31.080.99 : Other semiconductor devices

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  • IEC 62384:2020

    IEC 62384:2020 DC or AC supplied electronic controlgear for LED modules - Performance requirements
    5/13/2020 - PDF - English, French - IEC
    Learn More
    €71.00

  • IEC 62384:2020 + Redline

    IEC 62384:2020 (Redline version) DC or AC supplied electronic controlgear for LED modules - Performance requirements
    5/13/2020 - PDF - English - IEC
    Learn More
    €92.00

  • IEC 62047-37:2020

    IEC 62047-37:2020 Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application
    4/28/2020 - PDF - English, French - IEC
    Learn More
    €107.00

  • 20/30409285 DC:2020

    BS IEC 63284. Semiconductor devices. Reliability test method of on-stress reliability by inductive load switching for gallium nitride transistors
    4/1/2020 - PDF - English - BSI
    Learn More
    €23.70

  • 20/30406234 DC:2020

    BS IEC 63275-2 Ed.1.0. Semiconductor devices. Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors Part 2. Test bipolar degradation by body diode operating
    4/1/2020 - PDF - English - BSI
    Learn More
    €23.70

  • BS EN IEC 62031:2020

    LED modules for general lighting. Safety specifications
    3/19/2020 - PDF - English - BSI
    Learn More
    €215.67

  • 20/30404574 DC:2020

    BS EN IEC 62047-41. Semiconductor devices. Micro-electromechanical devices Part 41. RF MEMS Circulators and Isolators
    3/6/2020 - PDF - English - BSI
    Learn More
    €23.70

  • 20/30404083 DC:2020

    BS IEC 62047-38. Semiconductor devices. Micro-electromechanical devices Part 38. Test method for adhesion strength of metal powder paste in MEMS interconnection
    2/7/2020 - PDF - English - BSI
    Learn More
    €23.70

  • BS IEC 60747-18-3:2019

    Semiconductor devices bio sensors. Fluid flow characteristics of lens-free CMOS photonic array sensor package modules with fluidic system
    1/14/2020 - PDF - English - BSI
    Learn More
    €215.67

  • BS IEC 60747-5-11:2019

    Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of radiative and nonradiative currents light diodes
    1/14/2020 - PDF - English - BSI
    Learn More
    €154.05

  • BS IEC 60747-5-10:2019

    Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of the internal quantum efficiency based on room-temperature reference point
    1/14/2020 - PDF - English - BSI
    Learn More
    €154.05

  • BS IEC 60747-5-9:2019

    Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of the internal quantum efficiency based on temperature-dependent electroluminescence
    1/14/2020 - PDF - English - BSI
    Learn More
    €154.05

  • BS EN IEC 60904-4:2019

    Photovoltaic devices Reference solar devices. Procedures for establishing calibration traceability
    1/9/2020 - PDF - English - BSI
    Learn More
    €253.59

  • IEC 60747-18-3:2019

    IEC 60747-18-3:2019 Semiconductor devices - Part 18-3: Semiconductor bio sensors - Fluid flow characteristics of lens-free CMOS photonic array sensor package modules with fluidic system
    12/11/2019 - PDF - English - IEC
    Learn More
    €147.00

  • IEC 60747-5-10:2019

    IEC 60747-5-10:2019 Semiconductor devices - Part 5-10: Optoelectronic devices - Light emitting diodes - Test method of the internal quantum efficiency based on the room-temperature reference point
    12/11/2019 - PDF - English - IEC
    Learn More
    €71.00

  • IEC 60747-5-9:2019

    IEC 60747-5-9:2019 Semiconductor devices - Part 5-9: Optoelectronic devices - Light emitting diodes - Test method of the internal quantum efficiency based on the temperature-dependent electroluminescence
    12/11/2019 - PDF - English - IEC
    Learn More
    €107.00

  • IEC 60747-5-11:2019

    IEC 60747-5-11:2019 Semiconductor devices - Part 5-11: Optoelectronic devices - Light emitting diodes - Test method of radiative and nonradiative currents of light emitting diodes
    12/11/2019 - PDF - English - IEC
    Learn More
    €71.00

  • BS IEC 60747-19-1:2019

    Semiconductor devices Smart sensors. Control scheme of smart sensors
    11/29/2019 - PDF - English - BSI
    Learn More
    €215.67

  • BS IEC 60747-5-8:2019

    Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of optoelectronic efficiencies light diodes
    11/27/2019 - PDF - English - BSI
    Learn More
    €154.05

  • IEC 60747-19-1:2019

    IEC 60747-19-1:2019 Semiconductor devices - Part 19-1: Smart sensors - Control scheme of smart sensors
    11/22/2019 - PDF - English - IEC
    Learn More
    €147.00

  • IEC 62047-35:2019

    IEC 62047-35:2019 Semiconductor devices - Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices
    11/22/2019 - PDF - English, French - IEC
    Learn More
    €147.00

  • IEC 60747-5-8:2019

    IEC 60747-5-8:2019 Semiconductor devices - Part 5-8: Optoelectronic devices - Light emitting diodes - Test method of optoelectronic efficiencies of light emitting diodes
    11/13/2019 - PDF - English, French - IEC
    Learn More
    €107.00

  • PR NF EN 60747-16-5/A1, C96-016-5/A1PR (11/2019)


