31.180 : Printed circuits and boards

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  • PD IEC TR 61191-7:2020

    Printed board assemblies Technical cleanliness of components and printed
    3/23/2020 - PDF - English - BSI
    Learn More
    €346.02

  • IEC TR 61191-7:2020

    IEC TR 61191-7:2020 Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
    3/11/2020 - PDF - English - IEC
    Learn More
    €335.00

  • PR NF EN IEC 60603-7, C93-430-7PR (03/2020)


    3/1/2020 - Paper - English, French - AFNOR
    Learn More
    €129.70

  • BS EN IEC 61191-1:2018:2020 + Redline

    Tracked Changes. Printed board assemblies Generic specification. Requirements for soldered electrical and electronic using surface mount related assembly technologies
    2/27/2020 - PDF - English - BSI
    Learn More
    €369.72

  • BS EN 61191-3:2017:2020 + Redline

    Tracked Changes. Printed board assemblies Sectional specification. Requirements for through-hole mount soldered
    2/26/2020 - PDF - English - BSI
    Learn More
    €280.37

  • 20/30414127 DC:2020

    BS EN IEC 63203-406-1. Wearable electronic devices and technologies Part 406-1. Test method for measuring contact surface temperature of wrist worn wearable
    2/19/2020 - PDF - English - BSI
    Learn More
    €23.70

  • 20/30387889 DC:2020

    BS EN IEC 63203-201-1. Wearable electronic devices and technologies Part 201-1. Electronic Textile. Measurement methods for basic properties of conductive yarns
    2/13/2020 - PDF - English - BSI
    Learn More
    €23.70

  • 20/30387893 DC:2020

    BS EN IEC 63203-201-2. Wearable electronic devices and technologies Part 201-2. Electronic Textile. Measurement methods for basic properties of conductive fabric insulation materials
    1/17/2020 - PDF - English - BSI
    Learn More
    €23.70

  • UNE-EN IEC 62878-1:2019

    Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (Endorsed by Asociación Española de Normalización in January of 2020.)
    1/1/2020 - PDF - English - AENOR
    Learn More
    €70.00

  • 20/30408452 DC:2019

    BS EN IEC 61189-2-501. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-501. materials structures. Measurement of Resilience strength Retention Factor Flexible Dielectric Materials
    12/20/2019 - PDF - English - BSI
    Learn More
    €23.70

  • BS EN IEC 62878-1:2019

    Device embedding assembly technology Generic specification for device embedded substrates
    12/17/2019 - PDF - English - BSI
    Learn More
    €215.67

  • 20/30394767 DC:2019

    BS EN IEC 62878-2-601. Device Embedding assembly technology Part 2-602. Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
    12/13/2019 - PDF - English - BSI
    Learn More
    €23.70

  • UNE-EN IEC 62878-2-5:2019

    Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate (Endorsed by Asociación Española de Normalización in December of 2019.)
    12/1/2019 - PDF - English - AENOR
    Learn More
    €98.00

  • UNE-EN 61191-2:2017/AC:2019-10

    Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in December of 2019.)
    12/1/2019 - PDF - English - AENOR
    Learn More
    €0.00

  • 19/30396945 DC:2019

    BS EN IEC 63251. Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress
    11/29/2019 - PDF - English - BSI
    Learn More
    €23.70

  • BS EN IEC 62878-2-5:2019

    Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
    11/18/2019 - PDF - English - BSI
    Learn More
    €300.99

  • 19/30402793 DC:2019

    BS EN IEC 61189-5-301. Test methods for electrical materials, printed boards and other interconnection structures assemblies Part 5-301. board assemblies. Soldering paste using fine solder particles
    11/8/2019 - PDF - English - BSI
    Learn More
    €23.70

  • PR NF EN IEC 61189-5-601, C93-735-601PR (11/2019)


    11/1/2019 - Paper - English, French - AFNOR
    Learn More
    €100.66

  • IEC 62878-1:2019

    IEC 62878-1:2019 Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
    10/14/2019 - PDF - English - IEC
    Learn More
    €107.00

  • IEC 62878-1:2019

    IEC 62878-1:2019 Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
    10/14/2019 - PDF - English, French - IEC
    Learn More
    €107.00

  • 19/30400602 DC:2019

    BS EN IEC 63203-301-1. Wearable electronic devices and technologies Part 301-1. Test method of electrochromic films for wearable equipments
    9/20/2019 - PDF - English - BSI
    Learn More
    €23.70

  • IEC 62878-2-5:2019

    IEC 62878-2-5:2019 Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
    9/16/2019 - PDF - English - IEC
    Learn More
    €284.00

  • IEC 62878-2-5:2019

    IEC 62878-2-5:2019 Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
    9/16/2019 - PDF - English, French - IEC
    Learn More
    €284.00

  • 18/30378879 DC:2019

    BS IEC 63203-101-1. Wearable electronic devices and technologies Part 101-1. Terminology
    9/13/2019 - PDF - English - BSI
    Learn More
    €23.70

  • 18/30379177 DC:2019

    BS EN IEC 63203-401-1. Wearable electronic devices and technologies Part 401-1. Devices Systems. Functional elements. Evaluation method of the stretchable resistive strain sensor
    9/13/2019 - PDF - English - BSI
    Learn More
    €23.70

  • 18/30379495 DC:2019

    BS IEC 63203-402-1. Wearable electronic devices and technologies Part 402-1. Devices Systems. Accessory. Test evaluation methods of glove-type motion sensors for measuring finger movements
    9/6/2019 - PDF - English - BSI
    Learn More
    €23.70

