Page 5 | 31.180 : Printed circuits and boards 31 : Electronics ICS

JIS C 6489:1999 (R2014)

Base materials for printed circuits - Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)
11/20/1999 - PDF - Japanese - JSA
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€25.00

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards), transfer adhesive films (IEC 61249-3-5:1999), German version EN 61249-3-5:1999
11/1/1999 - PDF - German - DIN
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€79.72

DIN EN 61249-3-4:1999-11

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards), adhesive coated flexible polyimide film (IEC 61249-3-4:1999), German version EN 61249-3-4:1999
11/1/1999 - PDF - German - DIN
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€79.72

DIN EN 61249-3-3:1999-11

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards), adhesive coated flexible polyester film (IEC 61249-3-3:1999), German version EN 61249-3-3:1999
11/1/1999 - PDF - German - DIN
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€79.72

DIN EN 61249-2-13:1999-11

Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad, cyanate ester non-woven aramid laminate of defined flammability, copper clad (IEC 61249-2-13:1999), German version EN 61249-2-13:1999
11/1/1999 - PDF - German - DIN
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€79.72

DIN EN 61249-2-12:1999-11

Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad, epoxide non-woven aramid laminate of defined flammability, copper-clad (IEC 61249-2-12:1999), German version EN 61249-2-12:1999
11/1/1999 - PDF - German - DIN
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€79.72

BS CECC 265001:1998

Harmonized system of quality assessment for electronic components. Technology approval schedule. Film and hybrid integrated circuits
7/15/1999 - PDF - English - BSI
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€293.00

BS EN 61249-3-4:1999

Materials for interconnection structures. Sectional specification set unreinforced base materials, clad and unclad (intended flexible printed boards) Adhesive coated polyimide film
6/15/1999 - PDF - English - BSI
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€180.00

BS EN 61249-3-5:1999

Materials for interconnection structures. Sectional specification set unreinforced base materials, clad and unclad (intended flexible printed boards) Transfer adhesive films boards
6/15/1999 - PDF - English - BSI
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€180.00

BS EN 61249-2-12:1999

Materials for interconnection structures. Sectional specification set reinforced base materials, clad and unclad Epoxide non-woven aramid laminate of defined flammability, copper-clad
6/15/1999 - PDF - English - BSI
Learn More

€180.00

BS EN 61249-3-3:1999

Materials for interconnection structures. Sectional specification set unreinforced base materials, clad and unclad (intended flexible printed boards) Adhesive coated polyester film
6/15/1999 - PDF - English - BSI
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€180.00

BS EN 61249-2-13:1999

Materials for interconnection structures. Sectional specification set reinforced base materials, clad and unclad Cyanate ester non-woven aramid laminate of defined flammability, copper-clad
6/15/1999 - PDF - English - BSI
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€180.00

IPC 4104:1999

Specifications for High Density Interconnect (HDI) and Microvia Materials
5/1/1999 - PDF sécurisé - English - IPC
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€152.00

UNE-EN 62326-4:1999

PRINTED BOARDS. PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS. SECTIONAL SPECIFICATION.
4/19/1999 - PDF - Spanish - AENOR
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€80.00

UNE-EN 62326-4:1999

PRINTED BOARDS. PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS. SECTIONAL SPECIFICATION.
4/19/1999 - PDF - English - AENOR
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€96.00

UNE-EN 62326-4-1:1999

PRINTED BOARDS. PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION. SECTION 1: CAPABILITY DETAIL SPECIFICATION - PERFORMANCE LEVELS A, B, AND C
3/24/1999 - PDF - Spanish - AENOR
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€109.00

UNE-EN 62326-4-1:1999

PRINTED BOARDS. PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION. SECTION 1: CAPABILITY DETAIL SPECIFICATION - PERFORMANCE LEVELS A, B, AND C
3/24/1999 - PDF - English - AENOR
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€130.80

DIN EN 61188-1-2:1999-03

Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements, controlled impedance (IEC 61188-1-2:1998), German version EN 61188-1-2:1998
3/1/1999 - PDF - German - DIN
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€99.35

IEC 61249-2-13:1999

IEC 61249-2-13:1999 Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad
2/26/1999 - PDF - English - IEC
Learn More

€92.00

IEC 61249-2-13:1999

IEC 61249-2-13:1999 Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad
2/26/1999 - PDF - English, French - IEC
Learn More

