31.080.99 : Other semiconductor devices
-
DIN EN IEC 60747-16-8:2024-04
Semiconductor devices - Part 16-8: Microwave integrated circuits - Limiters (IEC 60747-16-8:2022), German version EN IEC 60747-16-8:2023
4/1/2024 - PDF - German - DIN
Learn More€120.84 -
DIN EN IEC 60747-16-7:2024-04
Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators (IEC 60747-16-7:2022), German version EN IEC 60747-16-7:2023
4/1/2024 - PDF - German - DIN
Learn More€131.96 -
BS IEC 62047-43:2024
Semiconductor devices. Micro-electromechanical devices Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical
3/22/2024 - PDF - English - BSI
Learn More€180.00 -
BS IEC 62047-44:2024
Semiconductor devices. Micro-electromechanical devices Test methods for dynamic performances of MEMS resonant electric-field-sensitive
2/29/2024 - PDF - English - BSI
Learn More€180.00 -
IEC 62047-44:2024
IEC 62047-44:2024 Semiconductor devices - Micro-electromechanical devices - Part 44: Test methods for dynamic performances of MEMS resonant electric-field-sensitive devices
2/22/2024 - PDF - English - IEC
Learn More€132.00 -
BS IEC 63229:2021
Semiconductor devices. Classification of defects in gallium nitride epitaxial film on silicon carbide substrate
8/31/2023 - PDF - English - BSI
Learn More€250.00 -
BS IEC 62830-7:2021
Semiconductor devices. devices for energy harvesting and generation Linear sliding mode triboelectric
7/7/2023 - PDF - English - BSI
Learn More€293.00 -
BS EN IEC 60747-16-7:2022
Semiconductor devices Microwave integrated circuits. Attenuators
5/25/2023 - PDF - English - BSI
Learn More€331.00 -
BS EN IEC 60747-16-8:2022
Semiconductor devices Microwave integrated circuits. Limiters
5/25/2023 - PDF - English - BSI
Learn More€293.00 -
BS EN IEC 63287-2:2023
Semiconductor devices. Guidelines for reliability qualification plans Concept of mission profile
5/23/2023 - PDF - English - BSI
Learn More€180.00 -
BS IEC 63150-1:2019
Semiconductor devices. Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment Arbitrary random mechanical vibrations
4/13/2023 - PDF - English - BSI
Learn More€293.00 -
BS IEC 62047-37:2020
Semiconductor devices. Micro-electromechanical devices Environmental test methods of MEMS piezoelectric thin films for sensor application
4/5/2023 - PDF - English - BSI
Learn More€180.00 -
BS IEC 60747-5-16:2023
Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of the flat-band voltage GaN-based light diodes based on photocurrent spectroscopy
4/5/2023 - PDF - English - BSI
Learn More€180.00 -
IEC 60747-5-16:2023
IEC 60747-5-16:2023 Semiconductor devices - Part 5-16: Optoelectronic devices - Light emitting diodes - Test method of the flat-band voltage of GaN-based light emitting diodes based on the photocurrent spectroscopy
3/28/2023 - PDF - English - IEC
Learn More€132.00 -
BS IEC 60747-18-4:2023
Semiconductor devices bio sensors. Evaluation method of noise characteristics lens-free CMOS photonic array sensors
3/27/2023 - PDF - English - BSI
Learn More€180.00 -
BS IEC 60747-18-5:2023
Semiconductor devices bio sensors. Evaluation method for light responsivity characteristics of lens-free CMOS photonic array sensor package modules by incident angle
3/23/2023 - PDF - English - BSI
Learn More€180.00 -
IEC 60747-18-4:2023
IEC 60747-18-4:2023 Semiconductor devices - Part 18-4: Semiconductor bio sensors - Evaluation method of noise characteristics of lens-free CMOS photonic array sensors
3/16/2023 - PDF - English - IEC
Learn More€92.00 -
IEC 60747-18-5:2023
IEC 60747-18-5:2023 Semiconductor devices - Part 18-5: Semiconductor bio sensors - Evaluation method for light responsivity characteristics of lens-free CMOS photonic array sensor package modules by incident angle of light
3/16/2023 - PDF - English - IEC
Learn More€92.00 -
BS EN IEC 63364-1:2022
Semiconductor devices. devices for IoT system Test method of sound variation detection
2/2/2023 - PDF - English - BSI
Learn More€180.00 -
BS IEC 62951-8:2023
Semiconductor devices. Flexible and stretchable semiconductor devices Test method for stretchability, flexibility, stability of flexible resistive memory
1/24/2023 - PDF - English - BSI
Learn More€180.00 -
