31.180 : Printed circuits and boards
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UNE-EN 61189-5-2:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (Endorsed by AENOR in April of 2015.)
4/1/2015 - PDF - English -
Learn More€80.00 -
UNE-EN 61189-5-4:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (Endorsed by AENOR in April of 2015.)
4/1/2015 - PDF - English -
Learn More€70.00 -
IEC TS 62878-2-1:2015
IEC TS 62878-2-1:2015 Device embedded substrate - Part 2-1: Guidelines - General description of technology
3/30/2015 - PDF - English, French -
Learn More€219.00 -
IEC TS 62878-2-3:2015
IEC TS 62878-2-3:2015 Device embedded substrate - Part 2-3: Guidelines - Design guide
3/27/2015 - PDF - English, French -
Learn More€173.00 -
IEC TS 62878-2-4:2015
IEC TS 62878-2-4:2015 Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
3/27/2015 - PDF - English, French -
Learn More€270.00 -
IEC 60050-541:1990/AMD1:2015
IEC 60050-541:1990/AMD1:2015 Amendment 1 - International Electrotechnical Vocabulary (IEV) - Part 541: Printed circuits
2/25/2015 - PDF - English, French -
Learn More€12.00 -
IEC 61189-5-3:2015
IEC 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
1/8/2015 - PDF - English, French -
Learn More€270.00 -
IEC 61189-5-4:2015
IEC 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
1/8/2015 - PDF - English, French -
Learn More€173.00 -
IEC 61189-5-2:2015
IEC 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
1/8/2015 - PDF - English, French -
Learn More€311.00 -
IEEE 1687:2014
IEEE Standard for Access and Control of Instrumentation Embedded within a Semiconductor Device
12/5/2014 - Paper - English -
Learn More€337.00 -
IEEE 1687:2014
IEEE Standard for Access and Control of Instrumentation Embedded within a Semiconductor Device
12/5/2014 - PDF - English -
Learn More€269.00 -
PD IEC/PAS 61182-12:2014
Generic requirements for printed board assembly products manufacturing description data and transfer methodology
10/31/2014 - PDF - English -
Learn More€449.00 -
UNE-EN 60947-4-3:2014
Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads
10/15/2014 - PDF - English -
Learn More€151.20 -
UNE-EN 60947-4-3:2014
Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads
10/15/2014 - PDF - Spanish -
Learn More€126.00 -
JIS C 61188-7:2014
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
9/22/2014 - PDF - Japanese -
Learn More€25.00 -
NF EN 123400/A2, C93-123-400/A2 (09/2014)
Sectional specification : flexible printed boards without through connections
9/1/2014 - Paper - French -
Learn More€54.67 -
BS EN 60947-4-3:2014
Low-voltage switchgear and controlgear Contactors motor-starters. AC semiconductor controllers contactors for non-motor loads
7/31/2014 - PDF - English -
Learn More€377.00 -
DIN EN 61249-4-18:2014-07
Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-18:2013), German version EN 61249-4-18:2013
7/1/2014 - PDF - German -
Learn More€85.79 -
DIN EN 61249-4-19:2014-07
Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-19:2013), German version EN 61249-4-19:2013
7/1/2014 - PDF - German -
Learn More€85.79 -
PD IEC/PAS 61249-8-5:2014
Qualification and performance specification of permanent solder mask and flexible cover materials
6/30/2014 - PDF - English -
Learn More€250.00 -
PD IEC/PAS 61249-8-1:2014
Qualification and performance of electrical insulating compound for printed wiring assemblies
6/30/2014 - PDF - English -
Learn More€250.00 -
JIS Z 3284-2:2014
Solder paste - Part 2: Test methods for solder particle shape, surface condition judgment, and particle size distribution
6/20/2014 - PDF - Japanese -
Learn More€25.00 -
JIS Z 3284-3:2014
Solder paste - Part 3: Test methods for printability, viscosity, slump and tackiness
6/20/2014 - PDF - Japanese -
Learn More€25.00 -
JIS Z 3198-1:2014
Test methods for lead-free solders - Part 1: Methods for measuring of melting temperature ranges
6/20/2014 - PDF - Japanese -
Learn More€25.00 -
JIS Z 3284-4:2014
Solder paste - Part 4: Test methods for wettability, solderball and spread
6/20/2014 - PDF - Japanese -
Learn More€36.27 -
PD IEC/TR 62866:2014
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
5/7/2014 - PDF - English -
Learn More€377.00 -
IEC TR 62866:2014
IEC TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
5/7/2014 - PDF - English, French -
Learn More€431.00 -
BS EN 61249-4-18:2013
Materials for printed boards and other interconnecting structures Sectional specification set prepreg materials, unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass defined flammability (vertical burning test) lead-free assembly
2/28/2014 - PDF - English -
Learn More€180.00 -
BS EN 61249-4-19:2013
Materials for printed boards and other interconnecting structures Sectional specification set prepreg materials, unclad (for the manufacture of multilayer boards). High performance non-halogenated epoxide woven E-glass defined flammability (vertical burning test) lead-free assembly
2/28/2014 - PDF - English -
Learn More€180.00 -
UNE-EN 61249-4-18:2013
Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (Endorsed by AENOR in February of 2014.)
