF - English - IEC
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IEC 62899-402-2:2020
IEC 62899-402-2:2020 Printed electronics - Part 402-2: Printability - Measurement of qualities - Edge waviness
8/21/2020 - PDF - English - IEC
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IEC 60947-4-3:2020
IEC 60947-4-3:2020 Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - Semiconductor controllers and semiconductor contactors for non-motor loads
7/14/2020 - PDF - English - IEC
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IEC 61189-5-504:2020
IEC 61189-5-504:2020 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)
4/21/2020 - PDF - English, French - IEC
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IEC TR 61191-7:2020
IEC TR 61191-7:2020 Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
3/11/2020 - PDF - English - IEC
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IEC 62878-1:2019
IEC 62878-1:2019 Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
10/14/2019 - PDF - English - IEC
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IEC 62878-1:2019
IEC 62878-1:2019 Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
10/14/2019 - PDF - English, French - IEC
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IEC 62878-2-5:2019
IEC 62878-2-5:2019 Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
9/16/2019 - PDF - English - IEC
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IEC 62878-2-5:2019
IEC 62878-2-5:2019 Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
9/16/2019 - PDF - English, French - IEC
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IEC TR 61189-5-506:2019
IEC TR 61189-5-506:2019 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
6/26/2019 - PDF - English - IEC
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IEC 62899-204:2019
IEC 62899-204:2019 Printed electronics - Part 204: Materials - Insulator ink - Measurement methods of properties of insulator inks and printed insulating layers
5/20/2019 - PDF - English - IEC
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IEC 61188-6-4:2019
IEC 61188-6-4:2019 Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
5/2/2019 - PDF - English, French - IEC
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IEC TR 62878-2-7:2019
IEC TR 62878-2-7:2019 Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
3/20/2019 - PDF - English - IEC
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IEC 62899-202-3:2019
IEC 62899-202-3:2019 Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films - Contactless method
1/16/2019 - PDF - English - IEC
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IEC 62899-201:2016/AMD1:2018
IEC 62899-201:2016/AMD1:2018 Amendment 1 - Printed electronics - Part 201: Materials - Substrates
11/15/2018 - PDF - English - IEC
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IEC 62899-201:2016+AMD1:2018 Edition 1.1
IEC 62899-201:2016+AMD1:2018 (Consolidated version) Printed electronics - Part 201: Materials - Substrates
11/15/2018 - PDF - English - IEC
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IEC 62899-202-5:2018
IEC 62899-202-5:2018 Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
9/28/2018 - PDF - English - IEC
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IEC 62899-403-1:2018
IEC 62899-403-1:2018 Printed electronics - Part 403-1: Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine
6/21/2018 - PDF - English - IEC
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IEC 61189-2-630:2018
IEC 61189-2-630:2018 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning
6/5/2018 - PDF - English, French - IEC
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IEC 61249-2-46:2018
IEC 61249-2-46:2018 Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
1/10/2018 - PDF - English - IEC
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IEC 61249-2-45:2018
IEC 61249-2-45:2018 Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
1/10/2018 - PDF - English - IEC
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IEC 61249-2-47:2018
IEC 61249-2-47:2018 Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
1/10/2018 - PDF - English - IEC
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IEC 61249-2-45:2018
IEC 61249-2-45:2018 Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
1/10/2018 - PDF - English, French - IEC
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IEC 61249-2-46:2018
IEC 61249-2-46:2018 Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
1/10/2018 - PDF - English, French - IEC
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IEC 61249-2-47:2018
IEC 61249-2-47:2018 Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
1/10/2018 - PDF - English, French - IEC
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IEC 60194-2:2017
IEC 60194-2:2017 Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
12/13/2017 - PDF - English - IEC
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IEC 61189-5-503:2017
IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
5/22/2017 - PDF - English, French - IEC
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IEC 61189-5-503:2017
IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
5/22/2017 - PDF - English - IEC
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IEC 61188-7:2017
IEC 61188-7:2017 Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
4/10/2017 - PDF - English, French - IEC
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IEC 61188-7:2017