  • PR NF IEC 60194-1, C93-730-1PR (09/2019)


    9/1/2019 - Paper - English, French - AFNOR
    Learn More
    €190.09

  • PR NF EN IEC 61189-5-504, C93-735-504PR (09/2019)


    9/1/2019 - Paper - English, French - AFNOR
    Learn More
    €83.64

  • NBN EN 16602-70-60:2019

    Space product assurance - Qualification and Procurement of printed circuit boards
    8/28/2019 - PDF - English - NBN
    Learn More
    €187.00

  • NBN EN 16602-70-60:2019

    Space product assurance - Qualification and Procurement of printed circuit boards
    8/28/2019 - PDF - French - NBN
    Learn More
    €187.00

  • UNE-EN IEC 61188-6-4:2019

    Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (Endorsed by Asociación Española de Normalización in August of 2019.)
    8/1/2019 - PDF - English - AENOR
    Learn More
    €83.00

  • UNE-EN 16602-70-60:2019

    Space product assurance - Qualification and Procurement of printed circuit boards (Endorsed by Asociación Española de Normalización in August of 2019.)
    8/1/2019 - PDF - English - AENOR
    Learn More
    €212.00

  • 19/30400561 DC:2019

    BS EN IEC 63203-406-1. Wearable electronic devices and technologies Part 406-1. Test methods of on-body wearable for measuring skin contact temperature
    7/25/2019 - PDF - English - BSI
    Learn More
    €23.70

  • BS EN 16602-70-60:2019

    Space product assurance. Qualification and Procurement of printed circuit boards
    7/19/2019 - PDF - English - BSI
    Learn More
    €464.52

  • PD IEC TR 61189-5-506:2019

    Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. An intercomparison evaluation to implement the use of fine-pitch surface insulation resistance (SIR) testing solder fluxes in accordance with IEC 61189-5-501
    7/18/2019 - PDF - English - BSI
    Learn More
    €215.67

  • 19/30399798 DC:2019

    BS IEC 62899-402-3. Printed Electronics Part 402-3. Printability. Measurement of qualities. Voids in printed pattern using two-dimensional optical image
    7/16/2019 - PDF - English - BSI
    Learn More
    €23.70

  • BS EN IEC 61188-6-4:2019

    Printed boards and printed board assemblies. Design use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint land design
    7/12/2019 - PDF - English - BSI
    Learn More
    €284.40

  • 19/30392908 DC:2019

    BS IEC 62899-402-3. Printed Electronics Part 402-3. Printability. Measurement of qualities. Voids in printed pattern using two-dimensional optical image
    7/10/2019 - PDF - English - BSI
    Learn More
    €23.70

  • NF EN 16602-70-60, L90-200-70-60 (07/2019)

    Space product assurance - Qualification and Procurement of printed circuit boards - Assurance produit des projets spatiaux - Qualification et approvisionnement des circuits imprimés
    7/1/2019 - Paper - English, French - AFNOR
    Learn More
    €301.91

  • NF EN IEC 61188-6-4, C93-711-6-4 (07/2019)

    Printed boards and printed board assemblies - Design and use - Part 6-4: Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design - Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 6-4: Exigences génériques pour les dessins dimensionnels de CMS du point de vue de la conception de la zone de report
    7/1/2019 - Paper - French - AFNOR
    Learn More
    €119.48

  • IEC TR 61189-5-506:2019

    IEC TR 61189-5-506:2019 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
    6/26/2019 - PDF - English - IEC
    Learn More
    €147.00

  • BS IEC 62899-204:2019

    Printed electronics Materials. Insulator ink. Measurement methods of properties insulator inks and printed insulating layers
    6/7/2019 - PDF - English - BSI
    Learn More
    €215.67

  • 19/30394009 DC:2019

    BS EN IEC 63203-201-3. Wearable electronic devices and technologies Part 201-3. Electronic Textile. Determination of electrical resistance conductive textiles under simulated microclimate
    6/6/2019 - PDF - English - BSI
    Learn More
    €23.70

  • PR NF EN/IEC 62878-2-5, C93-778-2-5PR (06/2019)

    Substrat avec appareil(s) intégré(s) - Partie 2-5 : Mise en oeuvre d'un format de données 3D pour un substrat avec appareil(s) intégré(s)
    6/1/2019 - Paper - English, French - AFNOR
    Learn More
    €116.51

  • UNE-EN IEC 62496-4-1:2019

    Optical circuit boards - Part 4-1: Interface standards - Terminated waveguide OCB assembly using single-row twelve-channel PMT connectors (Endorsed by Asociación Española de Normalización in June of 2019.)
    6/1/2019 - PDF - English - AENOR
    Learn More
    €63.00

  • IEC 62899-204:2019

    IEC 62899-204:2019 Printed electronics - Part 204: Materials - Insulator ink - Measurement methods of properties of insulator inks and printed insulating layers
    5/20/2019 - PDF - English - IEC
    Learn More
    €147.00

  • 19/30357467 DC:2019

    BS IEC 62899-201-2. Printed electronics Part 201-2. Materials. Evaluation method of stretchable substrates
    5/13/2019 - PDF - English - BSI
    Learn More
    €23.70

  • IEC 61188-6-4:2019

    IEC 61188-6-4:2019 Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
    5/2/2019 - PDF - English, French - IEC
    Learn More
    €249.00

  • 19/30384688 DC:2019

    BS EN IEC 61189-5-501. Test methods for electrical materials, printed boards and other interconnection structures assemblies Part 5-501. General test materials assemblies. Surface insulation resistance (SIR) testing of solder fluxes
    4/17/2019 - PDF - English - BSI
    Learn More
    €23.70