2/1/2014 - PDF - English -
Learn More€62.00 -
NF EN 61249-4-17, C93-780-4-17 (02/2014)
Materials for printed boards and other interconnecting structures - Part 4-17 : sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
2/1/2014 - Paper - French -
Learn More€88.33 -
UNE-EN 61249-4-19:2013
Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Hich performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (Endorsed by AENOR in February of 2014.)
2/1/2014 - PDF - English -
Learn More€62.00 -
NF EN 61249-4-16, C93-780-4-16 (02/2014)
Materials for printed boards and other interconnecting structures - Part 4-16 : sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
2/1/2014 - Paper - French -
Learn More€88.33 -
DIN EN 61189-11:2014-02
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (IEC 61189-11:2013), German version EN 61189-11:2013
2/1/2014 - PDF - German -
Learn More€92.62 -
NF EN 61249-4-15, C93-780-4-15 (02/2014)
Materials for printed boards and other interconnecting structures - Part 4-15 : sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
2/1/2014 - Paper - French -
Learn More€72.00 -
IEC 61249-4-19:2013
IEC 61249-4-19:2013 Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
11/4/2013 - PDF - English, French -
Learn More€92.00 -
IEC 61249-4-18:2013
IEC 61249-4-18:2013 Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
11/4/2013 - PDF - English, French -
Learn More€92.00 -
DIN EN 61193-3:2013-11
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing (IEC 61193-3:2013), German version EN 61193-3:2013
11/1/2013 - PDF - German -
Learn More€163.74 -
NF EN 61189-11, C93-731 (11/2013)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11 : measurement of melting temperature or melting temperature ranges of solder alloys
11/1/2013 - Paper - French -
Learn More€88.33 -
UNE-EN 62496-2-4:2013
Optical circuit boards - Basic test and measurement procedures - Part 2-4: Optical transmission test for optical circuit boards without input/output fibres (Endorsed by AENOR in November of 2013.)
11/1/2013 - PDF - English -
Learn More€66.00 -
IPC HDBK-830A:2013
Guidelines for Design, Selection and Application of Conformal Coatings
10/7/2013 - Paper - English -
Learn More€255.00 -
IPC HDBK-830A:2013
Guidelines for Design, Selection and Application of Conformal Coatings
10/7/2013 - PDF sécurisé - English -
Learn More€195.00 -
DIN EN 61249-2-30:2013-09
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad (IEC 61249-2-30:2012), German version EN 61249-2-30:2013
9/1/2013 - PDF - German -
Learn More€99.35 -
DIN EN 61249-2-39:2013-09
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-39:2012), German version EN 61249-2-39:2013
9/1/2013 - PDF - German -
Learn More€104.95 -
DIN EN 61249-2-27:2013-09
Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-27:2012), German version EN 61249-2-27:2013
9/1/2013 - PDF - German -
Learn More€99.35 -
DIN EN 61249-2-40:2013-09
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-40:2012), German version EN 61249-2-40:2013
9/1/2013 - PDF - German -
Learn More€104.95 -
DIN EN 61182-2-2:2013-08
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description (IEC 61182-2-2:2012), German version EN 61182-2-2:2012
8/1/2013 - PDF - German -
Learn More€141.96 -
UNE-EN 61189-11:2013
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (Endorsed by AENOR in August of 2013.)
