31.180 : Printed circuits and boards
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€253.00 -
€183.00
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DIN EN IEC 61188-6-4:2020-04
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (IEC 61188-6-4:2019), German version EN IEC 61188-6-4:2019
4/1/2020 - PDF - German - DIN
Learn More€131.96 -
IPC 4101E-WAM1:2020
Specification for Base Materials for Rigid and Multilayer Printed Boards
4/1/2020 - Paper - English - IPC
Learn More€264.00 -
PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed
3/23/2020 - PDF - English - BSI
Learn More€398.00 -
IEC TR 61191-7:2020
IEC TR 61191-7:2020 Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
3/11/2020 - PDF - English - IEC
Learn More€431.00 -
BS EN IEC 61191-1:2018 + Redline
Tracked Changes. Printed board assemblies Generic specification. Requirements for soldered electrical and electronic using surface mount related assembly technologies
2/27/2020 - PDF - English - BSI
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BS EN 61191-3:2017 + Redline
Tracked Changes. Printed board assemblies Sectional specification. Requirements for through-hole mount soldered
2/26/2020 - PDF - English - BSI
Learn More€326.00 -
DIN EN 61191-2 Berichtigung 1:2020-02
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017/COR1:2019), German version EN 61191-2:2017/AC:2019
2/1/2020 - PDF - German - DIN
Learn More€0.00 -
IPC 2223E:2020
Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
1/24/2020 - Paper - English - IPC
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IPC 2223E:2020
Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
1/24/2020 - PDF sécurisé - English - IPC
Learn More€195.00 -
UNE-EN IEC 62878-1:2019
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (Endorsed by Asociación Española de Normalización in January of 2020.)
1/1/2020 - PDF - English - AENOR
Learn More€70.00 -
BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
12/17/2019 - PDF - English - BSI
Learn More€250.00 -
NF EN IEC 62878-1, C93-778-1 (12/2019)
Device embedding assembly technology - Part 1 : generic specification for device embedded substrates - Techniques d'assemblage avec appareil(s) intégré(s) - Partie 1 : Spécification générique pour substrats avec appareil(s) intégré(s)
12/1/2019 - Paper - French - AFNOR
Learn More€103.33 -
UNE-EN 61191-2:2017/AC:2019-10
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in December of 2019.)
12/1/2019 - PDF - English - AENOR
Learn More€0.00 -
UNE-EN IEC 62878-2-5:2019
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate (Endorsed by Asociación Española de Normalización in December of 2019.)
12/1/2019 - PDF - English - AENOR
Learn More€98.00 -
19/30396945 DC:2019
BS EN IEC 63251. Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress
11/29/2019 - PDF - English - BSI
Learn More€24.00 -
BS EN IEC 62878-2-5:2019
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
11/18/2019 - PDF - English - BSI
Learn More€348.00 -
NF EN IEC 62878-2-5, C93-778-2-5 (11/2019)
Device embedding assembly technology - Part 2-5 : guidelines - Implementation of a 3D data format for device embedded substrate - Substrat avec appareil(s) intégré(s) - Partie 2-5 : Mise en oeuvre d'un format de données 3D pour un substrat avec appareil(s) intégré(s)
11/1/2019 - Paper - French - AFNOR
Learn More€153.50 -
IEC 62878-1:2019
IEC 62878-1:2019 Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
10/14/2019 - PDF - English - IEC
Learn More€132.00 -
IEC 62878-1:2019
IEC 62878-1:2019 Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
10/14/2019 - PDF - English, French - IEC
Learn More€132.00 -
DIN EN 16602-70-60:2019-10
Space product assurance - Qualification and Procurement of printed circuit boards, English version EN 16602-70-60:2019, only on CD-ROM.
10/1/2019 - PDF - English, German - DIN
Learn More€363.74 -
19/30400602 DC:2019
BS EN IEC 63203-301-1. Wearable electronic devices and technologies Part 301-1. Test method of electrochromic films for wearable equipments
9/20/2019 - PDF - English - BSI
Learn More€24.00 -
IEC 62878-2-5:2019
IEC 62878-2-5:2019 Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
9/16/2019 - PDF - English - IEC
Learn More€345.00 -
IEC 62878-2-5:2019
IEC 62878-2-5:2019 Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
9/16/2019 - PDF - English, French - IEC
Learn More€345.00 -
18/30379177 DC:2019
BS EN IEC 63203-401-1. Wearable electronic devices and technologies Part 401-1. Devices Systems. Functional elements. Evaluation method of the stretchable resistive strain sensor
9/13/2019 - PDF - English - BSI
Learn More€24.00 -
PR NF IEC 60194-1, C93-730-1PR (09/2019)
Conception, fabrication et assemblage de cartes imprimées - Vocabulaire - Partie 1 : Usage commun des techniques d'assemblage des composants électroniques et des cartes imprimées
9/1/2019 - Paper - English, French - AFNOR
Learn More€204.00 -
IPC 9121 - Amendment 2:2019
Troubleshooting for PCB Fabrication Processes - Amendment 2
9/1/2019 - PDF sécurisé - English - IPC
Learn More€62.00 -
NBN EN 16602-70-60:2019
Space product assurance - Qualification and Procurement of printed circuit boards
8/28/2019 - PDF - French - NBN
Learn More€205.00 -
NBN EN 16602-70-60:2019
Space product assurance - Qualification and Procurement of printed circuit boards
8/28/2019 - PDF - English - NBN
Learn More€205.00 -
UNE-EN 16602-70-60:2019
Space product assurance - Qualification and Procurement of printed circuit boards (Endorsed by Asociación Española de Normalización in August of 2019.)