  • PD IEC TR 62878-2-7:2019

    Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
    4/1/2019 - PDF - English - BSI
    Learn More
    €154.05

  • IEC TR 62878-2-7:2019

    IEC TR 62878-2-7:2019 Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
    3/20/2019 - PDF - English - IEC
    Learn More
    €71.00

  • 19/30393235 DC:2019

    BS EN IEC 63203-401-1. Wearable electronic devices and technologies Part 401-1. Devices Systems. Functional elements. Evaluation method of the stretchable resistive strain sensor
    3/13/2019 - PDF - English - BSI
    Learn More
    €23.70

  • 19/30393236 DC:2019

    BS EN 63203-101-1. Wearable electronic devices and technologies Part 101-1. Terminology
    3/13/2019 - PDF - English - BSI
    Learn More
    €23.70

  • 19/30393237 DC:2019

    BS EN 63203-204-1. Wearable electronic devices and technologies Part 204-1. Electronic textile. Washable durability test method for leisure sportswear e-textile system
    3/13/2019 - PDF - English - BSI
    Learn More
    €23.70

  • 19/30393238 DC:2019

    BS EN 63203-402-1. Wearable electronic devices and technologies Part 402-1. Devices Systems. Accessory. Test evaluation methods of glove-type motion sensors for measuring finger movements
    3/13/2019 - PDF - English - BSI
    Learn More
    €23.70

  • NF EN 60603-7/A2, C93-430-7/A2 (03/2019)

    Connectors for electronic equipment - Part 7 : detail specification for 8-way, unshielded, free and fixed connectors - Amendement 2 : Connecteurs pour équipements électroniques - Partie 7 : Spécification particulière pour les fiches et les embases non écrantées à 8 voies
    3/1/2019 - Paper - French - AFNOR
    Learn More
    €60.85

  • NF EN IEC 60947-7-4, C63-001-7-4 (03/2019)

    Low-voltage switchgear and controlgear - Part 7-4 : ancillary equipment - PCB terminal blocks for copper conductors - Appareillage à basse tension - Partie 7-4 : Matériels accessoires - Blocs de jonction pour cartes de circuits imprimés pour conducteurs en cuivre
    3/1/2019 - Paper - French - AFNOR
    Learn More
    €107.86

  • PR NF EN IEC 62878-1, C93-778-1PR (03/2019)

    Techniques d'assemblage avec appareil(s) intégré(s) - Partie 1 : Spécification générique pour substrats avec appareil(s) intégré(s)
    3/1/2019 - Paper - French - AFNOR
    Learn More
    €52.27

  • 19/30379185 DC:2019

    BS EN 63203-406-1. Wearable electronic devices and technologies Part 406-1. Test methods of wrist worn wearable for measuring skin contact temperature
    1/31/2019 - PDF - English - BSI
    Learn More
    €23.70

  • BS IEC 62899-202-3:2019

    Printed electronics Materials. Conductive ink. Measurement of sheet resistance conductive films. Contactless method
    1/23/2019 - PDF - English - BSI
    Learn More
    €154.05

  • 19/30371606 DC:2019

    BS EN IEC 62496-2-61. Optical circuit boards Part 2-61. Test methods. Flexibility for flexible optic-electric circuits
    1/23/2019 - PDF - English - BSI
    Learn More
    €23.70

  • IEC 62899-202-3:2019

    IEC 62899-202-3:2019 Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films - Contactless method
    1/16/2019 - PDF - English - IEC
    Learn More
    €71.00

  • BS IEC 62899-201:2016+A1:2018:2019

    Printed electronics Materials. Substrates
    1/3/2019 - PDF - English - BSI
    Learn More
    €300.99

  • UNE-EN IEC 61191-1:2018

    Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (Endorsed by Asociación Española de Normalización in December of 2018.)
    12/1/2018 - PDF - English - AENOR
    Learn More
    €84.00

  • 18/30380691 DC:2018

    BS EN IEC 61249-6-3. Materials for printed boards and other interconnecting structures Part 6-3. Sectional specification set reinforcement materials. Specification finished fabric woven from “E” glass
    11/21/2018 - PDF - English - BSI
    Learn More
    €23.70

  • 18/30379173 DC:2018

    BS EN 61189-2-804. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-804. time to delamination. T260, T288, T300
    11/21/2018 - PDF - English - BSI
    Learn More
    €23.70

  • 18/30372182 DC:2018

    BS EN IEC 61189-2-801. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-801. Thermal conductivity test base materials
    11/21/2018 - PDF - English - BSI
    Learn More
    €23.70

  • 18/30379169 DC:2018

    BS EN IEC 61189-2-803. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-803. Z-Axis Expansion of base materials
    11/19/2018 - PDF - English - BSI
    Learn More
    €23.70

  • IEC 62899-201:2016/AMD1:2018

    IEC 62899-201:2016/AMD1:2018 Amendment 1 - Printed electronics - Part 201: Materials - Substrates
    11/15/2018 - PDF - English - IEC
    Learn More
    €71.00

  • IEC 62899-201:2016+AMD1:2018 Edition 1.1

    IEC 62899-201:2016+AMD1:2018 (Consolidated version) Printed electronics - Part 201: Materials - Substrates
    11/15/2018 - PDF - English - IEC
    Learn More
    €406.00

  • BS EN IEC 61191-1:2018

    Printed board assemblies Generic specification. Requirements for soldered electrical and electronic using surface mount related assembly technologies
    11/13/2018 - PDF - English - BSI
    Learn More
    €284.40