8/1/2013 - PDF - English -
Learn More€62.00 -
NF EN 61249-2-30, C93-780-2-30 (08/2013)
Materials for printed boards and other interconnecting structures - Part 2-30 : reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
8/1/2013 - Paper - French -
Learn More€103.33 -
NF EN 61249-2-27, C93-780-2-27 (08/2013)
Materials for printed boards and other interconnecting structures - Part 2-27 : reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
8/1/2013 - Paper - French -
Learn More€103.33 -
BS EN 61189-11:2013
Test methods for electrical materials, printed boards and other interconnection structures assemblies Measurement of melting temperature or ranges solder alloys
7/31/2013 - PDF - English -
Learn More€180.00 -
IEC 61189-11:2013
IEC 61189-11:2013 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
5/7/2013 - PDF - English, French -
Learn More€92.00 -
UNE-EN 61249-2-39:2013
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in May of 2013.)
5/1/2013 - PDF - English -
Learn More€69.00 -
UNE-EN 61249-2-27:2013
Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad (Endorsed by AENOR in May of 2013.)
5/1/2013 - PDF - English -
Learn More€66.00 -
UNE-EN 61249-2-40:2013
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in May of 2013.)
5/1/2013 - PDF - English -
Learn More€69.00 -
UNE-EN 61249-2-30:2013
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad (Endorsed by AENOR in May of 2013.)
5/1/2013 - PDF - English -
Learn More€66.00 -
BS EN 61249-2-30:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
4/30/2013 - PDF - English -
Learn More€250.00 -
BS EN 61249-2-40:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly
4/30/2013 - PDF - English -
Learn More€250.00 -
BS EN 61249-2-39:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. High performance epoxide non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly
4/30/2013 - PDF - English -
Learn More€250.00 -
BS EN 61249-2-27:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
4/30/2013 - PDF - English -
Learn More€250.00 -
IPC 4556:2013
Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
2/5/2013 - PDF sécurisé - English -
Learn More€195.00 -
IEC 61249-2-39:2012
IEC 61249-2-39:2012 Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
11/29/2012 - PDF - English, French -
Learn More€173.00 -
IEC 61249-2-40:2012
IEC 61249-2-40:2012 Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials, clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
11/29/2012 - PDF - English, French -
Learn More€173.00 -
IEC 61249-2-27:2012
IEC 61249-2-27:2012 Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
11/29/2012 - PDF - English, French -
Learn More€173.00 -
IEC 61249-2-30:2012
IEC 61249-2-30:2012 Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
11/29/2012 - PDF - English, French -
Learn More€173.00 -
BS EN 61754-20-100:2012
Fibre optic interconnecting devices and passive components. connector interfaces Interface standard for LC connectors with protective housings related to IEC 61076-3-106
9/30/2012 - PDF - English -
Learn More€250.00 -
BS EN 61182-2-2:2012
Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed fabrication
8/31/2012 - PDF - English -
Learn More€331.00 -
€64.10
-
€93.00 -
UNE-EN 62496-2-1:2011
Optical circuit boards - Part 2-1: Measurements - Optical attenuation and isolation (Endorsed by AENOR in January of 2012.)
1/1/2012 - PDF - English -
Learn More€74.00 -
JIS C 61191-6:2011 (R2016)
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
12/20/2011 - PDF - Japanese -
Learn More€41.86 -
BS EN 61290-4-2:2011
Optical amplifiers. Test methods Gain transient parameters. Broadband source method
10/31/2011 - PDF - English -
Learn More€250.00 -
BS EN 62129-2:2011
Calibration of wavelength/optical frequency measurement instruments Michelson interferometer single wavelength meters
7/31/2011 - PDF - English -
Learn More€348.00 -
UNE-EN 62496-2-2:2011
Optical circuit boards - Test and measurement procedures -- Part 2-2: Measurements: Dimensions of optical circuit boards (Endorsed by AENOR in July of 2011.)
7/1/2011 - PDF - English -
Learn More€70.00 -
UNE-EN 62496-4:2011
Optical circuit boards - Interface standards - Part 4: General and guidance (Endorsed by AENOR in July of 2011.)