IEC 62951-8:2023
IEC 62951-8:2023 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 8: Test method for stretchability, flexibility, and stability of flexible resistive memory
1/19/2023 - PDF - English - IEC
Learn More€92.00 -
NF EN IEC 60747-16-7, C96-016-7 (01/2023)
Dispositifs à semiconducteurs - Partie 16-7 : circuits intégrés hyperfréquences - Atténuateurs
1/1/2023 - Paper - French - AFNOR
Learn More€141.33 -
NF EN IEC 60747-16-8, C96-016-8 (01/2023)
Dispositifs à semiconducteurs - Partie 16-8 : circuits intégrés hyperfréquences - Limiteurs
1/1/2023 - Paper - French - AFNOR
Learn More€127.67 -
BS IEC 62951-9:2022
Semiconductor devices. Flexible and stretchable semiconductor devices Performance testing methods of one transistor resistor (1T1R) resistive memory cells
12/20/2022 - PDF - English - BSI
Learn More€180.00 -
IEC 63364-1:2022
IEC 63364-1:2022 Semiconductor devices - Semiconductor devices for IoT system - Part 1: Test method of sound variation detection
12/14/2022 - PDF - English, French - IEC
Learn More€92.00 -
IEC 62951-9:2022
IEC 62951-9:2022 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 9: Performance testing methods of one transistor and one resistor (1T1R) resistive memory cells
12/14/2022 - PDF - English - IEC
Learn More€132.00 -
IEC 60747-16-7:2022
IEC 60747-16-7:2022 Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators
11/29/2022 - PDF - English, French - IEC
Learn More€311.00 -
IEC 60747-16-8:2022
IEC 60747-16-8:2022 Semiconductor devices - Part 16-8: Microwave integrated circuits - Limiters
11/29/2022 - PDF - English, French - IEC
Learn More€270.00 -
BS IEC 63284:2022
Semiconductor devices. Reliability test method by inductive load switching for gallium nitride transistors
11/11/2022 - PDF - English - BSI
Learn More€180.00 -
BS IEC 62047-42:2022
Semiconductor devices. Micro-electromechanical devices Measurement methods of electro-mechanical conversion characteristics piezoelectric MEMS cantilever
10/24/2022 - PDF - English - BSI
Learn More€250.00 -
UNE-EN IEC 60747-16-7:2023
Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators (Endorsed by Asociación Española de Normalización in February of 2023.)
10/12/2022 - PDF - English - AENOR
Learn More€81.00 -
UNE-EN IEC 60747-16-8:2023
Semiconductor devices - Part 16-8: Microwave integrated circuits - Limiters (Endorsed by Asociación Española de Normalización in February of 2023.)
10/12/2022 - PDF - English - AENOR
Learn More€76.00 -
UNE-EN IEC 63364-1:2023
Semiconductor devices - Semiconductor devices for IOT system - Part 1: Test method of sound variation detection (Endorsed by Asociación Española de Normalización in March of 2023.)
10/12/2022 - PDF - English - AENOR
Learn More€60.00 -
IEC TR 63357:2022
IEC TR 63357:2022 Semiconductor devices - Standardization roadmap of fault test method for automotive vehicles
10/11/2022 - PDF - English - IEC
Learn More€92.00 -
IEC 62047-42:2022
IEC 62047-42:2022 Semiconductor devices - Micro-electromechanical devices - Part 42: Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever
9/16/2022 - PDF - English - IEC
Learn More€173.00 -
BS IEC 63068-4:2022
Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices Procedure identifying and evaluating using a combined method optical inspection photoluminescence
9/7/2022 - PDF - English - BSI
Learn More€250.00 -
IEC 63068-4:2022
IEC 63068-4:2022 Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 4: Procedure for identifying and evaluating defects using a combined method of optical inspection and photoluminescence
7/27/2022 - PDF - English - IEC
Learn More€173.00 -
BS IEC 60747-5-15:2022
Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of the flat-band voltage based on electroreflectance spectroscopy
7/19/2022 - PDF - English - BSI
Learn More€180.00 -
BS EN IEC 63373:2022
Dynamic on-resistance test method guidelines for GaN HEMT based power conversion devices
6/17/2022 - PDF - English - BSI
Learn More€180.00 -
UNE-EN IEC 63373:2022
Dynamic on-resistance test method guidelines for GaN HEMT based power conversion devices (Endorsed by Asociación Española de Normalización in May of 2022.)