  • DIN EN 61189-5-601:2018-11

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (IEC 91/1518/CD:2018); Text in German and English
    11/1/2018 - PDF - English, German - DIN
    Learn More
    €141.90

  • UNE-EN IEC 61189-2-630:2018

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning (Endorsed by Asociación Española de Normalización in November of 2018.)
    11/1/2018 - PDF - English - AENOR
    Learn More
    €42.00

  • BS EN IEC 61189-2-630:2018

    Test methods for electrical materials, printed board and other interconnection structures assemblies materials structures. Moisture absorption after pressure vessel conditioning
    10/10/2018 - PDF - English - BSI
    Learn More
    €130.35

  • BS IEC 62899-202-5:2018

    Printed electronics Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate
    10/9/2018 - PDF - English - BSI
    Learn More
    €154.05

  • DIN EN 62878-1:2018-10

    Device embedded substrate - Generic specification (IEC 91/1509/CD:2018); Text in German and English
    10/1/2018 - PDF - English, German - DIN
    Learn More
    €103.00

  • DIN EN IEC 61249-2-47 VDE 0322-249-2-47:2018-10

    Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2.0 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-47:2018); German version EN IEC 61249-2-47:2018
    10/1/2018 - Paper - German - VDE
    Learn More
    €74.10

  • DIN EN IEC 61249-2-45 VDE 0322-249-2-45:2018-10

    Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-45:2018); German version EN IEC 61249-2-45:2018
    10/1/2018 - Paper - German - VDE
    Learn More
    €74.10

  • DIN EN IEC 61249-2-46 VDE 0322-249-2-46:2018-10

    Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-46:2018); German version EN IEC 61249-2-46:2018
    10/1/2018 - Paper - German - VDE
    Learn More
    €74.10

  • NF EN IEC 61189-2-630, C93-732-630 (10/2018)

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630 : test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning - Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-630: Méthodes d'essai pour les matériaux de base des cartes imprimées rigides - Absorption d'humidité après conditionnement dans un récipient sous pression
    10/1/2018 - Paper - French - AFNOR
    Learn More
    €46.44

  • IEC 62899-202-5:2018

    IEC 62899-202-5:2018 Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
    9/28/2018 - PDF - English - IEC
    Learn More
    €71.00

  • 18/30383448 DC:2018

    BS EN 60947-4-3. Low-voltage switchgear and controlgear Part 4-3. Contactors motor-starters. Semiconductor controllers semiconductor contactors for non-motor loads
    9/14/2018 - PDF - English - BSI
    Learn More
    €23.70

  • 18/30379181 DC:2018

    BS IEC 63203-204-1. Wearable electronic devices and technologies Part 204-1. Electronic textile. Washable durability test method for leisure sportswear e-textile system
    8/6/2018 - PDF - English - BSI
    Learn More
    €23.70

  • MIL-DTL-32462:2018

    Spider Munition Control Electronics Assembly
    7/17/2018 - PDF sécurisé - English - DODNAV
    Learn More
    €25.00

  • MIL-PRF-31032/4:2018

    Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
    7/14/2018 - PDF sécurisé - English - DODNAV
    Learn More
    €25.00

  • MIL-PRF-31032/1:2018

    Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
    7/11/2018 - PDF sécurisé - English - DODNAV
    Learn More
    €25.00

  • BS IEC 62899-403-1:2018

    Printed electronics Printability. Requirements for reproducibility. Basic patterns evaluation of printing machine
    6/27/2018 - PDF - English - BSI
    Learn More
    €215.67

  • IEC 62899-403-1:2018

    IEC 62899-403-1:2018 Printed electronics - Part 403-1: Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine
    6/21/2018 - PDF - English - IEC
    Learn More
    €147.00

  • MIL-PRF-31032/3:2018

    Printed Wiring Board, Flexible, Single and Double Layer, with or without Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
    6/13/2018 - PDF sécurisé - English - DODNAV
    Learn More
    €25.00

  • MIL-PRF-31032/2:2018

    Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, With or Without Plated-Through Holes, for Soldered Part Mounting
    6/12/2018 - PDF sécurisé - English - DODNAV
    Learn More
    €25.00

  • MIL-DTL-32449:2018

    Spider Transceiver Module
    6/7/2018 - PDF sécurisé - English - DODNAV
    Learn More
    €25.00

  • MIL-DTL-32463:2018

    Spider Munition Control Electronics Assembly Trainer
    6/7/2018 - PDF sécurisé - English - DODNAV
    Learn More
    €25.00

  • IEC 61189-2-630:2018

    IEC 61189-2-630:2018 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning
    6/5/2018 - PDF - English, French - IEC
    Learn More
    €20.00

  • BS IEC 62899-302-2:2018

    Printed electronics Equipment. Inkjet. Imaging-based measurement of droplet volume
    5/18/2018 - PDF - English - BSI
    Learn More
    €154.05

  • BS IEC 62899-303-1:2018

    Printed electronics Equipment. Roll-to-roll printing. Mechanical dimensions
    5/18/2018 - PDF - English - BSI
    Learn More
    €130.35

  • 18/30373795 DC:2018

    BS EN 63185. Balanced-type circular disk resonator method to measure the complex permittivity of low-loss dielectric substrates
    5/9/2018 - PDF - English - BSI
    Learn More
    €23.70

  • 18/30369151 DC:2018

    BS EN 62899-202-7. Printed electronics Part 202-7. Materials. Conductive ink. Measurement of peel strength for printed conductive layer on flexible substrate
    5/9/2018 - PDF - English - BSI
    Learn More
    €23.70