7/1/2011 - PDF - English -
Learn More€72.00 -
UNE-EN 62496-3:2011
Optical circuit boards -- Part 3: Performance standards - General and guidance (Endorsed by AENOR in June of 2011.)
6/1/2011 - PDF - English -
Learn More€57.00 -
BS EN 62496-4:2011
Optical circuit boards Interface standards. General and guidance
3/31/2011 - PDF - English -
Learn More€293.00 -
BS EN 62496-3:2011
Optical circuit boards Performance standards. General and guidance
3/31/2011 - PDF - English -
Learn More€180.00 -
DIN EN 61191-6:2011-01
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (IEC 61191-6:2010), German version EN 61191-6:2010
1/1/2011 - PDF - German -
Learn More€141.96 -
DIN EN 61249-2-41:2010-12
Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-41:2010), German version EN 61249-2-41:2010
12/1/2010 - PDF - German -
Learn More€99.35 -
DIN EN 61249-2-42:2010-12
Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-42:2010), German version EN 61249-2-42:2010
12/1/2010 - PDF - German -
Learn More€99.35 -
DD IEC/PAS 62326-14:2010
Printed boards Device embedded substrate. Terminology / reliability design guide
11/30/2010 - PDF - English -
Learn More€348.00 -
UNE-EN 61249-2-41:2010
Materials for printed boards and other interconnecting structures -- Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in September of 2010.)
9/1/2010 - PDF - English -
Learn More€66.00 -
UNE-EN 61249-2-42:2010
Materials for printed boards and other interconnecting structures -- Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in September of 2010.)
9/1/2010 - PDF - English -
Learn More€66.00 -
UNE-EN 61191-6:2010
Printed board assemblies -- Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (Endorsed by AENOR in August of 2010.)
8/1/2010 - PDF - English -
Learn More€76.00 -
NF EN 61249-2-42, C93-780-2-42 (07/2010)
Materials for printed boards and other interconnecting structures - Part 2-42 : reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
7/1/2010 - Paper - French -
Learn More€103.33 -
NF EN 61249-2-41, C93-780-2-41 (07/2010)
Materials for printed boards and other interconnecting structures - Part 2-41 : reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
7/1/2010 - Paper - French -
Learn More€103.33 -
BS EN 62496-3-1:2010
Optical circuit boards. Performance standard Flexible optical boards using unconnectorized glass fibres
6/30/2010 - PDF - English -
Learn More€180.00 -
BS EN 61249-2-41:2010
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly
6/30/2010 - PDF - English -
Learn More€250.00 -
BS EN 61249-2-42:2010
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly
6/30/2010 - PDF - English -
Learn More€250.00 -
UNE-EN 62496-3-1:2010
Optical circuit boards - Performance standard -- Part 3-1: Flexible optical circuit boards using unconnectorized optical glass fibres (Endorsed by AENOR in June of 2010.)
6/1/2010 - PDF - English -
Learn More€60.00 -
BS EN 61191-6:2010
Printed board assemblies Evaluation criteria for voids in soldered joints of BGA and LGA measurement methods
5/31/2010 - PDF - English -
Learn More€293.00 -
JIS C 5005-2:2010 (R2015)
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
5/20/2010 - PDF - Japanese -
Learn More€25.00 -
IEC 61249-2-41:2010
IEC 61249-2-41:2010 Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
4/21/2010 - PDF - English, French -
Learn More€173.00 -
IEC 61249-2-42:2010
IEC 61249-2-42:2010 Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
4/21/2010 - PDF - English, French -
Learn More€173.00 -
IEC 61191-6:2010
IEC 61191-6:2010 Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
1/14/2010 - PDF - English, French -
Learn More€270.00 -
UNE-EN 61249-4-15:2009
Materials for printed boards and other interconnecting structures -- Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (Endorsed by AENOR in December of 2009.)
12/1/2009 - PDF - English -
Learn More€60.00 -
DIN EN 61249-4-15:2009-12
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-15:2009), German version EN 61249-4-15:2009
12/1/2009 - PDF - German -
Learn More€85.79 -
DIN EN 61249-4-14:2009-12
Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-14:2009), German version EN 61249-4-14:2009
12/1/2009 - PDF - German -
Learn More€85.79 -
UNE-EN 61249-4-16:2009
Materials for printed boards and other interconnecting structures -- Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (Endorsed by AENOR in December of 2009.)