8/1/2019 - PDF - English - AENOR
Learn More€212.00 -
UNE-EN IEC 61188-6-4:2019
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (Endorsed by Asociación Española de Normalización in August of 2019.)
8/1/2019 - PDF - English - AENOR
Learn More€83.00 -
BS EN 16602-70-60:2019
Space product assurance. Qualification and Procurement of printed circuit boards
7/19/2019 - PDF - English - BSI
Learn More€449.00 -
PD IEC TR 61189-5-506:2019
Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. An intercomparison evaluation to implement the use of fine-pitch surface insulation resistance (SIR) testing solder fluxes in accordance with IEC 61189-5-501
7/18/2019 - PDF - English - BSI
Learn More€250.00 -
BS EN IEC 61188-6-4:2019
Printed boards and printed board assemblies. Design use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint land design
7/12/2019 - PDF - English - BSI
Learn More€331.00 -
NF EN 16602-70-60, L90-200-70-60 (07/2019)
Space product assurance - Qualification and Procurement of printed circuit boards
7/1/2019 - Paper - English, French - AFNOR
Learn More€323.00 -
NF EN IEC 61188-6-4, C93-711-6-4 (07/2019)
Printed boards and printed board assemblies - Design and use - Part 6-4 : land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design - Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 6-4 : Exigences génériques pour les dessins dimensionnels de CMS du point de vue de la conception de la zone de report
7/1/2019 - Paper - French - AFNOR
Learn More€141.33 -
IEC TR 61189-5-506:2019
IEC TR 61189-5-506:2019 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
6/26/2019 - PDF - English - IEC
Learn More€173.00 -
BS IEC 62899-204:2019
Printed electronics Materials. Insulator ink. Measurement methods of properties insulator inks and printed insulating layers
6/7/2019 - PDF - English - BSI
Learn More€250.00 -
DIN EN IEC 61191-1:2019-06
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018), German version EN IEC 61191-1:2018.
6/1/2019 - PDF - German - DIN
Learn More€141.96 -
UNE-EN IEC 62496-4-1:2019
Optical circuit boards - Part 4-1: Interface standards - Terminated waveguide OCB assembly using single-row twelve-channel PMT connectors (Endorsed by Asociación Española de Normalización in June of 2019.)
6/1/2019 - PDF - English - AENOR
Learn More€63.00 -
IEC 62899-204:2019
IEC 62899-204:2019 Printed electronics - Part 204: Materials - Insulator ink - Measurement methods of properties of insulator inks and printed insulating layers
5/20/2019 - PDF - English - IEC
Learn More€173.00 -
19/30357467 DC:2019
BS IEC 62899-201-2. Printed electronics Part 201-2. Materials. Evaluation method of stretchable substrates
5/13/2019 - PDF - English - BSI
Learn More€24.00 -
IEC 61188-6-4:2019
IEC 61188-6-4:2019 Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
5/2/2019 - PDF - English, French - IEC
Learn More€311.00 -
DIN EN IEC 61189-2-803:2019-05
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board (IEC 91/1545/CD:2018), Text in German and English
5/1/2019 - PDF - English, German - DIN
Learn More€45.98 -
DIN EN IEC 61189-2-804:2019-05
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 (IEC 91/1546/CD:2018), Text in German and English
5/1/2019 - PDF - English, German - DIN
Learn More€45.98 -
PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
4/1/2019 - PDF - English - BSI
Learn More€180.00 -
DIN EN IEC 61189-2-801:2019-04
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (IEC 91/1543/CD:2018), Text in German and English
4/1/2019 - PDF - English, German - DIN
Learn More€65.89 -
IEC TR 62878-2-7:2019
IEC TR 62878-2-7:2019 Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
3/20/2019 - PDF - English - IEC
Learn More€92.00 -
19/30393235 DC:2019
BS EN IEC 63203-401-1. Wearable electronic devices and technologies Part 401-1. Devices Systems. Functional elements. Evaluation method of the stretchable resistive strain sensor
3/13/2019 - PDF - English - BSI
Learn More€24.00 -
NF EN IEC 60947-7-4, C63-001-7-4 (03/2019)
Low-voltage switchgear and controlgear - Part 7-4 : ancillary equipment - PCB terminal blocks for copper conductors
3/1/2019 - Paper - French - AFNOR
Learn More€127.67 -
DIN EN IEC 61189-2-630:2019-03
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning (IEC 61189-2-630:2018), German version EN IEC 61189-2-630:2018
3/1/2019 - PDF - German - DIN
Learn More€59.63 -
19/30379185 DC:2019
BS EN 63203-406-1. Wearable electronic devices and technologies Part 406-1. Test methods of wrist worn wearable for measuring skin contact temperature
1/31/2019 - PDF - English - BSI
Learn More€24.00 -
BS IEC 62899-202-3:2019
Printed electronics Materials. Conductive ink. Measurement of sheet resistance conductive films. Contactless method
1/23/2019 - PDF - English - BSI
Learn More€180.00 -
IEC 62899-202-3:2019
IEC 62899-202-3:2019 Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films - Contactless method
1/16/2019 - PDF - English - IEC
Learn More€92.00 -
€348.00
-
UNE-EN IEC 61191-1:2018
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (Endorsed by Asociación Española de Normalización in December of 2018.)