€92.00

IEC 61249-3-3:1999

IEC 61249-3-3:1999 Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
2/10/1999 - PDF - English, French - IEC
Learn More

€92.00

IEC 61249-3-4:1999

IEC 61249-3-4:1999 Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
2/10/1999 - PDF - English, French - IEC
Learn More

€92.00

IEC 61249-3-5:1999

IEC 61249-3-5:1999 Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
2/10/1999 - PDF - English, French - IEC
Learn More

€92.00

IEC 61249-3-5:1999

IEC 61249-3-5:1999 Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
2/10/1999 - PDF - English - IEC
Learn More

€92.00

IEC 61249-3-4:1999

IEC 61249-3-4:1999 Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
2/10/1999 - PDF - English - IEC
Learn More

€92.00

IEC 61249-3-3:1999

IEC 61249-3-3:1999 Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
2/10/1999 - PDF - English - IEC
Learn More

€92.00

IEC 61249-2-12:1999

IEC 61249-2-12:1999 Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
1/29/1999 - PDF - English, French - IEC
Learn More

€92.00

IEC 61249-2-12:1999

IEC 61249-2-12:1999 Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
1/29/1999 - PDF - English - IEC
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€92.00

BS EN 61188-1-2:1998

Printed boards and assemblies. Design use. Generic requirements requirements. Controlled impedance
12/15/1998 - PDF - English - BSI
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€293.00

BS EN 160101:1998

Harmonized system of quality assessment for electronic components. Blank detail specification: printed board assembly modular electronic units of assessed quality. Capability approval
12/15/1998 - PDF - English - BSI
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€180.00

NF EN 61188-1-1, C93-711 (12/1998)

Printed board and printed board assemblies. Design and use. Part 1-1 : generic requirements. Flatness considerations for electronic assemblies. - Cartes imprimées et cartes imprimées équipées
12/1/1998 - Paper - French - AFNOR
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€85.42

JIS C 6490:1998 (R2014)

Base materials for printed circuits - Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
10/20/1998 - PDF - Japanese - JSA
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€25.00

JIS C 6492:1998 (R2014)

Base materials for printed circuits - Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
10/20/1998 - PDF - Japanese - JSA
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€25.00

JIS C 6515:1998 (R2014)

Copper foil for printed wiring boards
10/20/1998 - PDF - Japanese - JSA
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€36.27

BS CECC 200025:1998

Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities
8/15/1998 - PDF - English - BSI
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€293.00

NF EN 62326-4, C93-708 (08/1998)

Printed boards. Part 4 : rigid multilayer printed boards with interlayer connections. Sectional specification. - Cartes imprimées
8/1/1998 - Paper - French - AFNOR
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€123.39

NF EN 61249-8-8, C93-748 (07/1998)

Materials for interconnection structures. Part 8 : sectional specification set for non-conductive films and coatings. . Section 8 : temporary polymer coatings. - Matériaux pour les structures d'interconnexion
7/1/1998 - Paper - French - AFNOR
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€88.00

UNE-EN 160100:1997

SECTIONAL SPECIFICATION: CAPABILITY APPROVAL OF MANUFACTURERS OF PRINTED BOARD ASSEMBLIES OF ASSESSED QUALITY. (Endorsed by AENOR in July of 1998.)
7/1/1998 - PDF - English - AENOR
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€106.00

BS CECC 23800-801:1998

Harmonized system of quality assessment for electronic components. Capability detail specification: flexible multilayer printed boards with through connections
6/15/1998 - PDF - English - BSI
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€250.00

BS CECC 23600-801:1998

Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections
6/15/1998 - PDF - English - BSI
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€250.00

BS CECC 23300-801:1998

Harmonized system of quality assessment for electronic components. Capability detail specification: multi-layer printed boards
6/15/1998 - PDF - English - BSI
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€293.00

BS CECC 23200-801:1998

Harmonized system of quality assessment for electronic components. Capability detail specification: single and double-sided printed boards with plated through holes
6/15/1998 - PDF - English - BSI
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€250.00

BS CECC 23100-801:1998

Harmonized system of quality assessment for electronic components. Capability detail specification: single and double-sided printed boards with plain holes
6/15/1998 - PDF - English - BSI
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€250.00