    11/1/2019 - Paper - English, French - AFNOR
    Learn More
    €42.59

  • IEC 60050-523:2018/AMD1:2019

    IEC 60050-523:2018/AMD1:2019 Amendment 1 - International Electrotechnical Vocabulary (IEV) - Part 523: Micro-electromechanical systems (MEMS)
    10/17/2019 - PDF - English, French - IEC
    Learn More
    €10.00

  • UNE-EN IEC 60747-16-6:2019

    Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers (Endorsed by Asociación Española de Normalización in October of 2019.)
    10/1/2019 - PDF - English - AENOR
    Learn More
    €72.00

  • 19/30393894 DC:2019

    BS EN 60747-16-5 AMD1. Semiconductor devices Part 16-5. Microwave integrated circuits. Oscillators
    9/13/2019 - PDF - English - BSI
    Learn More
    €23.70

  • BS EN IEC 60747-16-6:2019

    Semiconductor devices Microwave integrated circuits. Frequency multipliers
    9/2/2019 - PDF - English - BSI
    Learn More
    €215.67

  • BS IEC 62830-6:2019

    Semiconductor devices. devices for energy harvesting and generation Test evaluation methods vertical contact mode triboelectric
    8/7/2019 - PDF - English - BSI
    Learn More
    €215.67

  • NF EN IEC 60747-16-6, C96-016-6 (08/2019)


    8/1/2019 - Paper - French - AFNOR
    Learn More
    €98.42

  • IEC 62830-6:2019

    IEC 62830-6:2019 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 6: Test and evaluation methods for vertical contact mode triboelectric energy harvesting devices
    7/25/2019 - PDF - English - IEC
    Learn More
    €147.00

  • PR NF EN IEC 60747-17, C96-017PR (07/2019)

    Dispositifs à semiconducteurs - Partie 17 : Coupleur magnétique et capacitif pour l'isolation principale et renforcée
    7/1/2019 - Paper - English, French - AFNOR
    Learn More
    €116.51

  • IEC 60747-16-6:2019

    IEC 60747-16-6:2019 Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers
    6/26/2019 - PDF - English, French - IEC
    Learn More
    €147.00

  • BS IEC 60747-18-1:2019

    Semiconductor devices bio sensors. Test method and data analysis for calibration of lens-free CMOS photonic array sensors
    6/7/2019 - PDF - English - BSI
    Learn More
    €215.67

  • IEC 60747-18-1:2019

    IEC 60747-18-1:2019 Semiconductor devices - Part 18-1: Semiconductor bio sensors - Test method and data analysis for calibration of lens-free CMOS photonic array sensors
    5/20/2019 - PDF - English - IEC
    Learn More
    €178.00

  • BS IEC 62951-6:2019

    Semiconductor devices. Flexible and stretchable semiconductor devices Test method for sheet resistance of flexible conducting films
    5/15/2019 - PDF - English - BSI
    Learn More
    €215.67

  • BS IEC 63068-1:2019

    Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices Classification
    5/10/2019 - PDF - English - BSI
    Learn More
    €215.67

  • IEC 63150-1:2019

    IEC 63150-1:2019 Semiconductor devices - Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment - Part 1: Arbitrary and random mechanical vibrations
    5/10/2019 - PDF - English, French - IEC
    Learn More
    €208.00

  • IEC 62951-6:2019

    IEC 62951-6:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films
    5/6/2019 - PDF - English, French - IEC
    Learn More
    €147.00

  • BS IEC 62951-2:2019

    Semiconductor devices. Flexible and stretchable semiconductor devices Evaluation method for electron mobility, sub-threshold swing, threshold voltage of flexible
    4/30/2019 - PDF - English - BSI
    Learn More
    €130.35

  • BS IEC 62047-36:2019

    Semiconductor devices. Micro-electromechanical devices Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
    4/24/2019 - PDF - English - BSI
    Learn More
    €154.05

  • BS IEC 62047-33:2019

    Semiconductor devices. Micro-electromechanical devices MEMS piezoresistive pressure-sensitive device
    4/18/2019 - PDF - English - BSI
    Learn More
    €215.67

  • BS IEC 62047-31:2019

    Semiconductor devices. Micro-electromechanical devices Four-point bending test method for interfacial adhesion energy of layered MEMS materials
    4/17/2019 - PDF - English - BSI
    Learn More
    €154.05

  • IEC 62951-2:2019

    IEC 62951-2:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 2: Evaluation method for electron mobility, sub-threshold swing and threshold voltage of flexible devices
    4/17/2019 - PDF - English, French - IEC
    Learn More
    €41.00

  • BS IEC 62047-34:2019

    Semiconductor devices. Micro-electromechanical devices Test methods for MEMS piezoresistive pressure-sensitive device on wafer
    4/16/2019 - PDF - English - BSI
    Learn More
    €154.05

  • IEC 62047-31:2019

    IEC 62047-31:2019 Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials
    4/5/2019 - PDF - English - IEC
    Learn More
    €71.00

  • IEC 62047-33:2019

    IEC 62047-33:2019 Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device
    4/5/2019 - PDF - English - IEC
    Learn More
    €147.00

  • IEC 62047-34:2019

    IEC 62047-34:2019 Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer
    4/5/2019 - PDF - English - IEC
    Learn More
    €71.00

  • IEC 62047-36:2019

    IEC 62047-36:2019 Semiconductor devices - Micro-electromechanical devices - Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
    4/5/2019 - PDF - English - IEC
    Learn More
    €71.00

  • BS IEC 62951-7:2019

    Semiconductor devices. Flexible and stretchable semiconductor devices Test method for characterizing the barrier performance of thin film encapsulation flexible organic
    3/6/2019 - PDF - English - BSI
    Learn More
    €154.05