  • DIN EN 61191-2:2018-05

    Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017); German version EN 61191-2:2017
    5/1/2018 - PDF - German - DIN
    Learn More
    €119.60

  • DIN EN 61191-4:2018-05

    Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (IEC 61191-4:2017); German version EN 61191-4:2017
    5/1/2018 - PDF - German - DIN
    Learn More
    €103.00

  • UNE-EN IEC 61249-2-45:2018

    Materials for printed boards and other interconnecting structures – Part 2-45: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
    5/1/2018 - PDF - English - AENOR
    Learn More
    €70.00

  • UNE-EN IEC 61249-2-46:2018

    Materials for printed boards and other interconnecting structures – Part 2-46: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
    5/1/2018 - PDF - English - AENOR
    Learn More
    €70.00

  • UNE-EN IEC 61249-2-47:2018

    Materials for printed boards and other interconnecting structures – Part 2-47: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2.0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
    5/1/2018 - PDF - English - AENOR
    Learn More
    €70.00

  • 18/30366168 DC:2018

    BS EN 62899-202-6. Printed electronics Part 202-6. Materials. Conductive film. Environmental test of a printed metal based conductive layer on flexible substrate
    4/24/2018 - PDF - English - BSI
    Learn More
    €23.70

  • BS EN IEC 61249-2-47:2018

    Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m K) defined flammability (vertical burning test), copper-clad lead-free assembly
    4/18/2018 - PDF - English - BSI
    Learn More
    €215.67

  • BS EN IEC 61249-2-46:2018

    Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) defined flammability (vertical burning test), copper-clad lead-free assembly
    4/16/2018 - PDF - English - BSI
    Learn More
    €215.67

  • BS EN IEC 61189-5-503:2017:2018

    Test methods for electrical materials, printed board and other interconnection structures assemblies General test method materials assemblies. Conductive anodic filaments (CAF) testing of circuit boards
    4/13/2018 - PDF - English - BSI
    Learn More
    €215.67

  • BS EN IEC 61249-2-45:2018

    Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) defined flammability (vertical burning test), copper-clad lead-free assembly
    4/13/2018 - PDF - English - BSI
    Learn More
    €215.67

  • 18/30375223 DC:2018

    BS EN 60947-4-3. Low-voltage switchgear and controlgear Part 4-3. Contactors motor-starters. Semiconductor controllers semiconductor contactors for non-motor loads
    4/10/2018 - PDF - English - BSI
    Learn More
    €23.70

  • 18/30357471 DC:2018

    BS EN 62899-202-4. Printed electronics Part 202-4. Materials. Evaluation method of stretchable functional ink (conductive and insulator layer)
    3/27/2018 - PDF - English - BSI
    Learn More
    €23.70

  • NF EN 16602-70-12, L90-200-70-12 (03/2018)

    Space product assurance - Design rules for printed circuit boards - Assurance produit des projets spatiaux - Règles de conception des circuits imprimés
    3/1/2018 - Paper - French - AFNOR
    Learn More
    €246.02

  • DIN EN 61189-5-504:2018-02

    Test methods for electrical materials, interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) (IEC 91/1467/CD:2017)
    2/1/2018 - PDF - English, German - DIN
    Learn More
    €108.80

  • IEC 61249-2-46:2018

    IEC 61249-2-46:2018 Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
    1/10/2018 - PDF - English - IEC
    Learn More
    €147.00

  • IEC 61249-2-45:2018

    IEC 61249-2-45:2018 Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
    1/10/2018 - PDF - English - IEC
    Learn More
    €147.00

  • IEC 61249-2-47:2018

    IEC 61249-2-47:2018 Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
    1/10/2018 - PDF - English - IEC
    Learn More
    €147.00

  • DIN EN 16602-70-60:2018-01

    Space product assurance - Qualification and Procurement of printed circuit boards; English version prEN 16602-70-60:2017
    1/1/2018 - PDF - English - DIN
    Learn More
    €414.10

  • DIN EN 61189-5-503:2018-01

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (IEC 61189-5-503:2017); German version EN 61189-5-503:2017
    1/1/2018 - PDF - German - DIN
    Learn More
    €108.80

  • IEC 60194-2:2017

    IEC 60194-2:2017 Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
    12/13/2017 - PDF - English - IEC
    Learn More
    €249.00

  • DIN EN 61188-7:2017-12

    Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2017); German version EN 61188-7:2017
    12/1/2017 - PDF - German - DIN
    Learn More
    €103.00

  • DIN EN 61188-6-4:2017-12

    Printed boards and printed board assemblies - Design and use - Part 6-4: Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design (IEC 91/1452/CD:2017)
    12/1/2017 - PDF - English, German - DIN
    Learn More
    €147.20

  • UNE-EN 61191-4:2017

    Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (Endorsed by Asociación Española de Normalización in December of 2017.)
    12/1/2017 - PDF - English - AENOR
    Learn More
    €64.00

  • 17/30352670 DC:2017

    BS IEC 62899-402-2. Printed Electronics Part 402-2. Printability. Measurement of qualitities. Edge waviness
    11/22/2017 - PDF - English - BSI
    Learn More
    €23.70

  • BS EN 61191-4:2017

    Printed board assemblies Sectional specification. Requirements for terminal soldered
    11/20/2017 - PDF - English - BSI
    Learn More
    €215.67

  • BS IEC 62899-301-2:2017

    Printed electronics Equipment. Contact printing. Rigid master. Measurement method of plate master pattern dimension
    11/16/2017 - PDF - English - BSI
    Learn More
    €215.67