BS CECC 23700-801:1998

Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid double-sided printed boards with through connections
6/15/1998 - PDF - English - BSI
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€180.00

NF EN 60603-12, C93-430-12 (06/1998)

Connectors for frequencies below 3 MHz for use with printed boards. . Part 12 : detail specification for dimensions, general requirements and tests for à range of socket designed for use with integrated circuits.
6/1/1998 - Paper - French - AFNOR
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€103.00

NF EN 60603-13, C93-430-13 (06/1998)

Connectors for frequencies below 3 MHz for use with printed boards. . Part 13 : detail specification for two-part connectors of assessed quality, for printed boards for basic grid of 2,54 mm (0,1 in) , with free connectors for non accessible insulation displacement terminations (ID).
6/1/1998 - Paper - French - AFNOR
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€141.00

UNE-EN 123000/A2:1996

GENERIC SPECIFICATION: PRINTED BOARDS. (Endorsed by AENOR in June of 1998.)
6/1/1998 - PDF - English - AENOR
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€71.00

DIN EN 61188-1-1:1998-03

Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements; flatness considerations for electronic assemblies (IEC 61188-1-1:1997); German version EN 61188-1-1:1997
3/1/1998 - PDF - German - DIN
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€45.98

BS EN 160100:1998

Harmonized system of quality assessment for electronic components. Sectional specification: capability approval of manufacturers of printed board assemblies of assessed quality
2/15/1998 - PDF - English - BSI
Learn More

€293.00

DIN EN 61249-8-8:1998-01

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings; Section 8: Temporary polymer coatings (IEC 61249-8-8:1997); German version EN 61249-8-8:1997
1/1/1998 - PDF - German - DIN
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€59.63

BS EN 61249-8-8:1997

Materials for interconnection structures. Sectional specification set non-conductive films and coatings Temporary polymer
12/15/1997 - PDF - English - BSI
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€151.00

BS EN 61188-1-1:1997

Printed boards and assemblies. Design use. Generic requirements Flatness considerations for electronic assemblies
12/15/1997 - PDF - English - BSI
Learn More

€151.00

UNE-EN 61249-5-4:1997

MATERIALS FOR INTERCONNECTION STRUCTURES. PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH OR WITHOUT COATINGS. SECTION 4: CONDUCTIVE INKS.
11/5/1997 - PDF - Spanish - AENOR
Learn More

€60.00

UNE-EN 61249-5-4:1997

MATERIALS FOR INTERCONNECTION STRUCTURES. PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH OR WITHOUT COATINGS. SECTION 4: CONDUCTIVE INKS.
11/5/1997 - PDF - English - AENOR
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€72.00

NF EN 61249-5-4, C93-784 (11/1997)

Materials for interconnection structures. Part 5 : sectional specification set for conductive foils and films with or without coatings. Section 4 : conductive inks.
11/1/1997 - Paper - French - AFNOR
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€88.00

UNE-EN 61189-1:1997

TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES. PART 1: GENERAL TEST METHODS AND METHODOLOGY (Endorsed by AENOR in November of 1997.)
11/1/1997 - PDF - English - AENOR
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€65.00

UNE-EN 61182-7:1997

PRINTED BOARDS. ELECTRONIC DATA DESCRIPTION AND TRANSFER. PART 7: BARE BOARD ELECTRIC TEST INFORMATION IN DIGITAL FORM.
10/30/1997 - PDF - Spanish - AENOR
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€93.00

UNE-EN 61182-7:1997

PRINTED BOARDS. ELECTRONIC DATA DESCRIPTION AND TRANSFER. PART 7: BARE BOARD ELECTRIC TEST INFORMATION IN DIGITAL FORM.
10/30/1997 - PDF - English - AENOR
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€111.60

UNE-EN 60249-2-18:1997

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICTION Nº 18: BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
10/17/1997 - PDF - Spanish - AENOR
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€60.00

UNE-EN 60249-2-18:1997

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICTION Nº 18: BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
10/17/1997 - PDF - English - AENOR
Learn More

€72.00

UNE-EN 60249-2-19/A1:1997

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
10/17/1997 - PDF - Spanish - AENOR
Learn More

€25.00

UNE-EN 60249-2-19/A1:1997

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
10/17/1997 - PDF - English - AENOR
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€30.00