12/1/2009 - PDF - English -
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DIN EN 61249-4-17:2009-12
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-17:2009), German version EN 61249-4-17:2009
12/1/2009 - PDF - German -
Learn More€85.79 -
UNE-EN 61249-4-14:2009
Materials for printed boards and other interconnecting structures -- Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (Endorsed by AENOR in December of 2009.)
12/1/2009 - PDF - English -
Learn More€60.00 -
DIN EN 61249-4-16:2009-12
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-16:2009), German version EN 61249-4-16:2009
12/1/2009 - PDF - German -
Learn More€85.79 -
UNE-EN 61249-4-17:2009
Materials for printed boards and other interconnecting structures -- Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (Endorsed by AENOR in December of 2009.)
12/1/2009 - PDF - English -
Learn More€60.00 -
BS EN 61249-4-14:2009
Materials for printed boards and other interconnecting structures Sectional specification set prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass defined flammability (vertical burning test) lead-free assembly
10/31/2009 - PDF - English -
Learn More€180.00 -
BS EN 61249-4-17:2009
Materials for printed boards and other interconnecting structures Sectional specification set prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass defined flammability (vertical burning test) lead-free assembly
10/31/2009 - PDF - English -
Learn More€180.00 -
BS EN 61249-4-15:2009
Materials for printed boards and other interconnecting structures Sectional specification set prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional epoxide woven E-glass defined flammability (vertical burning test) lead-free assembly
10/31/2009 - PDF - English -
Learn More€180.00 -
BS EN 61249-4-16:2009
Materials for printed boards and other interconnecting structures Sectional specification set prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional non-halogenated epoxide woven E-glass defined flammability (vertical burning test) lead-free assembly
10/31/2009 - PDF - English -
Learn More€180.00 -
IPC 2152:2009
Standard for Determining Current Carrying Capacity in Printed Board Design
9/16/2009 - PDF sécurisé - English -
Learn More€195.00 -
IEC 62496-3-1:2009
IEC 62496-3-1:2009 Optical circuit boards - Part 3-1: Performance standards - Flexible optical circuit boards using unconnectorized optical glass fibres
8/18/2009 - PDF - English -
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IEC 62496-3-1:2009
IEC 62496-3-1:2009 Optical circuit boards - Part 3-1: Performance standards - Flexible optical circuit boards using unconnectorized optical glass fibres
8/18/2009 - PDF - English, French -
Learn More€92.00 -
NF EN 61249-2-38, C93-780-2-38 (08/2009)
Materials for printed boards and other interconnecting structures - Part 2-38 : reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
8/1/2009 - Paper - French -
Learn More€103.33 -
€250.00 -
DIN EN 61249-2-35:2009-07
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-35:2008), German version EN 61249-2-35:2009
7/1/2009 - PDF - German -
Learn More€104.95 -
UNE-EN 62496-1:2009
Optical circuit boards -- Part 1: General standard (Endorsed by AENOR in July of 2009.)
7/1/2009 - PDF - English -
Learn More€68.00 -
DIN EN 61249-2-37:2009-07
Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-37:2008), German version EN 61249-2-37:2009
7/1/2009 - PDF - German -
Learn More€104.95 -
NF EN 61249-2-37, C93-780-2-37 (07/2009)
Materials for printed boards and other interconnecting structures - Part 2-37 : reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
7/1/2009 - Paper - French -
Learn More€103.33 -
DIN EN 61249-2-36:2009-07
Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-36:2008), German version EN 61249-2-36:2009
7/1/2009 - PDF - German -
Learn More€104.95 -
DIN EN 61249-2-38:2009-07
Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-38:2008), German version EN 61249-2-38:2009
7/1/2009 - PDF - German -
Learn More€104.95 -
BS EN 61249-2-38:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad. Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly
6/30/2009 - PDF - English -
Learn More€250.00 -
BS EN 61249-2-36:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad. Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly
6/30/2009 - PDF - English -
Learn More€250.00 -
UNE-EN 61249-2-37:2009
Materials for printed boards and other interconnecting structures -- Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in June of 2009.)