IEC 61188-7:2017 Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
4/10/2017 - PDF - English - IEC
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IEC TR 61189-3-914:2017
IEC TR 61189-3-914:2017 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
3/17/2017 - PDF - English - IEC
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IEC 62899-401:2017
IEC 62899-401:2017 Printed electronics - Part 401: Printability - Overview
3/3/2017 - PDF - English - IEC
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IEC 62899-402-1:2017
IEC 62899-402-1:2017 Printed electronics - Part 402-1: Printability - Measurement of qualities - Pattern width
3/3/2017 - PDF - English - IEC
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IEC TR 62899-250:2016
IEC TR 62899-250:2016 Printed electronics - Part 250: Material technologies required in printed electronics for wearable smart devices
12/14/2016 - PDF - English - IEC
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IEC TS 61189-3-301:2016
IEC TS 61189-3-301:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB
7/28/2016 - PDF - English - IEC
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IEC 61189-2-719:2016
IEC 61189-2-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
7/12/2016 - PDF - English, French - IEC
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IEC 61189-5-1:2016
IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
7/5/2016 - PDF - English, French - IEC
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IEC 61249-2-44:2016
IEC 61249-2-44:2016 Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
5/12/2016 - PDF - English, French - IEC
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IEC 61249-2-43:2016
IEC 61249-2-43:2016 Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
5/12/2016 - PDF - English, French - IEC
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IEC 62899-201:2016
IEC 62899-201:2016 Printed electronics - Part 201: Materials - Substrates
2/25/2016 - PDF - English - IEC
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IEC 62326-20:2016
IEC 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
2/3/2016 - PDF - English, French - IEC
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IEC 61189-3-719:2016
IEC 61189-3-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
1/5/2016 - PDF - English, French - IEC
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IEC 61189-3-913:2016
IEC 61189-3-913:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs
1/5/2016 - PDF - English, French - IEC
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IEC TR 63018:2015
IEC TR 63018:2015 Flexible printed circuit boards (FPCBs) - Method to decrease signal loss by using noise suppression materials
12/16/2015 - PDF - English - IEC
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IEC TR 63017:2015
IEC TR 63017:2015 Flexible printed circuit boards (FPCBs) - Method of compensation of impedance variations
12/16/2015 - PDF - English - IEC
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IEC TR 62878-2-2:2015
IEC TR 62878-2-2:2015 Device embedded substrate - Part 2-2: Guidelines - Electrical testing
12/4/2015 - PDF - English, French - IEC
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IEC 62878-1-1:2015
IEC 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
5/20/2015 - PDF - English, French - IEC
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IEC 61189-2-721:2015
IEC 61189-2-721:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator
4/29/2015 - PDF - English, French - IEC
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IEC TS 62878-2-1:2015
IEC TS 62878-2-1:2015 Device embedded substrate - Part 2-1: Guidelines - General description of technology
3/30/2015 - PDF - English, French - IEC
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IEC TS 62878-2-3:2015
IEC TS 62878-2-3:2015 Device embedded substrate - Part 2-3: Guidelines - Design guide
3/27/2015 - PDF - English, French - IEC
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IEC TS 62878-2-4:2015
IEC TS 62878-2-4:2015 Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
3/27/2015 - PDF - English, French - IEC
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IEC 60050-541:1990/AMD1:2015
IEC 60050-541:1990/AMD1:2015 Amendment 1 - International Electrotechnical Vocabulary (IEV) - Part 541: Printed circuits
2/25/2015 - PDF - English, French - IEC
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IEC 61189-5-2:2015
IEC 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
1/8/2015 - PDF - English, French - IEC
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IEC 61189-5-3:2015
IEC 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
1/8/2015 - PDF - English, French - IEC
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IEC 61189-5-4:2015
IEC 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
1/8/2015 - PDF - English, French - IEC
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IEC TR 62866:2014
IEC TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
5/7/2014 - PDF - English, French - IEC
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IEC 61249-4-18:2013
IEC 61249-4-18:2013 Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
11/4/2013 - PDF - English, French - IEC
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IEC 61249-4-19:2013
IEC 61249-4-19:2013 Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
11/4/2013 - PDF - English, French - IEC