5/1/2022 - PDF - English - AENOR
Learn More€64.00 -
€250.00
-
IEC 60747-5-14:2022
IEC 60747-5-14:2022 Semiconductor devices - Part 5-14: Optoelectronic devices - Light emitting diodes - Test method of the surface temperature based on the thermoreflectance method
3/4/2022 - PDF - English - IEC
Learn More€173.00 -
IEC 63373:2022
IEC 63373:2022 Dynamic on-resistance test method guidelines for GaN HEMT based power conversion devices
2/10/2022 - PDF - English, French - IEC
Learn More€92.00 -
IEC 60747-5-15:2022
IEC 60747-5-15:2022 Semiconductor devices - Part 5-15: Optoelectronic devices - Light emitting diodes - Test method of the flat-band voltage based on the electroreflectance spectroscopy
1/7/2022 - PDF - English - IEC
Learn More€92.00 -
UNE-EN IEC 63244-1:2021
Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications (Endorsed by Asociación Española de Normalización in December of 2021.)
12/1/2021 - PDF - English - AENOR
Learn More€76.00 -
PD IEC TR 60747-5-12:2021
Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of LED efficiencies
11/19/2021 - PDF - English - BSI
Learn More€377.00 -
BS EN IEC 63244-1:2021
Semiconductor devices. devices for wireless power transfer and charging General requirements specifications
11/5/2021 - PDF - English - BSI
Learn More€293.00 -
BS IEC 62830-8:2021
Semiconductor devices. devices for energy harvesting and generation Test evaluation methods of flexible stretchable supercapacitors use in low power electronics
11/4/2021 - PDF - English - BSI
Learn More€293.00 -
IEC 62830-8:2021
IEC 62830-8:2021 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 8: Test and evaluation methods of flexible and stretchable supercapacitors for use in low power electronics
10/22/2021 - PDF - English - IEC
Learn More€270.00 -
IEC TR 60747-5-12:2021
IEC TR 60747-5-12:2021 Semiconductor devices - Part 5-12: Optoelectronic devices - Light emitting diodes - Test method of LED efficiencies
10/13/2021 - PDF - English - IEC
Learn More€397.00 -
BS IEC 62047-40:2021
Semiconductor devices. Micro-electromechanical devices Test methods of micro-electromechanical inertial shock switch threshold
9/14/2021 - PDF - English - BSI
Learn More€151.00 -
IEC 63244-1:2021
IEC 63244-1:2021 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications
9/14/2021 - PDF - English, French - IEC
Learn More€270.00 -
IEC 62047-40:2021
IEC 62047-40:2021 Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold
9/3/2021 - PDF - English - IEC
Learn More€46.00 -
DIN EN IEC 60747-16-6:2021-08
Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers (IEC 60747-16-6:2019), German version EN IEC 60747-16-6:2019
8/1/2021 - PDF - German - DIN
Learn More€110.00 -
DIN EN 60747-16-5:2021-08
Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (IEC 60747-16-5:2013 + A1:2020 + COR1:2020), German version EN 60747-16-5:2013 + A1:2020.
8/1/2021 - PDF - German - DIN
Learn More€131.96 -
BS IEC 62047-38:2021
Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
7/7/2021 - PDF - English - BSI
Learn More€180.00 -
IEC 60747-5-6:2021
IEC 60747-5-6:2021 Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes
7/6/2021 - PDF - English - IEC
Learn More€431.00 -
IEC 60747-5-6:2021 + Redline
IEC 60747-5-6:2021 (Redline version) Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes
7/6/2021 - PDF - English - IEC
Learn More€561.00 -
PD IEC TS 60747-19-2:2021
Semiconductor devices Smart sensors. Indication of specifications sensors and power supplies to drive smart for low operation
7/2/2021 - PDF - English - BSI
Learn More€250.00 -
BS IEC 60747-5-13:2021
Semiconductor devices Optoelectronic devices. Hydrogen sulphide corrosion test for LED packages
6/28/2021 - PDF - English - BSI
Learn More€180.00 -
BS IEC 62047-41:2021
Semiconductor devices. Micro-electromechanical devices RF MEMS circulators and isolators
6/28/2021 - PDF - English - BSI
Learn More€293.00 -
IEC 62047-38:2021
IEC 62047-38:2021 Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection
6/23/2021 - PDF - English - IEC
Learn More€92.00 -
IEC 62047-41:2021
IEC 62047-41:2021 Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators
6/15/2021 - PDF - English, French - IEC
Learn More€270.00 -
IEC 60747-5-13:2021
IEC 60747-5-13:2021 Semiconductor devices - Part 5-13: Optoelectronic devices - Hydrogen sulphide corrosion test for LED packages
6/15/2021 - PDF - English - IEC
Learn More€132.00 -
IEC TS 60747-19-2:2021
IEC TS 60747-19-2:2021 Semiconductor devices - Part 19-2: Smart sensors - Indication of specifications of sensors and power supplies to drive smart sensors for low power operation
5/21/2021 - PDF - English - IEC
Learn More€132.00 -
BS IEC 62047-35:2019
Semiconductor devices. Micro-electromechanical devices Test method of electrical characteristics under bending deformation for flexible electromechanical
4/20/2021 - PDF - English - BSI
Learn More€250.00 -
IEC 63229:2021
IEC 63229:2021 Semiconductor devices - Classification of defects in gallium nitride epitaxial film on silicon carbide substrate
4/7/2021 - PDF - English - IEC
Learn More€173.00 -
IEC 62830-7:2021
IEC 62830-7:2021 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 7: Linear sliding mode triboelectric energy harvesting
3/3/2021 - PDF - English, French - IEC
Learn More€270.00 -
BS IEC 62830-5:2021
Semiconductor devices. devices for energy harvesting and generation Test method measuring generated power from flexible thermoelectric
2/3/2021 - PDF - English - BSI
Learn More€180.00 -
BS EN IEC 60747-17:2020
Semiconductor devices Magnetic and capacitive coupler for basic reinforced insulation
2/3/2021 - PDF - English - BSI
Learn More€348.00 -
IEC 62830-5:2021
IEC 62830-5:2021 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 5: Test method for measuring generated power from flexible thermoelectric devices
1/21/2021 - PDF - English, French - IEC
Learn More€92.00 -
UNE-EN IEC 60747-17:2020
Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation (Endorsed by Asociación Española de Normalización in January of 2021.)