  • BS IEC 62951-5:2019

    Semiconductor devices. Flexible and stretchable semiconductor devices Test method for thermal characteristics of flexible materials
    3/5/2019 - PDF - English - BSI
    Learn More
    €154.05

  • BS IEC 62951-4:2019

    Semiconductor devices. Flexible and stretchable semiconductor devices Fatigue evaluation for flexible conductive thin film on the substrate
    3/5/2019 - PDF - English - BSI
    Learn More
    €154.05

  • BS IEC 62830-4:2019

    Semiconductor devices. devices for energy harvesting and generation Test evaluation methods flexible piezoelectric
    3/5/2019 - PDF - English - BSI
    Learn More
    €253.59

  • IEC 62830-4:2019

    IEC 62830-4:2019 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 4: Test and evaluation methods for flexible piezoelectric energy harvesting devices
    2/27/2019 - PDF - English, French - IEC
    Learn More
    €208.00

  • IEC 62951-4:2019

    IEC 62951-4:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
    2/27/2019 - PDF - English, French - IEC
    Learn More
    €71.00

  • IEC 62951-5:2019

    IEC 62951-5:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials
    2/27/2019 - PDF - English, French - IEC
    Learn More
    €107.00

  • IEC 62951-7:2019

    IEC 62951-7:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor
    2/27/2019 - PDF - English, French - IEC
    Learn More
    €71.00

  • 19/30392174 DC:2019

    BS EN 60747-5-6. Semiconductor devices Part 5-6. Optoelectronic devices. Light emitting diodes
    2/21/2019 - PDF - English - BSI
    Learn More
    €23.70

  • BS IEC 63068-2:2019

    Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices Test method using optical inspection
    2/8/2019 - PDF - English - BSI
    Learn More
    €215.67

  • IEC 63068-1:2019

    IEC 63068-1:2019 Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 1: Classification of defects
    1/30/2019 - PDF - English - IEC
    Learn More
    €147.00

  • IEC 63068-2:2019

    IEC 63068-2:2019 Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 2: Test method for defects using optical inspection
    1/30/2019 - PDF - English - IEC
    Learn More
    €147.00

  • BS IEC 62047-32:2019

    Semiconductor devices. Micro-electromechanical devices Test method for the nonlinear vibration of MEMS resonators
    1/29/2019 - PDF - English - BSI
    Learn More
    €154.05

  • IEC 62047-32:2019

    IEC 62047-32:2019 Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonlinear vibration of MEMS resonators
    1/24/2019 - PDF - English, French - IEC
    Learn More
    €107.00

  • 19/30364443 DC:2019

    BS EN IEC 62047-35. Semiconductor devices. Micro-electromechanical devices Part 35. Test method of electrical characteristics under bending deformation for flexible and foldable electro-mechanical
    1/4/2019 - PDF - English - BSI
    Learn More
    €23.70

  • IEC 60050-523:2018

    IEC 60050-523:2018 International Electrotechnical Vocabulary (IEV) - Part 523: Micro-electromechanical devices
    12/6/2018 - PDF - English, French - IEC
    Learn More
    €147.00

  • 18/30383935 DC:2018

    BS EN IEC 62047-37. Semiconductor devices. Micro-electromechanical devices Part 37. Environmental test methods of MEMS piezoelectric thin films for sensor application
    12/4/2018 - PDF - English - BSI
    Learn More
    €23.70

  • BS IEC 62951-3:2018

    Semiconductor devices. Flexible and stretchable semiconductor devices Evaluation of thin film transistor characteristics on flexible substrates under bulging
    11/15/2018 - PDF - English - BSI
    Learn More
    €215.67

  • IEC 62951-3:2018

    IEC 62951-3:2018 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 3: Evaluation of thin film transistor characteristics on flexible substrates under bulging
    11/7/2018 - PDF - English - IEC
    Learn More
    €147.00

  • UNE-EN IEC 62969-4:2018

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors (Endorsed by Asociación Española de Normalización in October of 2018.)
    10/1/2018 - PDF - English - AENOR
    Learn More
    €68.00

  • BS EN IEC 62969-4:2018

    Semiconductor devices. interface for automotive vehicles Evaluation method of data vehicle sensors
    8/30/2018 - PDF - English - BSI
    Learn More
    €215.67

  • NF EN IEC 62969-4, C96-069-4 (08/2018)

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4 : evaluation method of data interface for automotive vehicle sensors - Dispositifs à semiconducteurs - Interface à semiconducteurs pour les véhicules automobiles - Partie 4: Méthode d'évaluation de l'interface de données destinée aux capteurs de véhicules automobiles
    8/1/2018 - Paper - French - AFNOR
    Learn More
    €74.67

  • UNE-EN IEC 62969-3:2018

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors (Endorsed by Asociación Española de Normalización in August of 2018.)
    8/1/2018 - PDF - English - AENOR
    Learn More
    €71.00

  • 18/30381200 DC:2018

    BS IEC 60747-17. Semiconductor devices Part 17. Magnetic and capacitive coupler for basic reinforced isolation
    7/20/2018 - PDF - English - BSI
    Learn More
    €23.70

  • BS EN IEC 62969-3:2018

    Semiconductor devices. interface for automotive vehicles Shock driven piezoelectric energy harvesting vehicle sensors
    6/28/2018 - PDF - English - BSI
    Learn More
    €215.67