UNE-EN 60249-2-19/A2:1997

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
10/17/1997 - PDF - Spanish - AENOR
Learn More

€27.00

UNE-EN 60249-2-19/A2:1997

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
10/17/1997 - PDF - English - AENOR
Learn More

€32.40

UNE-EN 61249-7-1:1997

MATERIALS FOR INTERCONNECTION STRUCTURES. PART 7: SECTIONAL SPECIFICATION SET FOR RESTRAINING CORE MATERIALS. SECTION 1: COPPER/INVAR/COPPER.
10/17/1997 - PDF - Spanish - AENOR
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€46.00

UNE-EN 61249-7-1:1997

MATERIALS FOR INTERCONNECTION STRUCTURES. PART 7: SECTIONAL SPECIFICATION SET FOR RESTRAINING CORE MATERIALS. SECTION 1: COPPER/INVAR/COPPER.
10/17/1997 - PDF - English - AENOR
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€55.20

UNE-EN 61249-8-7:1997

MATERIALS FOR INTERCONNECTION STRUCTURES. PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS. SECTION 7: MARKING LEGEND INKS.
10/17/1997 - PDF - Spanish - AENOR
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€68.00

UNE-EN 61249-8-7:1997

MATERIALS FOR INTERCONNECTION STRUCTURES. PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS. SECTION 7: MARKING LEGEND INKS.
10/17/1997 - PDF - English - AENOR
Learn More

€81.60

BS EN 123000/Add:1997

Harmonized system of quality assessment for electronic components. Generic specification: printed boards
8/15/1997 - PDF - English - BSI
Learn More

€293.00

UNE-EN 60249-2-17:1997

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 17: THIN POLYIMIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARD.
8/11/1997 - PDF - Spanish - AENOR
Learn More

€58.00

UNE-EN 60249-2-17:1997

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 17: THIN POLYIMIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARD.
8/11/1997 - PDF - English - AENOR
Learn More

€69.60

UNE-EN 60249-2-19:1997

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
8/11/1997 - PDF - Spanish - AENOR
Learn More

€58.00

UNE-EN 60249-2-19:1997

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
8/11/1997 - PDF - English - AENOR
Learn More

€69.60

DIN EN 62326-4:1997-08

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections; sectional specification (IEC 62326-4:1996); German version EN 62326-4:1997
8/1/1997 - PDF - German - DIN
Learn More

€99.35

DIN EN 62326-4-1:1997-08

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections; sectional specification; section 1: Capability detail specification; performance levels A, B and C (IEC 62326-4-1:1996); German version EN 62326-4-1:1997
8/1/1997 - PDF - German - DIN
Learn More

€136.82

UNE-EN 60249-2-16:1997

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 16: POLYIMIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
7/15/1997 - PDF - Spanish - AENOR
Learn More

€63.00

UNE-EN 60249-2-16:1997

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 16: POLYIMIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
7/15/1997 - PDF - English - AENOR
Learn More

€75.60

UNE-EN 61249-5-1:1997

MATERIALS FOR INTERCONNECTION STRUCTURES. PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH AND WITHOUT COATINGS. SECTION 1: COPPER FOILS (FOR THE MANUFACTURE OF COPPER-CLAD BASE MATERIALS).
7/15/1997 - PDF - Spanish - AENOR
Learn More

€68.00

UNE-EN 61249-5-1:1997

MATERIALS FOR INTERCONNECTION STRUCTURES. PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH AND WITHOUT COATINGS. SECTION 1: COPPER FOILS (FOR THE MANUFACTURE OF COPPER-CLAD BASE MATERIALS).
7/15/1997 - PDF - English - AENOR
Learn More

€81.60

IEC 61249-8-8:1997

IEC 61249-8-8:1997 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
6/24/1997 - PDF - English, French - IEC
Learn More

€46.00

BS EN 62326-4:1997

Printed boards Rigid multilayer printed with interlayer connections. Sectional specification
6/15/1997 - PDF - English - BSI
Learn More

€293.00

BS EN 62326-4-1:1997

Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C
6/15/1997 - PDF - English - BSI
Learn More

€348.00

BS EN 61249-5-4:1997

Materials for interconnection structures. Sectional specification set conductive foils and films with without coatings Conductive inks
5/15/1997 - PDF - English - BSI
Learn More