1/1/2021 - PDF - English - AENOR
Learn More€95.00 -
NF EN IEC 60747-17, C96-047 (11/2020)
Semiconductor devices - Part 17 : magnetic and capacitive coupler for basic and reinforced insulation
11/1/2020 - Paper - French - AFNOR
Learn More€153.67 -
BS EN IEC 60904-4:2020
Photovoltaic devices Reference solar devices. Procedures for establishing calibration traceability
10/19/2020 - PDF - English - BSI
Learn More€293.00 -
UNE-EN IEC 62384:2020
DC or AC supplied electronic controlgear for LED modules - Performance requirements
10/7/2020 - PDF - Spanish - AENOR
Learn More€68.00 -
UNE-EN IEC 62384:2020
DC or AC supplied electronic controlgear for LED modules - Performance requirements
10/7/2020 - PDF - English - AENOR
Learn More€81.60 -
UNE-EN IEC 60747-5-5:2020
Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers (Endorsed by Asociación Española de Normalización in October of 2020.)
10/1/2020 - PDF - English - AENOR
Learn More€96.00 -
BS EN 60747-16-5:2013+A1:2020
Semiconductor devices Microwave integrated circuits. Oscillators
9/24/2020 - PDF - English - BSI
Learn More€331.00 -
IEC 60747-17:2020
IEC 60747-17:2020 Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation
9/21/2020 - PDF - English - IEC
Learn More€345.00 -
IEC 60747-17:2020
IEC 60747-17:2020 Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation
9/21/2020 - PDF - English, French - IEC
Learn More€345.00 -
BS IEC 63068-3:2020
Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices Test method using photoluminescence
7/24/2020 - PDF - English - BSI
Learn More€250.00 -
BS IEC 62047-27:2017
Semiconductor devices. Micro-electromechanical devices Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
7/22/2020 - PDF - English - BSI
Learn More€180.00 -
BS IEC 62047-28:2017
Semiconductor devices. Micro-electromechanical devices Performance testing method of vibration-driven MEMS electret energy harvesting
7/22/2020 - PDF - English - BSI
Learn More€180.00 -
BS IEC 62830-1:2017
Semiconductor devices. devices for energy harvesting and generation Vibration based piezoelectric
7/21/2020 - PDF - English - BSI
Learn More€250.00 -
IEC 60747-16-5:2013+AMD1:2020 Edition 1.1
IEC 60747-16-5:2013+AMD1:2020 (Consolidated version) Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
7/14/2020 - PDF - English - IEC
Learn More€443.00 -
IEC 60747-16-5:2013+AMD1:2020 Edition 1.1
IEC 60747-16-5:2013+AMD1:2020 (Consolidated version) Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
7/14/2020 - PDF - English, French - IEC
Learn More€443.00 -
BS EN IEC 62384:2020
DC or AC supplied electronic controlgear for LED modules. Performance requirements
7/13/2020 - PDF - English - BSI
Learn More€180.00 -
IEC 63068-3:2020
IEC 63068-3:2020 Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 3: Test method for defects using photoluminescence
7/13/2020 - PDF - English, French - IEC
Learn More€219.00 -
UNE-EN IEC 62031:2020
LED modules for general lighting - Safety specifications
6/24/2020 - PDF - Spanish - AENOR
Learn More€73.00 -
UNE-EN IEC 62031:2020
LED modules for general lighting - Safety specifications
6/24/2020 - PDF - English - AENOR
Learn More€87.60 -
IEC 62384:2020
IEC 62384:2020 DC or AC supplied electronic controlgear for LED modules - Performance requirements
5/13/2020 - PDF - English, French - IEC
Learn More€92.00 -