12/1/2018 - PDF - English - AENOR
Learn More€84.00 -
18/30380691 DC:2018
BS EN IEC 61249-6-3. Materials for printed boards and other interconnecting structures Part 6-3. Sectional specification set reinforcement materials. Specification finished fabric woven from “E” glass
11/21/2018 - PDF - English - BSI
Learn More€24.00 -
18/30379173 DC:2018
BS EN 61189-2-804. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-804. time to delamination. T260, T288, T300
11/21/2018 - PDF - English - BSI
Learn More€24.00 -
18/30372182 DC:2018
BS EN IEC 61189-2-801. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-801. Thermal conductivity test base materials
11/21/2018 - PDF - English - BSI
Learn More€24.00 -
18/30379169 DC:2018
BS EN IEC 61189-2-803. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-803. Z-Axis Expansion of base materials
11/19/2018 - PDF - English - BSI
Learn More€24.00 -
IEC 62899-201:2016/AMD1:2018
IEC 62899-201:2016/AMD1:2018 Amendment 1 - Printed electronics - Part 201: Materials - Substrates
11/15/2018 - PDF - English - IEC
Learn More€92.00 -
IEC 62899-201:2016+AMD1:2018 Edition 1.1
IEC 62899-201:2016+AMD1:2018 (Consolidated version) Printed electronics - Part 201: Materials - Substrates
11/15/2018 - PDF - English - IEC
Learn More€506.00 -
BS EN IEC 61191-1:2018
Printed board assemblies Generic specification. Requirements for soldered electrical and electronic using surface mount related assembly technologies
11/13/2018 - PDF - English - BSI
Learn More€331.00 -
UNE-EN IEC 61189-2-630:2018
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning (Endorsed by Asociación Española de Normalización in November of 2018.)
11/1/2018 - PDF - English - AENOR
Learn More€42.00 -
BS EN IEC 61189-2-630:2018
Test methods for electrical materials, printed board and other interconnection structures assemblies materials structures. Moisture absorption after pressure vessel conditioning
10/10/2018 - PDF - English - BSI
Learn More€151.00 -
BS IEC 62899-202-5:2018
Printed electronics Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate
10/9/2018 - PDF - English - BSI
Learn More€180.00 -
DIN EN IEC 61249-2-47 VDE 0322-249-2-47:2018-10
Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2.0 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-47:2018), German version EN IEC 61249-2-47:2018
10/1/2018 - Paper - German - VDE
Learn More€74.10 -
DIN EN IEC 61249-2-45 VDE 0322-249-2-45:2018-10
Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-45:2018), German version EN IEC 61249-2-45:2018
10/1/2018 - Paper - German - VDE
Learn More€74.10 -
DIN EN IEC 61249-2-46 VDE 0322-249-2-46:2018-10
Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-46:2018), German version EN IEC 61249-2-46:2018
10/1/2018 - Paper - German - VDE
Learn More€74.10 -
IEC 62899-202-5:2018
IEC 62899-202-5:2018 Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
9/28/2018 - PDF - English - IEC
Learn More€92.00 -
18/30383448 DC:2018
BS EN 60947-4-3. Low-voltage switchgear and controlgear Part 4-3. Contactors motor-starters. Semiconductor controllers semiconductor contactors for non-motor loads
9/14/2018 - PDF - English - BSI
Learn More€24.00 -
BS IEC 62899-403-1:2018
Printed electronics Printability. Requirements for reproducibility. Basic patterns evaluation of printing machine
6/27/2018 - PDF - English - BSI
Learn More€250.00 -
IEC 62899-403-1:2018
IEC 62899-403-1:2018 Printed electronics - Part 403-1: Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine
6/21/2018 - PDF - English - IEC
Learn More€173.00 -
IEC 61189-2-630:2018
IEC 61189-2-630:2018 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning
6/5/2018 - PDF - English, French - IEC
Learn More€23.00 -
BS IEC 62899-302-2:2018
Printed electronics Equipment. Inkjet. Imaging-based measurement of droplet volume
5/18/2018 - PDF - English - BSI
Learn More€180.00 -
BS IEC 62899-303-1:2018
Printed electronics Equipment. Roll-to-roll printing. Mechanical dimensions
5/18/2018 - PDF - English - BSI
Learn More€151.00 -
DIN EN 61191-2:2018-05
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017), German version EN 61191-2:2017.