  • ASTM F3290-17

    Standard Guide for Handling and Application of a Membrane Switch or Printed Electronic Device to its Final Support Structure
    11/1/2017 - PDF - English - ASTM
    Learn More
    €41.00

  • UNE-EN 61191-2:2017

    Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in November of 2017.)
    11/1/2017 - PDF - English - AENOR
    Learn More
    €76.00

  • UNE-EN 62496-2:2017

    Optical circuit boards - Basic test and measurement procedures - Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards (Endorsed by Asociación Española de Normalización in November of 2017.)
    11/1/2017 - PDF - English - AENOR
    Learn More
    €76.00

  • UNE-EN 61191-3:2017

    Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (Endorsed by Asociación Española de Normalización in October of 2017.)
    10/1/2017 - PDF - English - AENOR
    Learn More
    €65.00

  • BS EN 61188-7:2017

    Printed boards and printed board assemblies. Design use Electronic component zero orientation for CAD library construction
    9/28/2017 - PDF - English - BSI
    Learn More
    €215.67

  • BS EN 61191-3:2017

    Printed board assemblies Sectional specification. Requirements for through-hole mount soldered
    9/25/2017 - PDF - English - BSI
    Learn More
    €215.67

  • 17/30365805 DC:2017

    BS IEC 60194-1. Printed boards design, manufacture and assembly. Vocabulary. Part 1. Common usage in printed board and electronic assembly technologies
    9/1/2017 - PDF - English - BSI
    Learn More
    €42.66

  • UNE-EN 61189-5-503:2017

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (Endorsed by Asociación Española de Normalización in September of 2017.)
    9/1/2017 - PDF - English - AENOR
    Learn More
    €68.00

  • UNE-EN 61188-7:2017

    Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (Endorsed by Asociación Española de Normalización in August of 2017.)
    8/1/2017 - PDF - English - AENOR
    Learn More
    €65.00

  • NF EN 61189-5-503, C93-735-503 (08/2017)


    8/1/2017 - Paper - French - AFNOR
    Learn More
    €98.42

  • IEEE 1149.10-2017

    IEEE Standard for High-Speed Test Access Port and On-Chip Distribution Architecture
    7/28/2017 - PDF - English - IEEE
    Learn More
    €91.08

  • IEEE 1149.10-2017

    IEEE Standard for High-Speed Test Access Port and On-Chip Distribution Architecture
    7/28/2017 - Paper - English - IEEE
    Learn More
    €112.24

  • NF EN 61188-7, C93-711-7 (06/2017)


    6/1/2017 - Paper - French - AFNOR
    Learn More
    €87.39

  • IEC 61189-5-503:2017

    IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
    5/22/2017 - PDF - English, French - IEC
    Learn More
    €147.00

  • IEC 61189-5-503:2017

    IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
    5/22/2017 - PDF - English - IEC
    Learn More
    €147.00

  • IEC 61188-7:2017

    IEC 61188-7:2017 Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
    4/10/2017 - PDF - English, French - IEC
    Learn More
    €107.00

  • IEC 61188-7:2017

    IEC 61188-7:2017 Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
    4/10/2017 - PDF - English - IEC
    Learn More
    €107.00

  • DIN EN 61189-5-1:2017-04

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (IEC 61189-5-1:2016); German version EN 61189-5-1:2016
    4/1/2017 - PDF - German - DIN
    Learn More
    €108.80

  • DIN EN 61189-2-719:2017-04

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (IEC 61189-2-719:2016); German version EN 61189-2-719:2016
    4/1/2017 - PDF - German - DIN
    Learn More
    €96.00

  • BS IEC 62899-402-1:2017

    Printed electronics Printability. Measurement of qualities. Pattern width
    3/31/2017 - PDF - English - BSI
    Learn More
    €154.05

  • BS IEC 62899-401:2017

    Printed electronics Printability. Overview
    3/31/2017 - PDF - English - BSI
    Learn More
    €154.05

  • PD IEC/TR 61189-3-914:2017

    Test methods for electrical materials, printed boards and other interconnection structures assemblies method thermal conductivity of circuit high-brightness LEDs. Guidelines
    3/31/2017 - PDF - English - BSI
    Learn More
    €215.67

  • IEC TR 61189-3-914:2017

    IEC TR 61189-3-914:2017 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
    3/17/2017 - PDF - English - IEC
    Learn More
    €147.00

  • IEC 62899-401:2017

    IEC 62899-401:2017 Printed electronics - Part 401: Printability - Overview
    3/3/2017 - PDF - English - IEC
    Learn More
    €41.00

  • IEC 62899-402-1:2017

    IEC 62899-402-1:2017 Printed electronics - Part 402-1: Printability - Measurement of qualities - Pattern width
    3/3/2017 - PDF - English - IEC
    Learn More
    €71.00

  • DIN EN 61249-2-43 VDE 0322-249-2-43:2017-03

    Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-43:2016); German version EN 61249-2-43:2016
    3/1/2017 - Paper - German - VDE
    Learn More
    €69.60

  • DIN EN 61249-2-44 VDE 0322-249-2-44:2017-03

    Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-44:2016); German version EN 61249-2-44:2016
    3/1/2017 - Paper - German - VDE
    Learn More
    €69.60

  • PD IEC/TR 62899-250:2016:2017

    Printed electronics Material technologies required in printed for wearable smart devices
    1/31/2017 - PDF - English - BSI
    Learn More
    €154.05

  • NF C93-735-1, NF EN 61189-5-1 (12/2016)