6/1/2009 - PDF - English -
Learn More€68.00 -
UNE-EN 61249-2-38:2009
Materials for printed boards and other interconnecting structures -- Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in June of 2009.)
6/1/2009 - PDF - English -
Learn More€68.00 -
UNE-EN 61249-2-36:2009
Materials for printed boards and other interconnecting structures -- Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in June of 2009.)
6/1/2009 - PDF - English -
Learn More€68.00 -
UNE-EN 61249-2-35:2009
Materials for printed boards and other interconnecting structures -- Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in June of 2009.)
6/1/2009 - PDF - English -
Learn More€68.00 -
IEC 61249-4-15:2009
IEC 61249-4-15:2009 Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
5/26/2009 - PDF - English -
Learn More€92.00 -
IEC 61249-4-16:2009
IEC 61249-4-16:2009 Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
5/26/2009 - PDF - English, French -
Learn More€92.00 -
IEC 61249-4-16:2009
IEC 61249-4-16:2009 Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
5/26/2009 - PDF - English -
Learn More€92.00 -
IEC 61249-4-15:2009
IEC 61249-4-15:2009 Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
5/26/2009 - PDF - English, French -
Learn More€92.00 -
IEC 61249-4-14:2009
IEC 61249-4-14:2009 Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
5/26/2009 - PDF - English -
Learn More€92.00 -
IEC 61249-4-17:2009
IEC 61249-4-17:2009 Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
5/26/2009 - PDF - English -
Learn More€92.00 -
IEC 61249-4-14:2009
IEC 61249-4-14:2009 Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
5/26/2009 - PDF - English, French -
Learn More€92.00 -
IEC 61249-4-17:2009
IEC 61249-4-17:2009 Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
5/26/2009 - PDF - English, French -
Learn More€92.00 -
BS EN 61249-2-37:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad. Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly
4/30/2009 - PDF - English -
Learn More€250.00 -
BS EN 61249-2-35:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad. Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly
4/30/2009 - PDF - English -
Learn More€250.00 -
BS EN 61189-5:2006
Test methods for electrical materials, interconnection structures and assemblies printed board
2/28/2009 - PDF - English -
Learn More€348.00 -
IEC 61249-2-31:2009
IEC 61249-2-31:2009 Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad
2/11/2009 - PDF - English, French -
Learn More€173.00 -
IEC 61249-2-34:2009
IEC 61249-2-34:2009 Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
2/11/2009 - PDF - English, French -
Learn More€173.00 -
IEC 61249-2-33:2009
IEC 61249-2-33:2009 Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad
2/11/2009 - PDF - English, French -
Learn More€173.00 -
IEC 61249-2-32:2009
IEC 61249-2-32:2009 Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
2/11/2009 - PDF - English, French -
Learn More€173.00 -
ASTM B885-09(2020)
Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
1/1/2009 - PDF - English -
Learn More€48.00 -
ASTM B885-09(2020) + Redline
Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
1/1/2009 - PDF - English -
Learn More€57.00 -
IEC 62496-1:2008
IEC 62496-1:2008 Optical circuit boards - Part 1: General
12/9/2008 - PDF - English, French -
Learn More€173.00 -
IEC 61249-2-35:2008
IEC 61249-2-35:2008 Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
11/27/2008 - PDF - English, French -
Learn More€173.00 -
IEC 61249-2-38:2008
IEC 61249-2-38:2008 Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
11/27/2008 - PDF - English, French -
Learn More€173.00 -
IEC 61249-2-36:2008
IEC 61249-2-36:2008 Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
11/27/2008 - PDF - English, French -
Learn More€173.00 -
IEC 61249-2-37:2008
IEC 61249-2-37:2008 Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
11/27/2008 - PDF - English, French -
Learn More€173.00 -
DIN EN 61249-4-1:2008-10
Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (IEC 61249-4-1:2008), German version EN 61249-4-1:2008
10/1/2008 - PDF - German -
Learn More€79.72 -
UNE-EN 61249-4-1:2008
Materials for interconnecting structures -- Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability. (Endorsed by AENOR in September of 2008.)