5/1/2018 - PDF - German - DIN
Learn More€115.33 -
DIN EN 61191-4:2018-05
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (IEC 61191-4:2017), German version EN 61191-4:2017.
5/1/2018 - PDF - German - DIN
Learn More€99.35 -
UNE-EN IEC 61249-2-45:2018
Materials for printed boards and other interconnecting structures – Part 2-45: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
5/1/2018 - PDF - English - AENOR
Learn More€70.00 -
UNE-EN IEC 61249-2-46:2018
Materials for printed boards and other interconnecting structures – Part 2-46: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
5/1/2018 - PDF - English - AENOR
Learn More€70.00 -
UNE-EN IEC 61249-2-47:2018
Materials for printed boards and other interconnecting structures – Part 2-47: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2.0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
5/1/2018 - PDF - English - AENOR
Learn More€70.00 -
BS EN IEC 61249-2-47:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m K) defined flammability (vertical burning test), copper-clad lead-free assembly
4/18/2018 - PDF - English - BSI
Learn More€250.00 -
BS EN IEC 61249-2-46:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) defined flammability (vertical burning test), copper-clad lead-free assembly
4/16/2018 - PDF - English - BSI
Learn More€250.00 -
BS EN IEC 61189-5-503:2017
Test methods for electrical materials, printed board and other interconnection structures assemblies General test method materials assemblies. Conductive anodic filaments (CAF) testing of circuit boards
4/13/2018 - PDF - English - BSI
Learn More€250.00 -
BS EN IEC 61249-2-45:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) defined flammability (vertical burning test), copper-clad lead-free assembly
4/13/2018 - PDF - English - BSI
Learn More€250.00 -
18/30375223 DC:2018
BS EN 60947-4-3. Low-voltage switchgear and controlgear Part 4-3. Contactors motor-starters. Semiconductor controllers semiconductor contactors for non-motor loads
4/10/2018 - PDF - English - BSI
Learn More€24.00 -
IPC 9121 - Amendment 1:2018
Troubleshooting for PCB Fabrication Processes - Amendment 1
4/1/2018 - PDF sécurisé - English - IPC
Learn More€62.00 -
NF EN 16602-70-12, L90-200-70-12 (03/2018)
Space product assurance - Design rules for printed circuit boards
3/1/2018 - Paper - French - AFNOR
Learn More€281.43 -
NF EN IEC 61249-2-45, C93-780-2-45 (03/2018)
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-45 : matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées renforcées en verre de type E tissé/non tissé époxyde non halogéné, de conductivité thermique 1,0 W/(m.K) et d'inflammabilité définie (essai de combustion verticale), plaquées cuivre pour les assemblages sans plomb
3/1/2018 - Paper - French - AFNOR
Learn More€103.33 -
NF EN IEC 61249-2-46, C93-780-2-46 (03/2018)
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-46 : matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées renforcées en verre de type E tissé/non tissé époxyde non halogéné, de conductivité thermique 1,5 W/(m.K) et d'inflammabilité définie (essai de combustion verticale), plaquées cuivre pour les assemblages sans plomb
3/1/2018 - Paper - French - AFNOR
Learn More€103.33 -
NF EN IEC 61249-2-47, C93-780-2-47 (03/2018)
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-47 : Matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées renforcées en verre de type E tissé/non tissé époxyde non halogéné, de conductivité thermique 2,0 W/(m.K) et d'inflammabilité définie (essai de combustion verticale), plaquées cuivre pour les assemblages sans plomb
3/1/2018 - Paper - French - AFNOR
Learn More€103.33 -
IEC 61249-2-46:2018
IEC 61249-2-46:2018 Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
1/10/2018 - PDF - English - IEC
Learn More€173.00 -
IEC 61249-2-45:2018
IEC 61249-2-45:2018 Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
1/10/2018 - PDF - English - IEC
Learn More€173.00 -
IEC 61249-2-47:2018
IEC 61249-2-47:2018 Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
1/10/2018 - PDF - English - IEC
Learn More€173.00 -
IEC 61249-2-45:2018
IEC 61249-2-45:2018 Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
1/10/2018 - PDF - English, French - IEC
Learn More€173.00 -
IEC 61249-2-46:2018
IEC 61249-2-46:2018 Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
1/10/2018 - PDF - English, French - IEC
Learn More€173.00 -
IEC 61249-2-47:2018
IEC 61249-2-47:2018 Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
1/10/2018 - PDF - English, French - IEC
Learn More€173.00 -
DIN EN 61189-5-503:2018-01
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (IEC 61189-5-503:2017), German version EN 61189-5-503:2017
1/1/2018 - PDF - German - DIN
Learn More€104.95 -
IPC CC-830C:2018
Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
1/1/2018 - PDF sécurisé - English - IPC
Learn More€108.00 -
IEC 60194-2:2017
IEC 60194-2:2017 Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
12/13/2017 - PDF - English - IEC
Learn More€311.00 -
DIN EN 61188-7:2017-12
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2017), German version EN 61188-7:2017.