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1 : general test methods for materials and assemblies - Guidance for printed board assemblies
    12/23/2016 - PDF - English - UTE
    Learn More
    €91.08

  • NF C93-732-719, NF EN 61189-2-719 (12/2016)

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
    12/23/2016 - PDF - English - UTE
    Learn More
    €91.08

  • IEC TR 62899-250:2016

    IEC TR 62899-250:2016 Printed electronics - Part 250: Material technologies required in printed electronics for wearable smart devices
    12/14/2016 - PDF - English - IEC
    Learn More
    €71.00

  • NF EN 61189-5-1, C93-735-1 (12/2016)

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1 : general test methods for materials and assemblies - Guidance for printed board assemblies - Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 5-1 : Méthodes d'essai générales pour les matériaux et assemblages - Lignes directrices pour les assemblages de cartes à circuit imprimé
    12/1/2016 - Paper - French - AFNOR
    Learn More
    €87.39

  • DIN EN 62326-20:2016-12

    Printed boards - Part 20: Printed circuit boards for high-brightness LEDs (IEC 62326-20:2016); German version EN 62326-20:2016
    12/1/2016 - PDF - German - DIN
    Learn More
    €147.20

  • DIN EN 61189-3-719:2016-12

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016); German version EN 61189-3-719:2016
    12/1/2016 - PDF - German - DIN
    Learn More
    €82.60

  • DIN EN 16602-70-12:2016-12

    Space product assurance - Design rules for printed circuit boards; English version EN 16602-70-12:2016
    12/1/2016 - PDF - English - DIN
    Learn More
    €308.20

  • NF EN 61189-2-719, C93-732-719 (12/2016)

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) - Méthode d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-719 : méthodes d'essai des matériaux pour structures d'interconnexion - Permittivité relative et tangente de perte (500 MHz à 10 GHz).
    12/1/2016 - Paper - French - AFNOR
    Learn More
    €87.39

  • BS IEC 63055:2016

    Format for LSI-Package-Board interoperable design
    11/30/2016 - PDF - English - BSI
    Learn More
    €405.27

  • NBN EN 16602-70-12:2016

    Space product assurance - Design rules for printed circuit boards
    11/23/2016 - PDF - English - NBN
    Learn More
    €155.00

  • NBN EN 16602-70-12:2016

    Space product assurance - Design rules for printed circuit boards
    11/23/2016 - PDF - French - NBN
    Learn More
    €155.00

  • IEC 63055:2016

    IEC 63055:2016 Format for LSI-Package-Board Interoperable design
    11/8/2016 - PDF - English - IEC
    Learn More
    €355.00

  • NF C93-733-719, NF EN 61189-3-719 (11/2016)

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719 : test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
    11/5/2016 - PDF - English - UTE
    Learn More
    €91.08

  • NF EN 61189-3-719, C93-733-719 (11/2016)

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719 : test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling - Méthodes d'essai pour les matériaux électriques, les cartes imprimées, et autres structures d'interconnexion et ensembles - Partie 3-719 : méthodes d'essai pour les structures d'interconnexion (cartes imprimées) - Contrôles de la variation de résistance des trous métallisés uniques (PTH) au cours
    11/1/2016 - Paper - French - AFNOR
    Learn More
    €87.39

  • NF EN 16602-70-28, L90-200-70-28 (11/2016)

    Space product assurance - Repair and modification of printed circuit board assemblies for space use - Assurance produit des projets spatiaux - Réparation et modification des ensembles de circuits imprimés pour utilisation spatiale
    11/1/2016 - Paper - English, French - AFNOR
    Learn More
    €167.55

  • UNE-EN 61189-5-1:2016

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (Endorsed by AENOR in November of 2016.)
    11/1/2016 - PDF - English - AENOR
    Learn More
    €70.00

  • UNE-EN 61189-2-719:2016

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (Endorsed by AENOR in November of 2016.)
    11/1/2016 - PDF - English - AENOR
    Learn More
    €66.00

  • UNE-EN 16602-70-12:2016

    Space product assurance - Design rules for printed circuit boards (Endorsed by AENOR in November of 2016.)
    11/1/2016 - PDF - English - AENOR
    Learn More
    €179.00

  • BS EN 61189-5-1:2016

    Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. Guidance board
    10/31/2016 - PDF - English - BSI
    Learn More
    €215.67

  • BS EN 61189-2-719:2016

    Test methods for electrical materials, printed boards and other interconnection structures assemblies materials structures. Relative permittivity loss tangent (500 MHz to 10 GHz)
    10/31/2016 - PDF - English - BSI
    Learn More
    €215.67

  • BS EN 16602-70-12:2016

    Space product assurance. Design rules for printed circuit boards
    10/31/2016 - PDF - English - BSI
    Learn More
    €405.27

  • NF EN 61249-2-43, C93-780-2-43 (09/2016)

    Materials for printed boards and other interconnecting structures - Part 2-43 : reinforced base materials clad and unclad - Non halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly - Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-43 : matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées renforcées en verre de type E tissé/papier cellulose époxyde non halogéné, plaquées cuivre, d'inflammabilité définie (essai de
    9/1/2016 - Paper - French - AFNOR
    Learn More
    €87.39

  • NF EN 61249-2-44, C93-780-2-44 (09/2016)

    Materials for printed boards and other interconnecting structures - Part 2-44 : reinforced base materials clad and unclad - Non halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly - Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-44 : matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées renforcées en verre de type E tissé/non-tissé époxyde non halogéné, plaquées cuivre, d'inflammabilité définie (essai de
    9/1/2016 - Paper - French - AFNOR
    Learn More
    €87.39