IEC 62384:2020 + Redline
IEC 62384:2020 (Redline version) DC or AC supplied electronic controlgear for LED modules - Performance requirements
5/13/2020 - PDF - English - IEC
Learn More€120.00 -
IEC 62047-37:2020
IEC 62047-37:2020 Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application
4/28/2020 - PDF - English, French - IEC
Learn More€132.00 -
€250.00
-
BS IEC 60747-18-3:2019
Semiconductor devices bio sensors. Fluid flow characteristics of lens-free CMOS photonic array sensor package modules with fluidic system
1/14/2020 - PDF - English - BSI
Learn More€250.00 -
BS IEC 60747-5-11:2019
Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of radiative and nonradiative currents light diodes
1/14/2020 - PDF - English - BSI
Learn More€180.00 -
BS IEC 60747-5-10:2019
Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of the internal quantum efficiency based on room-temperature reference point
1/14/2020 - PDF - English - BSI
Learn More€180.00 -
BS IEC 60747-5-9:2019
Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of the internal quantum efficiency based on temperature-dependent electroluminescence
1/14/2020 - PDF - English - BSI
Learn More€180.00 -
IEC 60747-5-10:2019
IEC 60747-5-10:2019 Semiconductor devices - Part 5-10: Optoelectronic devices - Light emitting diodes - Test method of the internal quantum efficiency based on the room-temperature reference point
12/11/2019 - PDF - English - IEC
Learn More€92.00 -
IEC 60747-5-9:2019
IEC 60747-5-9:2019 Semiconductor devices - Part 5-9: Optoelectronic devices - Light emitting diodes - Test method of the internal quantum efficiency based on the temperature-dependent electroluminescence
12/11/2019 - PDF - English - IEC
Learn More€132.00 -
IEC 60747-5-11:2019
IEC 60747-5-11:2019 Semiconductor devices - Part 5-11: Optoelectronic devices - Light emitting diodes - Test method of radiative and nonradiative currents of light emitting diodes
12/11/2019 - PDF - English - IEC
Learn More€92.00 -
IEC 60747-18-3:2019
IEC 60747-18-3:2019 Semiconductor devices - Part 18-3: Semiconductor bio sensors - Fluid flow characteristics of lens-free CMOS photonic array sensor package modules with fluidic system
12/11/2019 - PDF - English - IEC
Learn More€173.00 -
BS IEC 60747-19-1:2019
Semiconductor devices Smart sensors. Control scheme of smart sensors
11/29/2019 - PDF - English - BSI
Learn More€250.00 -
BS IEC 60747-5-8:2019
Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of optoelectronic efficiencies light diodes
11/27/2019 - PDF - English - BSI
Learn More€180.00 -
IEC 62047-35:2019
IEC 62047-35:2019 Semiconductor devices - Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices
11/22/2019 - PDF - English, French - IEC
Learn More€173.00 -
IEC 60747-19-1:2019
IEC 60747-19-1:2019 Semiconductor devices - Part 19-1: Smart sensors - Control scheme of smart sensors
11/22/2019 - PDF - English - IEC
Learn More€173.00 -
IEC 60747-5-8:2019
IEC 60747-5-8:2019 Semiconductor devices - Part 5-8: Optoelectronic devices - Light emitting diodes - Test method of optoelectronic efficiencies of light emitting diodes
11/13/2019 - PDF - English, French - IEC
Learn More€132.00 -
UNE-EN IEC 60747-16-6:2019
Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers (Endorsed by Asociación Española de Normalización in October of 2019.)