12/1/2017 - PDF - German - DIN
Learn More€99.35 -
UNE-EN 61191-4:2017
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (Endorsed by Asociación Española de Normalización in December of 2017.)
12/1/2017 - PDF - English - AENOR
Learn More€64.00 -
BS EN 61191-4:2017
Printed board assemblies Sectional specification. Requirements for terminal soldered
11/20/2017 - PDF - English - BSI
Learn More€250.00 -
BS IEC 62899-301-2:2017
Printed electronics Equipment. Contact printing. Rigid master. Measurement method of plate master pattern dimension
11/16/2017 - PDF - English - BSI
Learn More€250.00 -
UNE-EN 62496-2:2017
Optical circuit boards - Basic test and measurement procedures - Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards (Endorsed by Asociación Española de Normalización in November of 2017.)
11/1/2017 - PDF - English - AENOR
Learn More€76.00 -
UNE-EN 61191-2:2017
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in November of 2017.)
11/1/2017 - PDF - English - AENOR
Learn More€76.00 -
UNE-EN 61191-3:2017
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (Endorsed by Asociación Española de Normalización in October of 2017.)
10/1/2017 - PDF - English - AENOR
Learn More€65.00 -
BS EN 61188-7:2017
Printed boards and printed board assemblies. Design use Electronic component zero orientation for CAD library construction
9/28/2017 - PDF - English - BSI
Learn More€250.00 -
BS EN 61191-3:2017
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered
9/25/2017 - PDF - English - BSI
Learn More€250.00 -
17/30365805 DC:2017
BS IEC 60194-1. Printed boards design, manufacture and assembly. Vocabulary. Part 1. Common usage in printed board and electronic assembly technologies
9/1/2017 - PDF - English - BSI
Learn More€43.00 -
UNE-EN 61189-5-503:2017
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (Endorsed by Asociación Española de Normalización in September of 2017.)
9/1/2017 - PDF - English - AENOR
Learn More€68.00 -
NF EN 61189-5-503, C93-735-503 (08/2017)
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503 : general test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
8/1/2017 - Paper - French - AFNOR
Learn More€116.33 -
UNE-EN 61188-7:2017
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (Endorsed by Asociación Española de Normalización in August of 2017.)
8/1/2017 - PDF - English - AENOR
Learn More€65.00 -
IEEE 1149.10:2017
IEEE Standard for High-Speed Test Access Port and On-Chip Distribution Architecture
7/28/2017 - PDF - English - IEEE
Learn More€99.00 -
IEEE 1149.10:2017
IEEE Standard for High-Speed Test Access Port and On-Chip Distribution Architecture
7/28/2017 - Paper - English - IEEE
Learn More€122.00 -
NF EN 61188-7, C93-711-7 (06/2017)
Printed boards and printed board assemblies - Design and use - Part 7 : electronic component zero orientation for CAD library construction
6/1/2017 - Paper - French - AFNOR
Learn More€103.33 -
IEC 61189-5-503:2017
IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
5/22/2017 - PDF - English, French - IEC
Learn More€173.00 -
IEC 61189-5-503:2017
IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
5/22/2017 - PDF - English - IEC
Learn More€173.00 -
IEC 61188-7:2017
IEC 61188-7:2017 Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
4/10/2017 - PDF - English, French - IEC
Learn More€132.00 -
IEC 61188-7:2017
IEC 61188-7:2017 Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
4/10/2017 - PDF - English - IEC
Learn More€132.00 -
DIN EN 61189-5-1:2017-04
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (IEC 61189-5-1:2016), German version EN 61189-5-1:2016
4/1/2017 - PDF - German - DIN
Learn More€104.95 -
DIN EN 61189-2-719:2017-04
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (IEC 61189-2-719:2016), German version EN 61189-2-719:2016
4/1/2017 - PDF - German - DIN
Learn More€92.62 -
BS IEC 62899-402-1:2017
Printed electronics Printability. Measurement of qualities. Pattern width
3/31/2017 - PDF - English - BSI
Learn More€180.00 -
€180.00
-
PD IEC/TR 61189-3-914:2017
Test methods for electrical materials, printed boards and other interconnection structures assemblies method thermal conductivity of circuit high-brightness LEDs. Guidelines
3/31/2017 - PDF - English - BSI
Learn More€250.00 -
IEC TR 61189-3-914:2017
IEC TR 61189-3-914:2017 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
3/17/2017 - PDF - English - IEC
Learn More€173.00 -
IEC 62899-401:2017
IEC 62899-401:2017 Printed electronics - Part 401: Printability - Overview
3/3/2017 - PDF - English - IEC