9/1/2008 - PDF - English -
Learn More€58.00 -
JIS C 6485:2008 (R2017)
Base materials for printed circuits - Paper base, phenolic resin
8/20/2008 - PDF - Japanese -
Learn More€25.00 -
DIN EN 61193-2:2008-08
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages (IEC 61193-2:2007); German version EN 61193-2:2007
8/1/2008 - PDF - German -
Learn More€92.62 -
BS EN 61249-4-1:2008
Materials for printed boards and other interconnecting structures Sectional specification set prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass defined flammability
7/31/2008 - PDF - English -
Learn More€180.00 -
BS EN 60079-27:2008
Explosive atmospheres Fieldbus intrinsically safe concept (FISCO)
7/31/2008 - PDF - English -
Learn More€180.00 -
DIN EN 61188-5-5:2008-07
Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides (IEC 61188-5-5:2007); German version EN 61188-5-5:2007
7/1/2008 - PDF - German -
Learn More€136.82 -
DIN EN 61188-5-3:2008-07
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides (IEC 61188-5-3:2007); German version EN 61188-5-3:2007
7/1/2008 - PDF - German -
Learn More€110.00 -
DIN EN 61188-5-4:2008-07
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides (IEC 61188-5-4:2007); German version EN 61188-5-4:2007
7/1/2008 - PDF - German -
Learn More€92.62 -
UNE-EN 61188-5-8:2008
Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (Endorsed by AENOR in July of 2008.)
7/1/2008 - PDF - English -
Learn More€72.00 -
DIN EN 61188-5-8:2008-07
Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (IEC 61188-5-8:2007); German version EN 61188-5-8:2008
7/1/2008 - PDF - German -
Learn More€110.00 -
DIN EN 61189-3:2008-06
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:2007); German version EN 61189-3:2008
6/1/2008 - PDF - German -
Learn More€272.06 -
BS EN 61188-5-8:2008
Printed boards and printed board assemblies. Design use Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)
5/30/2008 - PDF - English -
Learn More€293.00 -
UNE-EN 61189-3:2008
Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards) (Endorsed by AENOR in May of 2008.)
5/1/2008 - PDF - English -
Learn More€146.00 -
BS EN 61189-3:2008
Test methods for electrical materials, printed boards and other interconnection structures assemblies (printed boards)
3/31/2008 - PDF - English -
Learn More€430.00 -
UNE-EN 61188-5-5:2007
Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides (Endorsed by AENOR in March of 2008.)
3/1/2008 - PDF - English -
Learn More€78.00 -
UNE-EN 61188-5-3:2007
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides (Endorsed by AENOR in March of 2008.)
3/1/2008 - PDF - English -
Learn More€71.00 -
UNE-EN 61188-5-4:2007
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides (Endorsed by AENOR in March of 2008.)
3/1/2008 - PDF - English -
Learn More€62.00 -
IEC 61249-4-1:2008
IEC 61249-4-1:2008 Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
1/30/2008 - PDF - English -
Learn More€92.00 -
IEC 61249-4-1:2008
IEC 61249-4-1:2008 Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
1/30/2008 - PDF - English, French -
Learn More€92.00 -
BS EN 61188-5-5:2007
Printed boards and printed board assemblies. Design use Attachment (land/joint) considerations. Components with gull- wing leads on four sides
12/31/2007 - PDF - English -
Learn More€331.00 -
BS EN 61188-5-4:2007
Printed boards and printed board assemblies. Design use Attachments (land/joint) considerations. Components with J leads on two sides
12/31/2007 - PDF - English -
Learn More€180.00 -
BS EN 61188-5-3:2007
Printed boards and printed board assemblies. Design use Attachment (land/joint) considerations. Components with gull- wing leads on two sides
12/31/2007 - PDF - English -
Learn More€250.00 -
DD IEC/PAS 61249-3-1:2007
Materials for printed boards and other interconnecting structures Copper-clad laminates flexible (adhesive non-adhesive types)
10/31/2007 - PDF - English -
Learn More€250.00 -
IEC 61188-5-5:2007
IEC 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
10/30/2007 - PDF - English, French -
Learn More€311.00 -
IEC 61188-5-4:2007
IEC 61188-5-4:2007 Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
10/30/2007 - PDF - English -
Learn More€92.00 -
IEC 61188-5-3:2007
IEC 61188-5-3:2007 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
10/30/2007 - PDF - English, French -
Learn More€219.00 -
IEC 61188-5-5:2007
IEC 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
10/30/2007 - PDF - English -
Learn More€311.00 -
IEC 61188-5-8:2007
IEC 61188-5-8:2007 Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
10/30/2007 - PDF - English, French -
Learn More€219.00 -
IEC 61188-5-4:2007