  • IEC 62969-4:2018

    IEC 62969-4:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors
    6/18/2018 - PDF - English, French - IEC
    Learn More
    €107.00

  • NF EN IEC 62969-3, C96-069-3 (06/2018)

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3 : shock driven piezoelectric energy harvesting for automotive vehicle sensors - Dispositifs à semiconducteurs - Interface à semiconducteurs pour les véhicules automobiles - Partie 3 : Récupération de l'énergie piézoélectrique produite par les chocs pour les capteurs de véhicules automobiles
    6/1/2018 - Paper - French - AFNOR
    Learn More
    €87.39

  • UNE-EN IEC 62969-2:2018

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors (Endorsed by Asociación Española de Normalización in June of 2018.)
    6/1/2018 - PDF - English - AENOR
    Learn More
    €62.00

  • IEC 62969-3:2018

    IEC 62969-3:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors
    5/7/2018 - PDF - English, French - IEC
    Learn More
    €147.00

  • BS IEC 62951-1:2017

    Semiconductor devices. Flexible and stretchable semiconductor devices Bending test method for conductive thin films on flexible substrates
    5/4/2018 - PDF - English - BSI
    Learn More
    €154.05

  • BS EN IEC 62969-2:2018

    Semiconductor devices. interface for automotive vehicles Efficiency evaluation methods of wireless power transmission using resonance sensors
    5/2/2018 - PDF - English - BSI
    Learn More
    €154.05

  • NF C96-069-2, NF EN IEC 62969-2 (04/2018)

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2 : efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
    4/27/2018 - PDF - English - UTE
    Learn More
    €63.42

  • BS EN 60747-16-1:2002+A2:2017

    Semiconductor devices Microwave integrated circuits. Amplifiers
    4/10/2018 - PDF - English - BSI
    Learn More
    €324.69

  • DIN EN 60747-16-4:2018-04

    Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches (IEC 60747-16-4:2004 + A1:2009 + A2:2017); German version EN 60747-16-4:2004 + A1:2011 + A2:2017
    4/1/2018 - PDF - German - DIN
    Learn More
    €114.10

  • DIN EN 60747-16-3:2018-04

    Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (IEC 60747-16-3:2002 + A1:2009 + A2:2017); German version EN 60747-16-3:2002 + A1:2009 + A2:2017
    4/1/2018 - PDF - German - DIN
    Learn More
    €141.90

  • NF EN IEC 62969-2, C96-069-2 (04/2018)

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2 : efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors - Dispositifs à semiconducteurs - Interface à semiconducteurs pour les véhicules automobiles - Partie 2 : Méthodes d'évaluation du rendement de la transmission d'énergie sans fil par résonance pour les capteurs de véhicules automobiles
    4/1/2018 - Paper - French - AFNOR
    Learn More
    €60.85

  • BS EN 60747-16-4:2004+A2:2017

    Semiconductor devices Microwave integrated circuits. Switches
    3/16/2018 - PDF - English - BSI
    Learn More
    €284.40

  • BS IEC 62047-29:2017

    Semiconductor devices. Micro-electromechanical devices Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
    3/15/2018 - PDF - English - BSI
    Learn More
    €154.05

  • IEC 62031:2018 + Redline

    IEC 62031:2018 (Redline version) LED modules for general lighting - Safety specifications
    3/8/2018 - PDF - English - IEC
    Learn More
    €192.00

  • IEC 62031:2018

    IEC 62031:2018 LED modules for general lighting - Safety specifications
    3/8/2018 - PDF - English, French - IEC
    Learn More
    €147.00

  • IEC 62969-2:2018

    IEC 62969-2:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
    3/8/2018 - PDF - English, French - IEC
    Learn More
    €41.00

  • UNE-EN IEC 62969-1:2018

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors (Endorsed by Asociación Española de Normalización in March of 2018.)
    3/1/2018 - PDF - English - AENOR
    Learn More
    €63.00

  • BS EN 60747-16-3:2002+A2:2017

    Semiconductor devices Microwave integrated circuits. Frequency converters
    2/23/2018 - PDF - English - BSI
    Learn More
    €300.99

  • BS EN IEC 62969-1:2018

    Semiconductor devices. interface for automotive vehicles General requirements of power vehicle sensors
    2/22/2018 - PDF - English - BSI
    Learn More
    €154.05

  • NF C96-069-1, NF EN IEC 62969-1 (02/2018)

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1 : general requirements of power interface for automotive vehicle sensors
    2/16/2018 - PDF - English - UTE
    Learn More
    €91.08

  • NF EN IEC 62969-1, C96-069-1 (02/2018)

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1 : general requirements of power interface for automotive vehicle sensors - Dispositifs à semiconducteurs - Interface à semiconducteurs pour les véhicules automobiles - Partie 1 : Exigences générales de l'interface d'alimentation destinée aux capteurs des véhicules automobiles
    2/1/2018 - Paper - French - AFNOR
    Learn More
    €87.39

  • UNE-EN 60747-16-3:2002/A2:2017

    Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (Endorsed by Asociación Española de Normalización in January of 2018.)
    1/1/2018 - PDF - English - AENOR
    Learn More
    €38.00

  • IEC 62969-1:2017

    IEC 62969-1:2017 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
    12/13/2017 - PDF - English - IEC
    Learn More
    €71.00

  • IEC 62969-1:2017

    IEC 62969-1:2017 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
    12/13/2017 - PDF - English, French - IEC
    Learn More
    €71.00