Learn More€46.00 -
IEC 62899-402-1:2017
IEC 62899-402-1:2017 Printed electronics - Part 402-1: Printability - Measurement of qualities - Pattern width
3/3/2017 - PDF - English - IEC
Learn More€92.00 -
DIN EN 61249-2-43 VDE 0322-249-2-43:2017-03
Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-43:2016), German version EN 61249-2-43:2016
3/1/2017 - Paper - German - VDE
Learn More€69.60 -
DIN EN 61249-2-44 VDE 0322-249-2-44:2017-03
Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-44:2016), German version EN 61249-2-44:2016
3/1/2017 - Paper - German - VDE
Learn More€69.60 -
PD IEC/TR 62899-250:2016
Printed electronics Material technologies required in printed for wearable smart devices
1/31/2017 - PDF - English - BSI
Learn More€180.00 -
IEC TR 62899-250:2016
IEC TR 62899-250:2016 Printed electronics - Part 250: Material technologies required in printed electronics for wearable smart devices
12/14/2016 - PDF - English - IEC
Learn More€92.00 -
DIN EN 62326-20:2016-12
Printed boards - Part 20: Printed circuit boards for high-brightness LEDs (IEC 62326-20:2016), German version EN 62326-20:2016
12/1/2016 - PDF - German - DIN
Learn More€141.96 -
DIN EN 61189-3-719:2016-12
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016), German version EN 61189-3-719:2016
12/1/2016 - PDF - German - DIN
Learn More€79.72 -
DIN EN 16602-70-12:2016-12
Space product assurance - Design rules for printed circuit boards, English version EN 16602-70-12:2016
12/1/2016 - PDF - English, German - DIN
Learn More€297.38 -
NBN EN 16602-70-12:2016
Space product assurance - Design rules for printed circuit boards
11/23/2016 - PDF - French - NBN
Learn More€205.00 -
NBN EN 16602-70-12:2016
Space product assurance - Design rules for printed circuit boards
11/23/2016 - PDF - English - NBN
Learn More€205.00 -
NF EN 61189-3-719, C93-733-719 (11/2016)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719 : test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling - Méthodes d'essai pour les matériaux électriques, les cartes imprimées, et autres structures d'interconnexion et ensembles - Partie 3-719 : méthodes d'essai pour les structures d'interconnexion (cartes imprimées) - Contrôles de la variation de résistance des trous métallisés uniques (PTH) au cours
11/1/2016 - Paper - French - AFNOR
Learn More€99.50 -
UNE-EN 61189-5-1:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (Endorsed by AENOR in November of 2016.)
11/1/2016 - PDF - English - AENOR
Learn More€70.00 -
UNE-EN 16602-70-12:2016
Space product assurance - Design rules for printed circuit boards (Endorsed by AENOR in November of 2016.)
11/1/2016 - PDF - English - AENOR
Learn More€179.00 -
UNE-EN 61189-2-719:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (Endorsed by AENOR in November of 2016.)
11/1/2016 - PDF - English - AENOR
Learn More€66.00 -
BS EN 61189-5-1:2016
Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. Guidance board
10/31/2016 - PDF - English - BSI
Learn More€250.00 -
BS EN 61189-2-719:2016
Test methods for electrical materials, printed boards and other interconnection structures assemblies materials structures. Relative permittivity loss tangent (500 MHz to 10 GHz)
10/31/2016 - PDF - English - BSI
Learn More€250.00 -
BS EN 16602-70-12:2016
Space product assurance. Design rules for printed circuit boards
10/31/2016 - PDF - English - BSI
Learn More€449.00 -
NF EN 61249-2-44, C93-780-2-44 (09/2016)
Materials for printed boards and other interconnecting structures - Part 2-44 : reinforced base materials clad and unclad - Non halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly - Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-44 : matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées renforcées en verre de type E tissé/non-tissé époxyde non halogéné, plaquées cuivre, d'inflammabilité définie (essai de
9/1/2016 - Paper - French - AFNOR
Learn More€103.33 -
PD IEC/TS 61189-3-301:2016
Test methods for electrical materials, printed boards and other interconnection structures assemblies (printed boards). Appearance inspection method plated surfaces on PWB
8/31/2016 - PDF - English - BSI
Learn More€180.00 -
NF EN 61188-5-3, C93-711-5-3 (08/2016)
Printed boards and printed board assemblies - Design and use - Part 5-3 : attachment (land/joint) considerations - Components with gull-wing leads on two sides
8/1/2016 - Paper - French - AFNOR
Learn More€116.33 -
UNE-EN 61249-2-43:2016
Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in August of 2016.)