10/1/2019 - PDF - English - AENOR
Learn More€72.00 -
BS EN IEC 60747-16-6:2019
Semiconductor devices Microwave integrated circuits. Frequency multipliers
9/2/2019 - PDF - English - BSI
Learn More€250.00 -
BS IEC 62830-6:2019
Semiconductor devices. devices for energy harvesting and generation Test evaluation methods vertical contact mode triboelectric
8/7/2019 - PDF - English - BSI
Learn More€250.00 -
NF EN IEC 60747-16-6, C96-016-6 (08/2019)
Semiconductor devices - Part 16-6 : microwave integrated circuits - Frequency multipliers
8/1/2019 - Paper - French - AFNOR
Learn More€116.50 -
IEC 62830-6:2019
IEC 62830-6:2019 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 6: Test and evaluation methods for vertical contact mode triboelectric energy harvesting devices
7/25/2019 - PDF - English - IEC
Learn More€173.00 -
IEC 60747-16-6:2019
IEC 60747-16-6:2019 Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers
6/26/2019 - PDF - English, French - IEC
Learn More€173.00 -
BS IEC 60747-18-1:2019
Semiconductor devices bio sensors. Test method and data analysis for calibration of lens-free CMOS photonic array sensors
6/7/2019 - PDF - English - BSI
Learn More€250.00 -
IEC 60747-18-1:2019
IEC 60747-18-1:2019 Semiconductor devices - Part 18-1: Semiconductor bio sensors - Test method and data analysis for calibration of lens-free CMOS photonic array sensors
5/20/2019 - PDF - English - IEC
Learn More€219.00 -
BS IEC 62951-6:2019
Semiconductor devices. Flexible and stretchable semiconductor devices Test method for sheet resistance of flexible conducting films
5/15/2019 - PDF - English - BSI
Learn More€250.00 -
BS IEC 63068-1:2019
Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices Classification
5/10/2019 - PDF - English - BSI
Learn More€250.00 -
IEC 63150-1:2019
IEC 63150-1:2019 Semiconductor devices - Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment - Part 1: Arbitrary and random mechanical vibrations
5/10/2019 - PDF - English, French - IEC
Learn More€270.00 -
IEC 62951-6:2019
IEC 62951-6:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films
5/6/2019 - PDF - English, French - IEC
Learn More€173.00 -
BS IEC 62951-2:2019
Semiconductor devices. Flexible and stretchable semiconductor devices Evaluation method for electron mobility, sub-threshold swing, threshold voltage of flexible
4/30/2019 - PDF - English - BSI
Learn More€151.00 -
BS IEC 62047-36:2019
Semiconductor devices. Micro-electromechanical devices Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
4/24/2019 - PDF - English - BSI
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BS IEC 62047-33:2019
Semiconductor devices. Micro-electromechanical devices MEMS piezoresistive pressure-sensitive device
4/18/2019 - PDF - English - BSI
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BS IEC 62047-31:2019
Semiconductor devices. Micro-electromechanical devices Four-point bending test method for interfacial adhesion energy of layered MEMS materials
4/17/2019 - PDF - English - BSI
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IEC 62951-2:2019
IEC 62951-2:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 2: Evaluation method for electron mobility, sub-threshold swing and threshold voltage of flexible devices
4/17/2019 - PDF - English, French - IEC
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BS IEC 62047-34:2019
Semiconductor devices. Micro-electromechanical devices Test methods for MEMS piezoresistive pressure-sensitive device on wafer
4/16/2019 - PDF - English - BSI
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IEC 62047-31:2019
IEC 62047-31:2019 Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials
4/5/2019 - PDF - English - IEC
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IEC 62047-33:2019
IEC 62047-33:2019 Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device
4/5/2019 - PDF - English - IEC
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IEC 62047-34:2019
IEC 62047-34:2019 Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer
4/5/2019 - PDF - English - IEC
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IEC 62047-36:2019
IEC 62047-36:2019 Semiconductor devices - Micro-electromechanical devices - Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
4/5/2019 - PDF - English - IEC
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BS IEC 62951-7:2019
Semiconductor devices. Flexible and stretchable semiconductor devices Test method for characterizing the barrier performance of thin film encapsulation flexible organic
3/6/2019 - PDF - English - BSI
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BS IEC 62951-5:2019
Semiconductor devices. Flexible and stretchable semiconductor devices Test method for thermal characteristics of flexible materials
3/5/2019 - PDF - English - BSI
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BS IEC 62951-4:2019
Semiconductor devices. Flexible and stretchable semiconductor devices Fatigue evaluation for flexible conductive thin film on the substrate
3/5/2019 - PDF - English - BSI
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BS IEC 62830-4:2019
Semiconductor devices. devices for energy harvesting and generation Test evaluation methods flexible piezoelectric
3/5/2019 - PDF - English - BSI
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IEC 62830-4:2019
IEC 62830-4:2019 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 4: Test and evaluation methods for flexible piezoelectric energy harvesting devices
2/27/2019 - PDF - English, French - IEC
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IEC 62951-4:2019
IEC 62951-4:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
2/27/2019 - PDF - English, French - IEC
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IEC 62951-5:2019
IEC 62951-5:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials
2/27/2019 - PDF - English, French - IEC
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IEC 62951-7:2019
IEC 62951-7:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor
2/27/2019 - PDF - English, French - IEC
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BS IEC 63068-2:2019
Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices Test method using optical inspection
2/8/2019 - PDF - English - BSI
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IEC 63068-1:2019
IEC 63068-1:2019 Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 1: Classification of defects
1/30/2019 - PDF - English - IEC
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IEC 63068-2:2019
IEC 63068-2:2019 Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 2: Test method for defects using optical inspection
1/30/2019 - PDF - English - IEC
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BS IEC 62047-32:2019
Semiconductor devices. Micro-electromechanical devices Test method for the nonlinear vibration of MEMS resonators
1/29/2019 - PDF - English - BSI
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IEC 62047-32:2019
IEC 62047-32:2019 Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonlinear vibration of MEMS resonators
1/24/2019 - PDF - English, French - IEC
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IEC 60050-523:2018
IEC 60050-523:2018 International Electrotechnical Vocabulary (IEV) - Part 523: Micro-electromechanical devices
12/6/2018 - PDF - English, French - IEC
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BS IEC 62951-3:2018
Semiconductor devices. Flexible and stretchable semiconductor devices Evaluation of thin film transistor characteristics on flexible substrates under bulging
11/15/2018 - PDF - English - BSI
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IEC 62951-3:2018
IEC 62951-3:2018 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 3: Evaluation of thin film transistor characteristics on flexible substrates under bulging
11/7/2018 - PDF - English - IEC
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UNE-EN IEC 62969-4:2018
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors (Endorsed by Asociación Española de Normalización in October of 2018.)