€180.00

IEC 61189-1:1997

IEC 61189-1:1997 Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
3/27/1997 - PDF - English, French - IEC
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€132.00

BS EN 61249-8-7:1997

Materials for interconnection structures. Sectional specification set non-conductive films and coatings Marking legend inks
3/15/1997 - PDF - English - BSI
Learn More

€180.00

JIS C 6482:1997 (R2015)

Copper-clad laminates for printed wiring boards - Paper base, epoxy resin
2/20/1997 - PDF - Japanese - JSA
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€25.00

JIS C 6483:1997 (R2015)

Copper-clad laminates for printed wiring boards - Synthetic fiber fabric base, epoxy resin
2/20/1997 - PDF - Japanese - JSA
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€25.00

UNE-EN 60249-1:1997

BASE MATERIALS FOR PRINTED CIRCUITS. PART 1: TEST METHODS.
2/5/1997 - PDF - Spanish - AENOR
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€92.00

UNE-EN 60249-1:1997

BASE MATERIALS FOR PRINTED CIRCUITS. PART 1: TEST METHODS.
2/5/1997 - PDF - English - AENOR
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€110.40

UNE-EN 60249-1/A4:1997

BASE MATERIALS FOR PRINTED CIRCUITS. PART 1: TEST METHODS.
2/5/1997 - PDF - Spanish - AENOR
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€25.00

DIN EN 61249-5-4:1997-02

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings; section 4: Conductive inks (IEC 61249-5-4:1996); German version EN 61249-5-4:1996
2/1/1997 - PDF - German - DIN
Learn More

€52.90

DIN EN 61249-8-7:1997-02

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings; section 7: Marking legend inks (IEC 61249-8-7:1996); German version EN 61249-8-7:1996
2/1/1997 - PDF - German - DIN
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€65.89

ANSI/VITA 12:1997 (S2022)

M-Module
1/1/1997 - PDF - English - VITA
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€90.00

IEC 62326-4:1996

IEC 62326-4:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
12/19/1996 - PDF - English, French - IEC
Learn More

€270.00

IEC 62326-4-1:1996

IEC 62326-4-1:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
12/19/1996 - PDF - English, French - IEC
Learn More

€397.00

UNE-EN 60249-2-4:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº4: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE.
11/7/1996 - PDF - Spanish - AENOR
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€60.00

UNE-EN 60249-2-4:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº4: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE.
11/7/1996 - PDF - English - AENOR
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€72.00

UNE-EN 60249-2-4/A3:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº4: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE.
11/7/1996 - PDF - Spanish - AENOR
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€34.00

UNE-EN 60249-2-4/A3:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº4: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE.
11/7/1996 - PDF - English - AENOR
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€40.80

UNE-EN 60249-2-4/A4:1996

BASE MATERIAL FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 4: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE.
11/7/1996 - PDF - Spanish - AENOR
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€25.00

UNE-EN 60249-2-4/A4:1996

BASE MATERIAL FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 4: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE.
11/7/1996 - PDF - English - AENOR
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€30.00

UNE-EN 60249-2-3/A2:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 3: EPOXIDE CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
10/23/1996 - PDF - Spanish - AENOR
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€27.00

UNE-EN 60249-2-3/A3:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 3: EPOXIDE CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
10/23/1996 - PDF - Spanish - AENOR
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€25.00

UNE-EN 60249-2-3/A3:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 3: EPOXIDE CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
10/23/1996 - PDF - English - AENOR
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€30.00

UNE-EN 60249-2-8/A1:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM.
10/23/1996 - PDF - Spanish - AENOR
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€25.00

UNE-EN 60249-2-8/A1:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM.
10/23/1996 - PDF - English - AENOR
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€30.00

UNE-EN 60249-2-13/A1:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE.
10/16/1996 - PDF - Spanish - AENOR
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€25.00

UNE-EN 60249-2-13/A1:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE.
10/16/1996 - PDF - English - AENOR
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€30.00

UNE-EN 60249-2-1/A2:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICAION Nº1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, HIGH ELECTRICAL QUALITY.
10/14/1996 - PDF - Spanish - AENOR
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€27.00

UNE-EN 60249-2-2:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY.
10/14/1996 - PDF - Spanish - AENOR
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€60.00

UNE-EN 60249-2-2:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY.
10/14/1996 - PDF - English - AENOR
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€72.00