8/1/2016 - PDF - English - AENOR
Learn More€15.00 -
UNE-EN 61249-2-44:2016
Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in August of 2016.)
8/1/2016 - PDF - English - AENOR
Learn More€66.00 -
BS EN 61249-2-43:2016
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly
7/31/2016 - PDF - English - BSI
Learn More€250.00 -
BS EN 61249-2-44:2016
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly
7/31/2016 - PDF - English - BSI
Learn More€250.00 -
IEC TS 61189-3-301:2016
IEC TS 61189-3-301:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB
7/28/2016 - PDF - English - IEC
Learn More€92.00 -
IEC 61189-2-719:2016
IEC 61189-2-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
7/12/2016 - PDF - English, French - IEC
Learn More€132.00 -
IEC 61189-5-1:2016
IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
7/5/2016 - PDF - English, French - IEC
Learn More€219.00 -
NF EN 62326-20, C93-707-20 (07/2016)
Printed boards - Part 20 : printed circuit boards for high-brightness LEDs
7/1/2016 - Paper - French - AFNOR
Learn More€153.67 -
NF EN 61188-5-5, C93-711-5-5 (07/2016)
Printed boards and printed board assemblies - Design and use - Part 5-5 : Attachment (land/joint) considerations - Components with gull-wing leads on four sides - Cartes imprimées et cartes imprimées équipées
7/1/2016 - Paper - French - AFNOR
Learn More€141.33 -
NF EN 61188-5-4, C93-711-5-4 (07/2016)
Printed boards and printed board assemblies - Design and use - Part 5-4 : attachment (land/joint) consideration - Components with J leads on two sides - Cartes imprimées et cartes imprimées équipées
7/1/2016 - Paper - French - AFNOR
Learn More€88.33 -
UNE-EN 62326-20:2016
Printed boards - Part 20: Printed circuit boards for high-brightness LEDs (Endorsed by AENOR in June of 2016.)
6/1/2016 - PDF - English - AENOR
Learn More€87.00 -
€348.00 -
IEC 61249-2-44:2016
IEC 61249-2-44:2016 Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
5/12/2016 - PDF - English, French - IEC
Learn More€173.00 -
IEC 61249-2-43:2016
IEC 61249-2-43:2016 Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
5/12/2016 - PDF - English, French - IEC
Learn More€173.00 -
UNE-EN 61189-3-719:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (Endorsed by AENOR in May of 2016.)
5/1/2016 - PDF - English - AENOR
Learn More€57.00 -
BS EN 61189-3-719:2016
Test methods for electrical materials, printed boards and other interconnection structures assemblies (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
4/30/2016 - PDF - English - BSI
Learn More€180.00 -
DIN EN 62878-1-1:2016-03
Device embedded substrate - Part 1-1: Generic specification - Test methods (IEC 62878-1-1:2015), German version EN 62878-1-1:2015
3/1/2016 - PDF - German - DIN
Learn More€152.71 -
DIN EN 61189-2-721:2016-03
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator (IEC 61189-2-721:2015), German version EN 61189-2-721:2015
3/1/2016 - PDF - German - DIN
Learn More€104.95 -
IEC 62899-201:2016
IEC 62899-201:2016 Printed electronics - Part 201: Materials - Substrates
2/25/2016 - PDF - English - IEC
Learn More€311.00 -
IEC 62326-20:2016
IEC 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
2/3/2016 - PDF - English, French - IEC
Learn More€311.00 -
IEC 61189-3-719:2016
IEC 61189-3-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
1/5/2016 - PDF - English, French - IEC
Learn More€46.00 -
IEC 61189-3-913:2016
IEC 61189-3-913:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs
1/5/2016 - PDF - English, French - IEC
Learn More€219.00 -
PD IEC/TR 62878-2-2:2015
Device embedded substrate Guidelines. Electrical testing
12/31/2015 - PDF - English - BSI
Learn More€180.00 -
PD IEC/TR 63017:2015
Flexible printed circuit boards (FPCBs). Method of compensation of impedance variations
12/16/2015 - PDF - English - BSI
Learn More€180.00 -
PD IEC/TR 63018:2015
Flexible printed circuit boards (FPCBs). Method to decrease signal loss by using noise suppression materials
12/16/2015 - PDF - English - BSI
Learn More€180.00 -
IEC TR 63018:2015
IEC TR 63018:2015 Flexible printed circuit boards (FPCBs) - Method to decrease signal loss by using noise suppression materials
12/16/2015 - PDF - English - IEC
Learn More€92.00 -
IEC TR 63017:2015
IEC TR 63017:2015 Flexible printed circuit boards (FPCBs) - Method of compensation of impedance variations
12/16/2015 - PDF - English - IEC
Learn More€92.00 -
IEC TR 62878-2-2:2015
IEC TR 62878-2-2:2015 Device embedded substrate - Part 2-2: Guidelines - Electrical testing
12/4/2015 - PDF - English, French - IEC
Learn More€92.00 -
JIS C 61191-1:2015
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
11/20/2015 - PDF - Japanese - JSA
Learn More€50.18 -
JIS C 61191-2:2015
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
11/20/2015 - PDF - Japanese - JSA
Learn More€41.86 -
DIN EN 61189-5-4:2015-11
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC 61189-5-4:2015), German version EN 61189-5-4:2015.