  • PD IEC/TS 61189-3-301:2016

    Test methods for electrical materials, printed boards and other interconnection structures assemblies (printed boards). Appearance inspection method plated surfaces on PWB
    8/31/2016 - PDF - English - BSI
    Learn More
    €154.05

  • NF EN 61188-5-3, C93-711-5-3 (08/2016)

    Printed boards and printed board assemblies - Design and use - Part 5-3 : attachment (land/joint) considerations - Components with gull-wing leads on two sides - Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-3 : considérations sur les liaisons pistes-soudures - Composants à sortie en aile de mouette sur deux côtés
    8/1/2016 - Paper - French - AFNOR
    Learn More
    €98.42

  • UNE-EN 61249-2-43:2016

    Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in August of 2016.)
    8/1/2016 - PDF - English - AENOR
    Learn More
    €15.00

  • UNE-EN 61249-2-44:2016

    Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in August of 2016.)
    8/1/2016 - PDF - English - AENOR
    Learn More
    €66.00

  • BS EN 61249-2-43:2016

    Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly
    7/31/2016 - PDF - English - BSI
    Learn More
    €215.67

  • BS EN 61249-2-44:2016

    Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly
    7/31/2016 - PDF - English - BSI
    Learn More
    €215.67

  • IEC TS 61189-3-301:2016

    IEC TS 61189-3-301:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB
    7/28/2016 - PDF - English - IEC
    Learn More
    €71.00

  • IEC 61189-2-719:2016

    IEC 61189-2-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
    7/12/2016 - PDF - English, French - IEC
    Learn More
    €107.00

  • IEC 61189-5-1:2016

    IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    7/5/2016 - PDF - English, French - IEC
    Learn More
    €178.00

  • NF EN 61188-5-4, C93-711-5-4 (07/2016)

    Printed boards and printed board assemblies - Design and use - Part 5-4 : attachment (land/joint) consideration - Components with J leads on two sides - Cartes imprimées et cartes imprimées équipées
    7/1/2016 - Paper - French - AFNOR
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    €74.67

  • NF EN 61188-5-5, C93-711-5-5 (07/2016)

    Printed boards and printed board assemblies - Design and use - Part 5-5 : Attachment (land/joint) considerations - Components with gull-wing leads on four sides - Cartes imprimées et cartes imprimées équipées
    7/1/2016 - Paper - French - AFNOR
    Learn More
    €119.48

  • NF EN 61188-5-8, C93-711-5-8 (07/2016)

    Printed boards and printed board assemblies - Design and use - Part 5-8 : Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) - Cartes imprimées et cartes imprimées équipées
    7/1/2016 - Paper - French - AFNOR
    Learn More
    €98.42

  • NF EN 62326-20, C93-707-20 (07/2016)

    Printed boards - Part 20 : printed circuit boards for high-brightness LEDs - Cartes imprimées - Partie 20 : cartes de circuits imprimés destinées aux LED à haute luminosité
    7/1/2016 - Paper - French - AFNOR
    Learn More
    €129.98

  • UNE-EN 62326-20:2016

    Printed boards - Part 20: Printed circuit boards for high-brightness LEDs (Endorsed by AENOR in June of 2016.)
    6/1/2016 - PDF - English - AENOR
    Learn More
    €87.00

  • BS EN 62326-20:2016

    Printed boards circuit for high-brightness LEDs
    5/31/2016 - PDF - English - BSI
    Learn More
    €300.99

  • IEC 61249-2-44:2016

    IEC 61249-2-44:2016 Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    5/12/2016 - PDF - English, French - IEC
    Learn More
    €147.00

  • IEC 61249-2-43:2016

    IEC 61249-2-43:2016 Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    5/12/2016 - PDF - English, French - IEC
    Learn More
    €147.00

  • ASTM F1896-16

    Test Method for Determining the Electrical Resistivity of a Printed Conductive Material
    5/1/2016 - PDF - English - ASTM
    Learn More
    €41.00

  • ASTM F1896-16 + Redline

    Test Method for Determining the Electrical Resistivity of a Printed Conductive Material
    5/1/2016 - PDF - English - ASTM
    Learn More
    €48.00

  • UNE-EN 61189-3-719:2016

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (Endorsed by AENOR in May of 2016.)
    5/1/2016 - PDF - English - AENOR
    Learn More
    €57.00

  • IPC A-600J:2016

    Acceptability of Printed Boards
    5/1/2016 - Paper - French - IPC
    Learn More
    €345.60

  • BS EN 61189-3-719:2016

    Test methods for electrical materials, printed boards and other interconnection structures assemblies (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
    4/30/2016 - PDF - English - BSI
    Learn More
    €154.05

  • BS IEC 62899-202:2016

    Printed electronics Materials. Conductive ink
    3/31/2016 - PDF - English - BSI
    Learn More
    €253.59

  • DIN EN 62878-1-1:2016-03

    Device embedded substrate - Part 1-1: Generic specification - Test methods (IEC 62878-1-1:2015); German version EN 62878-1-1:2015
    3/1/2016 - PDF - German - DIN
    Learn More
    €158.30

  • IEC 62899-201:2016

    IEC 62899-201:2016 Printed electronics - Part 201: Materials - Substrates
    2/25/2016 - PDF - English - IEC
    Learn More
    €249.00

  • IEC 62899-202:2016

    IEC 62899-202:2016 Printed electronics - Part 202: Materials - Conductive ink
    2/25/2016 - PDF - English - IEC
    Learn More
    €208.00

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