  • UNE-EN 60747-16-4:2004/A2:2017

    Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches (Endorsed by Asociación Española de Normalización in December of 2017.)
    12/1/2017 - PDF - English - AENOR
    Learn More
    €38.00

  • NF EN 60747-16-3/A2, C96-016-3/A2 (12/2017)


    12/1/2017 - Paper - French - AFNOR
    Learn More
    €98.42

  • IEC 62047-29:2017

    IEC 62047-29:2017 Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
    11/22/2017 - PDF - English - IEC
    Learn More
    €71.00

  • BS IEC 62047-30:2017

    Semiconductor devices. Micro-electromechanical devices Measurement methods of electro-mechanical conversion characteristics MEMS piezoelectric thin film
    10/9/2017 - PDF - English - BSI
    Learn More
    €215.67

  • DIN EN 60747-16-1:2017-10

    Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers (IEC 60747-16-1:2001 - A1:2007 - A2:2017); German version EN 60747-16-1:2002 + A1:2007 + A2:2017
    10/1/2017 - PDF - German - DIN
    Learn More
    €163.80

  • DIN EN 62477-1 VDE 0558-477-1:2017-10

    Safety requirements for power electronic converter systems and equipment - Part 1: General (IEC 62477-1:2012 + A1:2016); German version EN 62477-1:2012 + A11:2014 + A1:2017
    10/1/2017 - Paper - German - VDE
    Learn More
    €268.93

  • IEC 62047-30:2017

    IEC 62047-30:2017 Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
    9/15/2017 - PDF - English - IEC
    Learn More
    €107.00

  • NF C96-016-1/A2, NF EN 60747-16-1/A2 (08/2017)

    Semiconductor devices - Part 16-1 : microwave integrated circuits - Amplifiers
    8/19/2017 - PDF - English - UTE
    Learn More
    €63.42

  • IEC 60747-16-3:2002/AMD2:2017

    IEC 60747-16-3:2002/AMD2:2017 Amendment 2 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
    8/16/2017 - PDF - English, French - IEC
    Learn More
    €10.00

  • IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 Edition 1.2

    IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 (Consolidated version) Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
    8/16/2017 - PDF - English, French - IEC
    Learn More
    €305.00

  • IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 Edition 1.2

    IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 (Consolidated version) Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
    8/16/2017 - PDF - English - IEC
    Learn More
    €305.00

  • IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 Edition 1.2

    IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 (Consolidated version) Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
    8/16/2017 - PDF - English - IEC
    Learn More
    €284.00

  • IEC 60747-16-4:2004/AMD2:2017

    IEC 60747-16-4:2004/AMD2:2017 Amendment 2 - Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
    8/16/2017 - PDF - English - IEC
    Learn More
    €10.00

  • IEC 60747-16-3:2002/AMD2:2017

    IEC 60747-16-3:2002/AMD2:2017 Amendment 2 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
    8/16/2017 - PDF - English - IEC
    Learn More
    €10.00

  • BS IEC 62830-2:2017

    Semiconductor devices. devices for energy harvesting and generation Thermo power based thermoelectric
    8/10/2017 - PDF - English - BSI
    Learn More
    €154.05

  • DIN EN 60747-16-6:2017-08

    Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers (IEC 47E/568/CD:2017)
    8/1/2017 - PDF - English, German - DIN
    Learn More
    €114.10

  • NF EN 60747-16-1/A2, C96-016-1/A2 (08/2017)

    Semiconductor devices - Part 16-1 : microwave integrated circuits - Amplifiers - Dispositifs à semiconducteurs - Partie 16-1 : circuits intégrés hyperfréquences - Amplificateurs
    8/1/2017 - Paper - French - AFNOR
    Learn More
    €60.85

  • UNE-EN 60747-16-1:2002/A2:2017

    Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers (Endorsed by Asociación Española de Normalización in July of 2017.)
    7/1/2017 - PDF - English - AENOR
    Learn More
    €35.00

  • BS EN 62830-3:2017

    Semiconductor devices. devices for energy harvesting and generation Vibration based electromagnetic
    4/30/2017 - PDF - English - BSI
    Learn More
    €215.67

  • IEC 62951-1:2017

    IEC 62951-1:2017 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates
    4/10/2017 - PDF - English - IEC
    Learn More
    €71.00

  • DIN EN 62047-25:2017-04

    Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016
    4/1/2017 - PDF - German - DIN
    Learn More
    €103.00

  • IEC 62830-3:2017

    IEC 62830-3:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting
    3/28/2017 - PDF - English, French - IEC
    Learn More
    €147.00

  • JIS C 5630-1:2017

    Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
    3/21/2017 - PDF - Japanese - JSA
    Learn More
    €41.86

  • IEC 62830-1:2017

    IEC 62830-1:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting
    3/3/2017 - PDF - English, French - IEC
    Learn More
    €147.00

  • IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 Edition 1.2

    IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 (Consolidated version) Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
    2/15/2017 - PDF - English, French - IEC
    Learn More
    €508.00

  • IEC 60747-16-1:2001/AMD2:2017

    IEC 60747-16-1:2001/AMD2:2017 Amendment 2 - Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
    2/15/2017 - PDF - English, French - IEC
    Learn More
    €20.00

  • IEC 62830-2:2017

    IEC 62830-2:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
    1/20/2017 - PDF - English, French - IEC
    Learn More
    €71.00