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IEC 61189-11:2013
IEC 61189-11:2013 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
5/7/2013 - PDF - English, French - IEC
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IEC 61249-2-27:2012
IEC 61249-2-27:2012 Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
11/29/2012 - PDF - English, French - IEC
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IEC 61249-2-39:2012
IEC 61249-2-39:2012 Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
11/29/2012 - PDF - English, French - IEC
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IEC 61249-2-40:2012
IEC 61249-2-40:2012 Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials, clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
11/29/2012 - PDF - English, French - IEC
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IEC 61249-2-30:2012
IEC 61249-2-30:2012 Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
11/29/2012 - PDF - English, French - IEC
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IEC 61249-2-41:2010
IEC 61249-2-41:2010 Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
4/21/2010 - PDF - English, French - IEC
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IEC 61249-2-42:2010
IEC 61249-2-42:2010 Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
4/21/2010 - PDF - English, French - IEC
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IEC 61191-6:2010
IEC 61191-6:2010 Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
1/14/2010 - PDF - English, French - IEC
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IEC 62496-3-1:2009
IEC 62496-3-1:2009 Optical circuit boards - Part 3-1: Performance standards - Flexible optical circuit boards using unconnectorized optical glass fibres
8/18/2009 - PDF - English, French - IEC
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IEC 62496-3-1:2009
IEC 62496-3-1:2009 Optical circuit boards - Part 3-1: Performance standards - Flexible optical circuit boards using unconnectorized optical glass fibres
8/18/2009 - PDF - English - IEC
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IEC 61249-4-17:2009
IEC 61249-4-17:2009 Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
5/26/2009 - PDF - English, French - IEC
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IEC 61249-4-15:2009
IEC 61249-4-15:2009 Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
5/26/2009 - PDF - English, French - IEC
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IEC 61249-4-14:2009
IEC 61249-4-14:2009 Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
5/26/2009 - PDF - English, French - IEC
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IEC 61249-4-16:2009
IEC 61249-4-16:2009 Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
5/26/2009 - PDF - English, French - IEC
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IEC 61249-4-16:2009
IEC 61249-4-16:2009 Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
5/26/2009 - PDF - English - IEC
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IEC 61249-4-17:2009
IEC 61249-4-17:2009 Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
5/26/2009 - PDF - English - IEC
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IEC 61249-4-15:2009
IEC 61249-4-15:2009 Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
5/26/2009 - PDF - English - IEC
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IEC 61249-4-14:2009
IEC 61249-4-14:2009 Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
5/26/2009 - PDF - English - IEC
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IEC 61249-2-33:2009
IEC 61249-2-33:2009 Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad
2/11/2009 - PDF - English, French - IEC
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IEC 61249-2-31:2009
IEC 61249-2-31:2009 Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad
2/11/2009 - PDF - English, French - IEC
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IEC 61249-2-34:2009
IEC 61249-2-34:2009 Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
2/11/2009 - PDF - English, French - IEC
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IEC 61249-2-32:2009
IEC 61249-2-32:2009 Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
2/11/2009 - PDF - English, French - IEC
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IEC 62496-1:2008
IEC 62496-1:2008 Optical circuit boards - Part 1: General
12/9/2008 - PDF - English, French - IEC
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IEC 61249-2-38:2008
IEC 61249-2-38:2008 Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
11/27/2008 - PDF - English, French - IEC
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IEC 61249-2-37:2008
IEC 61249-2-37:2008 Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
11/27/2008 - PDF - English, French - IEC
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IEC 61249-2-35:2008
IEC 61249-2-35:2008 Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
11/27/2008 - PDF - English, French - IEC
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IEC 61249-2-36:2008
IEC 61249-2-36:2008 Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
11/27/2008 - PDF - English, French - IEC
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IEC 61249-4-1:2008
IEC 61249-4-1:2008 Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
1/30/2008 - PDF - English - IEC
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IEC 61249-4-1:2008