10/1/2018 - PDF - English - AENOR
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BS EN IEC 62969-4:2018
Semiconductor devices. interface for automotive vehicles Evaluation method of data vehicle sensors
8/30/2018 - PDF - English - BSI
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UNE-EN IEC 62969-3:2018
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors (Endorsed by Asociación Española de Normalización in August of 2018.)
8/1/2018 - PDF - English - AENOR
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BS EN IEC 62969-3:2018
Semiconductor devices. interface for automotive vehicles Shock driven piezoelectric energy harvesting vehicle sensors
6/28/2018 - PDF - English - BSI
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IEC 62969-4:2018
IEC 62969-4:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors
6/18/2018 - PDF - English, French - IEC
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UNE-EN IEC 62969-2:2018
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors (Endorsed by Asociación Española de Normalización in June of 2018.)
6/1/2018 - PDF - English - AENOR
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IEC 62969-3:2018
IEC 62969-3:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors
5/7/2018 - PDF - English, French - IEC
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BS IEC 62951-1:2017
Semiconductor devices. Flexible and stretchable semiconductor devices Bending test method for conductive thin films on flexible substrates
5/4/2018 - PDF - English - BSI
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BS EN IEC 62969-2:2018
Semiconductor devices. interface for automotive vehicles Efficiency evaluation methods of wireless power transmission using resonance sensors
5/2/2018 - PDF - English - BSI
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BS EN 60747-16-1:2002+A2:2017
Semiconductor devices Microwave integrated circuits. Amplifiers
4/10/2018 - PDF - English - BSI
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DIN EN 60747-16-4:2018-04
Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches (IEC 60747-16-4:2004 + A1:2009 + A2:2017), German version EN 60747-16-4:2004 + A1:2011 + A2:2017.
4/1/2018 - PDF - German - DIN
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DIN EN 60747-16-3:2018-04
Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (IEC 60747-16-3:2002 + A1:2009 + A2:2017), German version EN 60747-16-3:2002 + A1:2009 + A2:2017.
4/1/2018 - PDF - German - DIN
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BS EN 60747-16-4:2004+A2:2017
Semiconductor devices Microwave integrated circuits. Switches
3/16/2018 - PDF - English - BSI
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BS IEC 62047-29:2017
Semiconductor devices. Micro-electromechanical devices Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
3/15/2018 - PDF - English - BSI
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IEC 62031:2018
IEC 62031:2018 LED modules for general lighting - Safety specifications
3/8/2018 - PDF - English, French - IEC
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IEC 62969-2:2018
IEC 62969-2:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
3/8/2018 - PDF - English, French - IEC
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IEC 62031:2018 + Redline
IEC 62031:2018 (Redline version) LED modules for general lighting - Safety specifications
3/8/2018 - PDF - English - IEC
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UNE-EN IEC 62969-1:2018
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors (Endorsed by Asociación Española de Normalización in March of 2018.)
3/1/2018 - PDF - English - AENOR
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BS EN 60747-16-3:2002+A2:2017
Semiconductor devices Microwave integrated circuits. Frequency converters
2/23/2018 - PDF - English - BSI
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BS EN IEC 62969-1:2018
Semiconductor devices. interface for automotive vehicles General requirements of power vehicle sensors
2/22/2018 - PDF - English - BSI
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IEC 62969-1:2017
IEC 62969-1:2017 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
12/13/2017 - PDF - English - IEC
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IEC 62969-1:2017
IEC 62969-1:2017 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
12/13/2017 - PDF - English, French - IEC
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IEC 62047-29:2017
IEC 62047-29:2017 Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
11/22/2017 - PDF - English - IEC
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BS IEC 62047-30:2017
Semiconductor devices. Micro-electromechanical devices Measurement methods of electro-mechanical conversion characteristics MEMS piezoelectric thin film
10/9/2017 - PDF - English - BSI
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DIN EN 60747-16-1:2017-10
Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers (IEC 60747-16-1:2001 - A1:2007 - A2:2017), German version EN 60747-16-1:2002 + A1:2007 + A2:2017.