  • IEC 62047-27:2017

    IEC 62047-27:2017 Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
    1/20/2017 - PDF - English - IEC
    Learn More
    €71.00

  • IEC 62047-28:2017

    IEC 62047-28:2017 Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices
    1/20/2017 - PDF - English - IEC
    Learn More
    €107.00

  • DIN VDE V 0884-11 VDE V 0884-11:2017-01

    Semiconductor devices - Part 11: Magnetic and capacitive coupler for basic and reinforced isolation
    1/1/2017 - Paper - German - VDE
    Learn More
    €104.79

  • UNE-EN 62047-25:2016

    Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (Endorsed by Asociación Española de Normalización in January of 2017.)
    1/1/2017 - PDF - English - AENOR
    Learn More
    €68.00

  • NF C96-050-25, NF EN 62047-25 (12/2016)

    Semiconductor devices - Micro-electromechanical devices - Part 25 : silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
    12/30/2016 - PDF - English - UTE
    Learn More
    €91.08

  • NF EN 62047-25, C96-050-25 (12/2016)

    Semiconductor devices - Micro-electromechanical devices - Part 25 : silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area - Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 25 : Technologie de fabrication de MEMS à base de silicium - Méthode de mesure de la résistance à la traction-compression et au cisaillement d'une micro zone de brasure
    12/1/2016 - Paper - French - AFNOR
    Learn More
    €87.39

  • DIN EN 62477-2 VDE 0558-477-2:2016-12

    Safety requirements for power electronic converter systems and equipment - Part 2: Power electronic converters from 1000 V a.c. or 1500 V d.c. up to 36 kV a.c. or 54 kV d.c. (IEC 22/275/CDV:2016); German version prEN 62477-2:2016
    12/1/2016 - Paper - German - VDE
    Learn More
    €95.02

  • BS EN 62047-25:2016

    Semiconductor devices. Micro-electromechanical devices Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength micro bonding area
    11/30/2016 - PDF - English - BSI
    Learn More
    €215.67

  • NF C96-050-1, NF EN 62047-1 (11/2016)

    Semiconductor devices - Micro-electromechanical devices - Part 1 : terms and definitions
    11/5/2016 - PDF - English - UTE
    Learn More
    €102.58

  • NF EN 62047-1, C96-050-1 (11/2016)

    Semiconductor devices - Micro-electromechanical devices - Part 1 : terms and definitions - Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 1 : termes et définitions
    11/1/2016 - Paper - French - AFNOR
    Learn More
    €98.42

  • IEC 62047-25:2016

    IEC 62047-25:2016 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
    8/29/2016 - PDF - English, French - IEC
    Learn More
    €147.00

  • UNE-EN 62047-26:2016

    Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (Endorsed by AENOR in June of 2016.)
    6/1/2016 - PDF - English - AENOR
    Learn More
    €71.00

  • NF EN 62047-26, C96-050-26 (06/2016)

    Semiconductor devices - Micro-electromechanical devices - Part 26 : description and measurement methods for micro trench and needle structures - Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 26 : description et méthodes de mesure pour structures de microtranchées et de microaiguille
    6/1/2016 - Paper - French - AFNOR
    Learn More
    €98.42

  • BS EN 62047-26:2016

    Semiconductor devices. Micro-electromechanical devices Description and measurement methods for micro trench needle structures
    5/31/2016 - PDF - English - BSI
    Learn More
    €253.59

  • 16/30343345 DC:2016

    BS EN 62384. DC or AC supplied electronic control gear for LED modules. Performance requirements
    5/31/2016 - PDF - English - BSI
    Learn More
    €23.70

  • UNE-EN 62047-1:2016

    Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (Endorsed by AENOR in May of 2016.)
    5/1/2016 - PDF - English - AENOR
    Learn More
    €74.00

  • BS EN 62047-1:2016

    Semiconductor devices. Micro-electromechanical devices Terms and definitions
    4/30/2016 - PDF - English - BSI
    Learn More
    €253.59

  • JIS C 6790:2016

    Load test of a bolt-clamped Langevin vibrator using wattmeter method
    3/22/2016 - PDF - Japanese - JSA
    Learn More
    €25.00

  • IEC 60747-5-6:2016

    IEC 60747-5-6:2016 Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes
    2/23/2016 - PDF - English, French - IEC
    Learn More
    €315.00

  • IEC 60747-5-7:2016

    IEC 60747-5-7:2016 Semiconductor devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors
    2/23/2016 - PDF - English, French - IEC
    Learn More
    €147.00

  • IEC 62047-26:2016

    IEC 62047-26:2016 Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
    1/7/2016 - PDF - English, French - IEC
    Learn More
    €178.00

  • IEC 62047-1:2016

    IEC 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
    1/6/2016 - PDF - English, French - IEC
    Learn More
    €208.00

  • AS IEC 62477.1:2016

    Safety requirements for power electronic converter systems and equipment General
    1/1/2016 - PDF sécurisé - English - SA
    Learn More
    €197.62

  • NF EN 62047-16, C96-050-16 (11/2015)

    Semiconductor devices - Micro-electromechanical devices - Part 16 : test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods - Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 16 : méthodes d'essai pour déterminer les contraintes résiduelles des films de MEMS - Méthodes de la courbure de la plaquette et de déviation de poutre en porte-à-faux
    11/1/2015 - Paper - French - AFNOR
    Learn More
    €74.67

  • NF EN 62047-17, C96-050-17 (11/2015)