11/1/2015 - PDF - German - DIN
Learn More€104.95 -
DIN EN 61189-5-2:2015-11
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (IEC 61189-5-2:2015), German version EN 61189-5-2:2015.
11/1/2015 - PDF - German - DIN
Learn More€131.96 -
DIN EN 61189-5-3:2015-11
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015), German version EN 61189-5-3:2015.
11/1/2015 - PDF - German - DIN
Learn More€136.82 -
NF EN 61189-2-721, C93-732-721 (10/2015)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721 : test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator - Méthodes d'essais pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-721 : méthodes d'essai des matériaux pour structures d'interconnexion - Mesure de la permittivité relative et de la tangente de perte pour les
10/1/2015 - Paper - French - AFNOR
Learn More€103.00 -
NF EN 62878-1-1, C93-778-1-1 (10/2015)
Device embedded substrate - Part 1-1 : generic specification - Test methods - Substrat intégré à l'appareil
10/1/2015 - Paper - French - AFNOR
Learn More€148.67 -
UNE-EN 62878-1-1:2015
Device embedded substrate - Part 1-1: Generic specification - Test methods (Endorsed by AENOR in August of 2015.)
8/1/2015 - PDF - English - AENOR
Learn More€94.00 -
UNE-EN 61189-2-721:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator (Endorsed by AENOR in August of 2015.)
8/1/2015 - PDF - English - AENOR
Learn More€69.00 -
BS EN 62878-1-1:2015
Device embedded substrate Generic specification. Test methods
7/31/2015 - PDF - English - BSI
Learn More€348.00 -
BS EN 61189-2-721:2015
Test methods for electrical materials, printed boards and other interconnection structures assemblies materials structures. Measurement of relative permittivity loss tangent copper clad laminate at microwave frequency using split post dielectric resonator
6/30/2015 - PDF - English - BSI
Learn More€250.00 -
€578.00
-
NF EN 61189-5-2, C93-735-2 (06/2015)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2 : general test methods for materials and assemblies - Soldering Flux for printed board assemblies
6/1/2015 - Paper - French - AFNOR
Learn More€141.33 -
NF EN 61189-5-4, C93-735-4 (06/2015)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4 : general test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for wire for printed board assembies
6/1/2015 - Paper - French - AFNOR
Learn More€103.33 -
NF EN 61189-5-3, C93-735-3 (06/2015)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3 : general test methods for materials and assemblies - Soldering paste for printed board assemblies
6/1/2015 - Paper - French - AFNOR
Learn More€141.33 -
IEC 62878-1-1:2015
IEC 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
5/20/2015 - PDF - English, French - IEC
Learn More€345.00 -
PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology
4/30/2015 - PDF - English - BSI
Learn More€293.00 -
PD IEC/TS 62878-2-4:2015
Device embedded substrate Guidelines. Test element groups (TEG)
4/30/2015 - PDF - English - BSI
Learn More€293.00 -
€250.00 -
BS EN 61189-5-2:2015
Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. Soldering flux board
4/30/2015 - PDF - English - BSI
Learn More€331.00 -
BS EN 61189-5-3:2015
Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. Soldering paste board
4/30/2015 - PDF - English - BSI
Learn More€331.00 -
BS EN 61189-5-4:2015
Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. Solder alloys fluxed non-fluxed solid wire board
4/30/2015 - PDF - English - BSI
Learn More€250.00 -
IEC 61189-2-721:2015
IEC 61189-2-721:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator
4/29/2015 - PDF - English, French - IEC
Learn More€173.00 -
UNE-EN 61189-5-4:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (Endorsed by AENOR in April of 2015.)
4/1/2015 - PDF - English - AENOR
Learn More€70.00