10/1/2017 - PDF - German - DIN
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DIN EN 62477-1 VDE 0558-477-1:2017-10
Safety requirements for power electronic converter systems and equipment - Part 1: General (IEC 62477-1:2012 + A1:2016), German version EN 62477-1:2012 + A11:2014 + A1:2017
10/1/2017 - Paper - German - VDE
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IEC 62047-30:2017
IEC 62047-30:2017 Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
9/15/2017 - PDF - English - IEC
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IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 Edition 1.2
IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 (Consolidated version) Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
8/16/2017 - PDF - English, French - IEC
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IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 Edition 1.2
IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 (Consolidated version) Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
8/16/2017 - PDF - English - IEC
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IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 Edition 1.2
IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 (Consolidated version) Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
8/16/2017 - PDF - English - IEC
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IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 Edition 1.2
IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 (Consolidated version) Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
8/16/2017 - PDF - English, French - IEC
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BS IEC 62830-2:2017
Semiconductor devices. devices for energy harvesting and generation Thermo power based thermoelectric
8/10/2017 - PDF - English - BSI
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BS EN 62830-3:2017
Semiconductor devices. devices for energy harvesting and generation Vibration based electromagnetic
4/30/2017 - PDF - English - BSI
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IEC 62951-1:2017
IEC 62951-1:2017 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates
4/10/2017 - PDF - English - IEC
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DIN EN 62047-25:2017-04
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016), German version EN 62047-25:2016
4/1/2017 - PDF - German - DIN
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IEC 62830-3:2017
IEC 62830-3:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting
3/28/2017 - PDF - English, French - IEC
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JIS C 5630-1:2017
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
3/21/2017 - PDF - Japanese - JSA
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IEC 62830-1:2017
IEC 62830-1:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting
3/3/2017 - PDF - English, French - IEC
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IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 Edition 1.2
IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 (Consolidated version) Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
2/15/2017 - PDF - English, French - IEC
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IEC 62830-2:2017
IEC 62830-2:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
1/20/2017 - PDF - English, French - IEC
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IEC 62047-28:2017
IEC 62047-28:2017 Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices
1/20/2017 - PDF - English - IEC
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IEC 62047-27:2017
IEC 62047-27:2017 Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
1/20/2017 - PDF - English - IEC
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DIN VDE V 0884-11 VDE V 0884-11:2017-01
Semiconductor devices - Part 11: Magnetic and capacitive coupler for basic and reinforced isolation
1/1/2017 - Paper - German - VDE
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UNE-EN 62047-25:2016
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (Endorsed by Asociación Española de Normalización in January of 2017.)
1/1/2017 - PDF - English - AENOR
Learn More€68.00 -
NF EN 62047-25, C96-050-25 (12/2016)
Semiconductor devices - Micro-electromechanical devices - Part 25 : silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
12/1/2016 - Paper - French - AFNOR
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BS EN 62047-25:2016
Semiconductor devices. Micro-electromechanical devices Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength micro bonding area
11/30/2016 - PDF - English - BSI
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IEC 62047-25:2016
IEC 62047-25:2016 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
8/29/2016 - PDF - English, French - IEC
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UNE-EN 62047-26:2016
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (Endorsed by AENOR in June of 2016.)
6/1/2016 - PDF - English - AENOR
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BS EN 62047-26:2016
Semiconductor devices. Micro-electromechanical devices Description and measurement methods for micro trench needle structures
5/31/2016 - PDF - English - BSI
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UNE-EN 62047-1:2016
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (Endorsed by AENOR in May of 2016.)
5/1/2016 - PDF - English - AENOR
Learn More€74.00 -
BS EN 62047-1:2016
Semiconductor devices. Micro-electromechanical devices Terms and definitions
4/30/2016 - PDF - English - BSI
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JIS C 6790:2016
Load test of a bolt-clamped Langevin vibrator using wattmeter method
3/22/2016 - PDF - Japanese - JSA
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IEC 60747-5-7:2016
IEC 60747-5-7:2016 Semiconductor devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors
2/23/2016 - PDF - English, French - IEC
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IEC 62047-26:2016
IEC 62047-26:2016 Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
1/7/2016 - PDF - English, French - IEC
Learn More€219.00 -
IEC 62047-1:2016
IEC 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
1/6/2016 - PDF - English, French - IEC
Learn More€270.00