IEC 61188-5-4:2007 Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
10/30/2007 - PDF - English, French -
Learn More€92.00 -
IEC 61188-5-3:2007
IEC 61188-5-3:2007 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
10/30/2007 - PDF - English -
Learn More€219.00 -
IEC 61188-5-8:2007
IEC 61188-5-8:2007 Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
10/30/2007 - PDF - English -
Learn More€219.00 -
IEC 61189-3:2007
IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
10/9/2007 - PDF - English -
Learn More€431.00 -
IEC 61189-3:2007
IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
10/9/2007 - PDF - English, French -
Learn More€431.00 -
BS EN 60191-6-16:2007
Mechanical standardization of semiconductor devices Glossary tests and burn-in sockets for BGA, LGA, FBGA FLGA
7/31/2007 - PDF - English -
Learn More€151.00 -
DD IEC/PAS 62326-7-1:2007
Performance guide for single- and double-sided flexible printed wiring boards
6/29/2007 - PDF - English -
Learn More€331.00 -
DIN EN 61189-5:2007-05
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies (IEC 61189-5:2006); German version EN 61189-5:2006
5/1/2007 - PDF - German -
Learn More€141.96 -
DIN EN 61189-6:2007-03
Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies (IEC 61189-6:2006); German version EN 61189-6:2006
3/1/2007 - PDF - German -
Learn More€115.33 -
UNE-EN 61189-2:2006
Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2: Test methods for materials for interconnection structures (IEC 61189-2:2006). (Endorsed by AENOR in January of 2007.)
1/1/2007 - PDF - English -
Learn More€147.00 -
DIN EN 61189-2:2007-01
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 61189-2:2006); German version EN 61189-2:2006
1/1/2007 - PDF - German -
Learn More€246.73 -
UNE-EN 61189-5:2006
Test methods for electrical materials, interconnection structures and assemblies -- Part 5: Test methods for printed board assemblies (IEC 61189-5:2006). (Endorsed by AENOR in January of 2007.)
1/1/2007 - PDF - English -
Learn More€99.00 -
BS EN 61189-2:2006
Test methods for electrical materials, printed boards and other interconnection structures assemblies materials
11/30/2006 - PDF - English -
Learn More€430.00 -
UNE-EN 61189-6:2006
Test methods for electrical materials, interconnection structures and assemblies -- Part 6: Test methods for materials used in manufacturing electronic assemblies (IEC 61189-6:2006) (Endorsed by AENOR in November of 2006.)
11/1/2006 - PDF - English -
Learn More€78.00 -
BS EN 61189-6:2006
Test methods for electrical materials, interconnection structures and assemblies materials used in manufacturing electronic
9/29/2006 - PDF - English -
Learn More€293.00 -
BS EN 60194:2006
Printed board design, manufacture and assembly. Terms and definitions
9/29/2006 - PDF - English -
Learn More€430.00 -
BS EN 61249-2-7:2002
Materials for interconnection structures. Sectional specification set reinforced base materials, clad and unclad Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
8/31/2006 - PDF - English -
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BS EN 61249-2-6:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad Brominated epoxide non-woven/woven E-glass glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
8/31/2006 - PDF - English -
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BS EN 61249-2-10:2003
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
8/31/2006 - PDF - English -
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BS EN 61249-2-5:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad Brominated epoxide cellulose paper reinforced core/woven E-glass surfaces laminated sheets of defined flammability (vertical burning test), copper-clad
7/31/2006 - PDF - English -
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NF EN 61249-4-5, C93-780-4-5 (07/2006)
Materials for printed boards and other interconnecting structures - Part 4-5 : sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
7/1/2006 - Paper - French -
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NF EN 61249-4-2, C93-780-4-2 (07/2006)
Materials for printed boards and other interconnecting structures - Part 4-2 : sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
7/1/2006 - Paper - French -
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BS EN 61249-2-2:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
6/30/2006 - PDF - English -
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BS EN 61249-2-11:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad unclad Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
6/30/2006 - PDF - English -
Learn More€250.00