IEC 61249-4-1:2008 Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
1/30/2008 - PDF - English, French - IEC
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IEC 61188-5-8:2007
IEC 61188-5-8:2007 Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
10/30/2007 - PDF - English, French - IEC
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IEC 61188-5-3:2007
IEC 61188-5-3:2007 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
10/30/2007 - PDF - English, French - IEC
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IEC 61188-5-4:2007
IEC 61188-5-4:2007 Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
10/30/2007 - PDF - English, French - IEC
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IEC 61188-5-5:2007
IEC 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
10/30/2007 - PDF - English, French - IEC
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IEC 61188-5-8:2007
IEC 61188-5-8:2007 Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
10/30/2007 - PDF - English - IEC
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IEC 61188-5-5:2007
IEC 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
10/30/2007 - PDF - English - IEC
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IEC 61188-5-3:2007
IEC 61188-5-3:2007 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
10/30/2007 - PDF - English - IEC
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IEC 61188-5-4:2007
IEC 61188-5-4:2007 Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
10/30/2007 - PDF - English - IEC
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IEC 61189-3:2007
IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
10/9/2007 - PDF - English - IEC
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IEC 61189-3:2007
IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
10/9/2007 - PDF - English, French - IEC
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IEC 61189-5:2006
IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
8/29/2006 - PDF - English, French - IEC
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IEC 61189-5:2006
IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
8/29/2006 - PDF - English - IEC
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IEC 61189-6:2006
IEC 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
7/24/2006 - PDF - English, French - IEC
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IEC 61189-6:2006
IEC 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
7/24/2006 - PDF - English - IEC
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IEC 61189-2:2006
IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
5/30/2006 - PDF - English - IEC
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IEC 61249-4-11:2005
IEC 61249-4-11:2005 Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
9/22/2005 - PDF - English, French - IEC
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IEC 61249-4-12:2005
IEC 61249-4-12:2005 Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
9/5/2005 - PDF - English, French - IEC
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IEC 61249-4-5:2005
IEC 61249-4-5:2005 Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
9/5/2005 - PDF - English - IEC
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IEC 61249-4-2:2005
IEC 61249-4-2:2005 Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
9/5/2005 - PDF - English - IEC
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IEC 61249-2-2:2005
IEC 61249-2-2:2005 Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
1/20/2005 - PDF - English, French - IEC
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IEC 61249-2-23:2005
IEC 61249-2-23:2005 Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad
1/11/2005 - PDF - English, French - IEC
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IEC 61249-2-26:2005
IEC 61249-2-26:2005 Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
1/11/2005 - PDF - English, French - IEC
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IEC 61249-2-22:2005
IEC 61249-2-22:2005 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
1/11/2005 - PDF - English, French - IEC
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IEC 61249-2-1:2005
IEC 61249-2-1:2005 Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad
1/11/2005 - PDF - English, French - IEC
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IEC 61249-2-21:2003
IEC 61249-2-21:2003 Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
11/12/2003 - PDF - English, French - IEC
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IEC 61249-2-5:2003
IEC 61249-2-5:2003 Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad
11/12/2003 - PDF - English, French - IEC
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IEC 61249-2-6:2003
IEC 61249-2-6:2003 Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
11/12/2003 - PDF - English, French - IEC
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IEC 61249-2-11:2003
IEC 61249-2-11:2003 Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
11/12/2003 - PDF - English, French - IEC
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IEC 61188-5-2:2003
IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
6/24/2003 - PDF - English, French - IEC
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IEC 61249-2-9:2003
IEC 61249-2-9:2003 Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
2/27/2003 - PDF - English, French - IEC