UNE-EN 60249-2-2/A3:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY.
10/14/1996 - PDF - Spanish - AENOR
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€34.00

UNE-EN 60249-2-2/A3:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY.
10/14/1996 - PDF - English - AENOR
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€40.80

UNE-EN 60249-2-2/A4:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY.
10/14/1996 - PDF - Spanish - AENOR
Learn More

€25.00

UNE-EN 60249-2-2/A4:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY.
10/14/1996 - PDF - English - AENOR
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€30.00

UNE-EN 60249-2-15/A1:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY.
10/14/1996 - PDF - Spanish - AENOR
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€25.00

UNE-EN 60249-2-15/A1:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY.
10/14/1996 - PDF - English - AENOR
Learn More

€30.00

UNE-EN 60249-2-1/A3:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, HIGH ELECTRICAL QUALITY.
10/9/1996 - PDF - Spanish - AENOR
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€25.00

UNE-EN 60249-2-1/A3:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, HIGH ELECTRICAL QUALITY.
10/9/1996 - PDF - English - AENOR
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€30.00

BS EN 61249-5-1:1996

Materials for interconnection structures. Sectional specification set conductive foils and films with without coatings Copper (for the manufacture of copper-clad base materials)
9/15/1996 - PDF - English - BSI
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€180.00

NF EN 61249-7-1, C93-771 (09/1996)

Materials for interconnection structures. Part 7 : sectional specification set for restraining core materials. Section 1 : copper/invar/coper.
9/1/1996 - Paper - French - AFNOR
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€72.00

BS EN 61249-7-1:1996

Materials for interconnection structures. Sectional specification set restraining core materials Copper/invar/copper
8/15/1996 - PDF - English - BSI
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€151.00

UNE-EN 60249-2-1:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, HIGH ELECTRICAL QUALITY.
7/24/1996 - PDF - Spanish - AENOR
Learn More

€60.00

UNE-EN 60249-2-3:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 3: EPOXIDE CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
7/24/1996 - PDF - Spanish - AENOR
Learn More

€60.00

UNE-EN 60249-2-6:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 6: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (HORIZONTAL BURNING TEST).
7/24/1996 - PDF - Spanish - AENOR
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€60.00

UNE-EN 60249-2-7:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 7: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
7/24/1996 - PDF - Spanish - AENOR
Learn More

€60.00

UNE-EN 60249-2-8:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM.
7/24/1996 - PDF - Spanish - AENOR
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€53.00

UNE-EN 60249-2-8:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM.
7/24/1996 - PDF - English - AENOR
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€63.60

UNE-EN 60249-2-9:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 9: EPOXIDE CELLULOSE PAPER CORE, EPOXIDE GLASS CLOTH SURFACE COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
7/24/1996 - PDF - Spanish - AENOR
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€60.00

UNE-EN 60249-2-9:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 9: EPOXIDE CELLULOSE PAPER CORE, EPOXIDE GLASS CLOTH SURFACE COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
7/24/1996 - PDF - English - AENOR
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€72.00

UNE-EN 60249-2-10:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 10: EPOXIDE NON-WOVEN/WOVEN GLASS REINFORCED COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILIY (VERTICAL BURNING TEST).
7/24/1996 - PDF - Spanish - AENOR
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€60.00

UNE-EN 60249-2-11:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 11: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
7/24/1996 - PDF - Spanish - AENOR
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€57.00

UNE-EN 60249-2-12:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 12: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
7/24/1996 - PDF - Spanish - AENOR
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€57.00

UNE-EN 60249-2-13:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE.
7/24/1996 - PDF - Spanish - AENOR
Learn More

€58.00

UNE-EN 60249-2-13:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE.
7/24/1996 - PDF - English - AENOR
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€69.60

UNE-EN 60249-2-14:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 14: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), ECONOMIC QUALITY.
7/24/1996 - PDF - Spanish - AENOR
Learn More

€60.00

UNE-EN 60249-2-14:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 14: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), ECONOMIC QUALITY.
7/24/1996 - PDF - English - AENOR
Learn More

€72.00

UNE-EN 60249-2-15:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY.
7/24/1996 - PDF - Spanish - AENOR
Learn More