    Semiconductor devices - Micro-electromechanical devices - Part 17 : bulge test method for measuring mechanical properties of thin films - Dispositifs à semiconducteurs
    11/1/2015 - Paper - French - AFNOR
    Learn More
    €98.42

  • PR NF C96-830-3, PR NF EN 62830-3 (08/2015)

    Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3 : vibration based electromagnetic energy harvesting
    8/28/2015 - Paper - French - AFNOR
    Learn More
    €63.76

  • UNE-EN 62047-16:2015

    Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods (Endorsed by AENOR in August of 2015.)
    8/1/2015 - PDF - English - AENOR
    Learn More
    €57.00

  • UNE-EN 62047-17:2015

    Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films (Endorsed by AENOR in August of 2015.)
    8/1/2015 - PDF - English - AENOR
    Learn More
    €70.00

  • BS EN 62047-15:2015

    Semiconductor devices. Micro-electromechanical devices Test method of bonding strength between PDMS and glass
    7/31/2015 - PDF - English - BSI
    Learn More
    €154.05

  • BS EN 62047-17:2015

    Semiconductor devices. Micro-electromechanical devices Bulge test method for measuring mechanical properties of thin films
    7/31/2015 - PDF - English - BSI
    Learn More
    €253.59

  • BS EN 62047-16:2015

    Semiconductor devices. Micro-electromechanical devices Test methods for determining residual stresses of MEMS films. Wafer curvature and cantilever beam deflection
    7/31/2015 - PDF - English - BSI
    Learn More
    €154.05

  • 15/30329267 DC:2015

    BS EN 60747-17. Semiconductor devices. Part 17. Magnetic and capacitive coupler for basic and reinforced insulation
    7/31/2015 - PDF - English - BSI
    Learn More
    €23.70

  • UNE-EN 62031:2009/A2:2015

    LED modules for general lighting - Safety specifications
    5/6/2015 - PDF - Spanish - AENOR
    Learn More
    €31.00

  • UNE-EN 60747-5-5:2011/A1:2015

    Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers (Endorsed by AENOR in May of 2015.)
    5/1/2015 - PDF - English - AENOR
    Learn More
    €35.00

  • 15/30323630 DC:2015

    BS EN 62047-28. Semiconductor devices. Micro-electromechanical devices. Part 28. Performance testing method of vibration–driven MEMS electret energy harvesting devices
    4/8/2015 - PDF - English - BSI
    Learn More
    €23.70

  • IEC 62047-17:2015

    IEC 62047-17:2015 Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
    3/5/2015 - PDF - English, French - IEC
    Learn More
    €178.00

  • IEC 62047-16:2015

    IEC 62047-16:2015 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
    3/5/2015 - PDF - English, French - IEC
    Learn More
    €41.00

  • 15/30321848 DC:2015

    BS EN 62047-27. Semiconductor devices. Micro-electromechanical devices. Part 27. Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
    3/4/2015 - PDF - English - BSI
    Learn More
    €23.70

  • NF EN 62047-22, C96-050-22 (12/2014)

    Semiconductor devices - Micro-electromechanical devices - Part 22 : electromechanical tensile test method for conductive thin films on flexible substrates - Dispositifs à semiconducteurs
    12/1/2014 - Paper - French - AFNOR
    Learn More
    €60.85

  • NF EN 62047-21, C96-050-21 (12/2014)

    Semiconductor devices - Micro-electromechanical devices - Part 21 : test method for Poisson's ratio of thin film MEMS materials - Dispositifs à semiconducteurs
    12/1/2014 - Paper - French - AFNOR
    Learn More
    €74.67

  • NF EN 62047-20, C96-050-20 (12/2014)

    Semiconductor devices - Micro-electromechanical devices - Part 20 : gyroscopes - Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 20 : gyroscopes
    12/1/2014 - Paper - French - AFNOR
    Learn More
    €129.98

  • PD CLC/TR 62258-4:2013

    Semiconductor die products Questionnaire for users and suppliers
    11/30/2014 - PDF - English - BSI
    Learn More
    €253.59

  • UNE-EN 62047-22:2014

    Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (Endorsed by AENOR in November of 2014.)
    11/1/2014 - PDF - English - AENOR
    Learn More
    €57.00

  • UNE-EN 62047-20:2014

    Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (Endorsed by AENOR in November of 2014.)
    11/1/2014 - PDF - English - AENOR
    Learn More
    €90.00

  • UNE-EN 62047-21:2014

    Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (Endorsed by AENOR in November of 2014.)
    11/1/2014 - PDF - English - AENOR
    Learn More
    €59.00

  • BS EN 62047-20:2014

    Semiconductor devices. Micro-electromechanical devices Gyroscopes
    10/31/2014 - PDF - English - BSI
    Learn More
    €300.99

  • BS EN 62047-21:2014

    Semiconductor devices. Micro-electromechanical devices Test method for Poisson's ratio of thin film MEMS materials
    10/31/2014 - PDF - English - BSI
    Learn More
    €154.05

  • BS EN 62047-22:2014

    Semiconductor devices. Micro-electromechanical devices Electromechanical tensile test method for conductive thin films on flexible substrates
    10/31/2014 - PDF - English - BSI
    Learn More
    €130.35

  • IEC 62047-20:2014

    IEC 62047-20:2014 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
    6/26/2014 - PDF - English, French - IEC
    Learn More
    €284.00

  • IEC 62047-21:2014

    IEC 62047-21:2014 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
    6/19/2014 - PDF - English, French - IEC
    Learn More
    €71.00