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IEC 61249-2-8:2003
IEC 61249-2-8:2003 Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
2/27/2003 - PDF - English, French - IEC
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IEC 61249-2-10:2003
IEC 61249-2-10:2003 Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
2/27/2003 - PDF - English, French - IEC
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IEC 62326-1:2002
IEC 62326-1:2002 Printed boards - Part 1: Generic specification
3/5/2002 - PDF - English, French - IEC
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IEC 61249-2-7:2002
IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
3/5/2002 - PDF - English, French - IEC
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IEC 61249-2-18:2002
IEC 61249-2-18:2002 Materials for printed boards and other interconnecting structures - Part 2-18: Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad
2/13/2002 - PDF - English, French - IEC
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IEC 61249-2-4:2001
IEC 61249-2-4:2001 Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad
12/19/2001 - PDF - English, French - IEC
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IEC 61249-2-19:2001
IEC 61249-2-19:2001 Materials for printed boards and other interconnecting structures - Part 2-19: Reinforced base materials, clad and unclad - Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test), copper clad
11/28/2001 - PDF - English, French - IEC
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IEC 61189-1:1997+AMD1:2001 Edition 1.1
IEC 61189-1:1997+AMD1:2001 (Consolidated version) Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
11/22/2001 - PDF - English, French - IEC
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IEC 61189-1:1997/AMD1:2001
IEC 61189-1:1997/AMD1:2001 Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
8/9/2001 - PDF - English, French - IEC
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IEC 61249-2-13:1999
IEC 61249-2-13:1999 Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad
2/26/1999 - PDF - English - IEC
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IEC 61249-2-13:1999
IEC 61249-2-13:1999 Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad
2/26/1999 - PDF - English, French - IEC
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IEC 61249-3-3:1999
IEC 61249-3-3:1999 Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
2/10/1999 - PDF - English, French - IEC
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IEC 61249-3-4:1999
IEC 61249-3-4:1999 Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
2/10/1999 - PDF - English, French - IEC
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IEC 61249-3-5:1999
IEC 61249-3-5:1999 Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
2/10/1999 - PDF - English, French - IEC
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IEC 61249-3-5:1999
IEC 61249-3-5:1999 Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
2/10/1999 - PDF - English - IEC
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IEC 61249-3-4:1999
IEC 61249-3-4:1999 Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
2/10/1999 - PDF - English - IEC
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IEC 61249-3-3:1999
IEC 61249-3-3:1999 Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
2/10/1999 - PDF - English - IEC
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IEC 61249-2-12:1999
IEC 61249-2-12:1999 Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
1/29/1999 - PDF - English, French - IEC
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IEC 61249-2-12:1999
IEC 61249-2-12:1999 Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
1/29/1999 - PDF - English - IEC
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IEC 61249-8-8:1997
IEC 61249-8-8:1997 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
6/24/1997 - PDF - English, French - IEC
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IEC 61189-1:1997
IEC 61189-1:1997 Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
3/27/1997 - PDF - English, French - IEC
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IEC 62326-4:1996
IEC 62326-4:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
12/19/1996 - PDF - English, French - IEC
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IEC 62326-4-1:1996
IEC 62326-4-1:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
12/19/1996 - PDF - English, French - IEC
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IEC 61249-5-4:1996
IEC 61249-5-4:1996 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
6/18/1996 - PDF - English, French - IEC
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IEC 61249-8-7:1996
IEC 61249-8-7:1996 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
4/26/1996 - PDF - English, French - IEC
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IEC 61249-5-1:1995
IEC 61249-5-1:1995 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
11/28/1995 - PDF - English, French - IEC
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IEC 61249-7-1:1995
IEC 61249-7-1:1995 Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper
4/26/1995 - PDF - English, French - IEC
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IEC 60050-541:1990
IEC 60050-541:1990 International Electrotechnical Vocabulary (IEV) - Part 541: Printed circuits
10/15/1990 - PDF - English, French, Russian - IEC
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