€58.00

UNE-EN 60249-2-15:1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY.
7/24/1996 - PDF - English - AENOR
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€69.60

IPC 6011:1996

Generic Performance Specification for Printed Boards
7/1/1996 - PDF sécurisé - English - IPC
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€104.00

IEC 61249-5-4:1996

IEC 61249-5-4:1996 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
6/18/1996 - PDF - English, French - IEC
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€92.00

DIN EN 61249-5-1:1996-06

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings; section 1: Copper foils (for the manufacturer of copper-clad base materials) (IEC 61249-5-1:1995); German version EN 61249-5-1:1996
6/1/1996 - PDF - German - DIN
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€52.90

UNE-EN 123000:1991

GENERIC SPECIFICATION: PRINTED BOARDS. (Endorsed by AENOR in June of 1996.)
6/1/1996 - PDF - English - AENOR
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€70.00

UNE-EN 123000/A1:1995

GENERIC SPECIFICATION: PRINTED BOARDS. (Endorsed by AENOR in June of 1996.)
6/1/1996 - PDF - English - AENOR
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€15.00

IEC 61249-8-7:1996

IEC 61249-8-7:1996 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
4/26/1996 - PDF - English, French - IEC
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€92.00

BS CECC 23100-003:1996

Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plain holes
4/15/1996 - PDF - English - BSI
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€250.00

BS CECC 23200-003:1996

Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plated through holes
4/15/1996 - PDF - English - BSI
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€250.00

BS CECC 23300-003:1996

Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards
4/15/1996 - PDF - English - BSI
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€293.00

DIN EN 61249-7-1:1996-01

Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials; section 1: Copper/Invar/copper (IEC 61249-7-1:1995); German version EN 61249-7-1:1995
1/1/1996 - PDF - German - DIN
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€39.35

JIS C 5013:1996 (R2015)

Single and double sided printed wiring boards
1/1/1996 - PDF - Japanese - JSA
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€25.00

JIS C 6481:1996 (R2015)

Test methods of copper-clad laminates for printed wiring boards
1/1/1996 - PDF - Japanese - JSA
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€25.00

JIS C 6521:1996 (R2015)

Test methods of prepreg for multilayer printed wiring boards
1/1/1996 - PDF - Japanese - JSA
Learn More

€25.00

JIS C 6522:1996 (R2015)

Prepreg for multilayer printed wiring boards - Epoxy resin-impregnated glass cloth
1/1/1996 - PDF - Japanese - JSA
Learn More

€25.00

IEC 61249-5-1:1995

IEC 61249-5-1:1995 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
11/28/1995 - PDF - English, French - IEC
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€132.00

UTE C93-720, C93-720U (09/1995)

Electronic components. Inspection of printed boards for microwave applications. - Composants électroniques - Cartes imprimées
9/1/1995 - Paper - French - AFNOR
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€88.33

IPC D-325A:1995

Documentation Requirements for Printed Boards
5/1/1995 - PDF sécurisé - English - IPC
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€152.00

IEC 61249-7-1:1995

IEC 61249-7-1:1995 Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper
4/26/1995 - PDF - English, French - IEC
Learn More

€23.00

JIS C 6471:1995 (R2014)

Test methods of copper-clad laminates for flexible printed wiring boards
3/1/1995 - PDF - Japanese - JSA
Learn More

€25.00

JIS C 6472:1995 (R2014)

Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film)
3/1/1995 - PDF - Japanese - JSA
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€25.00

JIS C 6523:1995 (R2015)

Prepreg for multilayer printed wiring boards - Modified or unmodified polyimide resin-impregnated glass cloth
3/1/1995 - PDF - Japanese - JSA
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€25.00

JIS C 6524:1995 (R2015)

Prepreg for multilayer printed wiring boards - Bismaleimide/Triazine/Epoxide resin-impregnated glass cloth
3/1/1995 - PDF - Japanese - JSA
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€25.00

IPC CA-821:1995

General Requirements for Thermally Conductive Adhesives
1/1/1995 - PDF sécurisé - English - IPC
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€108.00

DIN IEC 60249-3-3:1994-06

Base materials for printed circuits; part 3: special materials; specification No. 3: permanent polymer coating materials (solder-resist) for use in the fabrication of printed boards; identical with IEC 60249-3-3:1991
6/1/1994 - PDF - German - DIN
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€59.63