  • IEC 62047-22:2014

    IEC 62047-22:2014 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
    6/19/2014 - PDF - English, French - IEC
    Learn More
    €41.00

  • DIN EN 60747-16-5:2014-04

    Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (IEC 60747-16-5:2013); German version EN 60747-16-5:2013
    4/1/2014 - PDF - German - DIN
    Learn More
    €136.80

  • NF EN 62047-11, C96-050-11 (03/2014)

    Semiconductor devices - Micro-electromechanical devices - Part 11 : test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems - Dispositifs à semiconducteurs
    3/1/2014 - Paper - French - AFNOR
    Learn More
    €87.39

  • NF EN 62047-19, C96-050-19 (03/2014)

    Semiconductor devices - Micro-electromechanical devices - Part 19 : electronic compasses - Dispositifs à semiconducteurs
    3/1/2014 - Paper - French - AFNOR
    Learn More
    €98.42

  • NF EN 60747-16-5, C96-016-5 (02/2014)

    Semiconductor devices - Part 16-5 : microwave integrated circuits - Oscillators
    2/1/2014 - Paper - French - AFNOR
    Learn More
    €107.86

  • NF EN 62047-18, C96-050-18 (02/2014)

    Semiconductor devices - Micro-electromechanical devices - Part 18 : bend testing methods of thin film materials - Dispositifs à semiconducteurs
    2/1/2014 - Paper - French - AFNOR
    Learn More
    €74.67

  • 14/30297227 DC:2014

    BS EN 62880-1. Semiconductor devices. Wafer level reliability for semiconductor devices. Copper stress migration test method
    1/28/2014 - PDF - English - BSI
    Learn More
    €23.70

  • 14/30296894 DC:2014

    BS EN 62830-1. Semiconductor devices. Semiconductor devices for energy harvesting and generation. Part 1. Vibration based piezoelectric energy harvesting
    1/21/2014 - PDF - English - BSI
    Learn More
    €23.70

  • UNE-EN 62031:2009/A1:2013

    LED modules for general lighting - Safety specifications
    12/4/2013 - PDF - Spanish - AENOR
    Learn More
    €47.00

  • UNE-EN 62047-19:2013

    Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (Endorsed by AENOR in November of 2013.)
    11/1/2013 - PDF - English - AENOR
    Learn More
    €72.00

  • UNE-EN 62047-18:2013

    Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (Endorsed by AENOR in November of 2013.)
    11/1/2013 - PDF - English - AENOR
    Learn More
    €59.00

  • UNE-EN 62047-11:2013

    Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (Endorsed by AENOR in November of 2013.)
    11/1/2013 - PDF - English - AENOR
    Learn More
    €65.00

  • BS EN 62047-11:2013

    Semiconductor devices. Micro-electromechanical devices Test method for coefficients of linear thermal expansion free-standing materials micro-electromechanical systems
    10/31/2013 - PDF - English - BSI
    Learn More
    €215.67

  • BS EN 62047-18:2013

    Semiconductor devices. Micro-electromechanical devices Bend testing methods of thin film materials
    10/31/2013 - PDF - English - BSI
    Learn More
    €154.05

  • BS EN 62047-19:2013

    Semiconductor devices. Micro-electromechanical devices Electronic compasses
    10/31/2013 - PDF - English - BSI
    Learn More
    €253.59

  • UNE-EN 60747-16-5:2013

    Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (Endorsed by AENOR in October of 2013.)
    10/1/2013 - PDF - English - AENOR
    Learn More
    €78.00

  • BS EN 60747-16-5:2013

    Semiconductor devices Microwave integrated circuits. Oscillators
    9/30/2013 - PDF - English - BSI
    Learn More
    €253.59

  • IEC 62047-19:2013

    IEC 62047-19:2013 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
    7/17/2013 - PDF - English, French - IEC
    Learn More
    €178.00

  • IEC 62047-18:2013

    IEC 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
    7/17/2013 - PDF - English, French - IEC
    Learn More
    €71.00

  • IEC 62047-11:2013

    IEC 62047-11:2013 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
    7/17/2013 - PDF - English, French - IEC
    Learn More
    €107.00

  • IEC 60747-16-5:2013

    IEC 60747-16-5:2013 Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
    6/19/2013 - PDF - English, French - IEC
    Learn More
    €249.00

  • NF EN 60747-16-1/A1, C96-016-1/A1 (05/2013)

    Semiconductor devices - Part 16-1 : microwave integrated circuits - Amplifiers
    5/1/2013 - Paper - French - AFNOR
    Learn More
    €87.39

  • BS EN 62047-5:2011

    Semiconductor devices. Micro-electromechanical devices RF MEMS switches
    4/30/2013 - PDF - English - BSI
    Learn More
    €253.59

  • NF EN 60747-16-3/A1, C96-016-3/A1 (02/2013)

    Semiconductor devices - Part 16-3 : microwave integrated circuits - Frequency converters
    2/1/2013 - Paper - French - AFNOR
    Learn More
    €60.85

  • BS EN 62047-9:2011

    Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS
    1/31/2013 - PDF - English - BSI
    Learn More
    €215.67

  • NF EN 62047-14, C96-050-14 (12/2012)

    Semiconductor devices - Micro-electromechanical devices - Part 14 : forming limit measuring method of metallic film materials - Dispositifs à semiconducteurs
    12/1/2012 - Paper - French - AFNOR
    Learn More
    €74.67

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