31.080 : Semiconductor devices
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IEC 60191-6-10:2003
IEC 60191-6-10:2003 Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
11/19/2003 - PDF - English, French -
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NF EN 60749-1, C96-022-1 (11/2003)
Semiconductor devices - Mechanical and climatic test methods - Part 1 : general - Dispositifs à semiconducteurs
11/1/2003 - Paper - French -
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NF EN 60749-32, C96-022-32 (11/2003)
Semiconductor devices - Mechanical and climatic test methods - Part 32 : flammability of plastic-encapsulated devices (externally induced) - Dispositifs à semiconducteurs
11/1/2003 - Paper - French -
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NF EN 60749-22, C96-022-22 (11/2003)
Semiconductor devices - Mechanical and climatic test methods - Part 22 : bond strength - Dispositifs à semiconducteurs
11/1/2003 - Paper - French -
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NF EN 60749-31, C96-022-31 (11/2003)
Semiconductor devices - Mechanical and climatic test methods - Part 31 : flammability of plastic-encapsulated devices (internally induced) - Dispositifs à semiconducteurs
11/1/2003 - Paper - French -
Learn More€54.50 -
NF EN 60191-6-4, C96-013-6-4 (11/2003)
Mechanical standardization of semiconductor devices - Part 6-4 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
11/1/2003 - Paper - French -
Learn More€88.00 -
NF EN 60749-8, C96-022-8 (11/2003)
Semiconductor devices - Mechanical and climatic test methods - Part 8 : sealing - Dispositifs à semiconducteurs
11/1/2003 - Paper - French -
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BS EN 60749-25:2003
Semiconductor devices. Mechanical and climatic test methods Temperature cycling
10/30/2003 - PDF - English -
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BS EN 60749-11:2002
Semiconductor devices. Mechanical and climatic test methods Rapid change of temperature. Two-fluid-bath method
10/24/2003 - PDF - English -
Learn More€151.00 -
UNE-EN 60191-6-2:2003
Mechanical standardization of semiconductor devices -- Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
10/10/2003 - PDF - Spanish -
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UNE-EN 60191-6-2:2003
Mechanical standardization of semiconductor devices -- Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
10/10/2003 - PDF - English -
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UNE-EN 60191-6-4:2003
Mechanical standardization of semiconductor devices -- Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (Endorsed by AENOR in October of 2003.)
10/1/2003 - PDF - English -
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DIN EN 60749-16:2003-09
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003
9/1/2003 - PDF - German -
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IEEE/ANSI N42.31:2003
American National Standard for Measurement Procedures for Resolution and Efficiency of Wide-Bandgap Semiconductor Detectors of Ionizing Radiation
8/20/2003 - PDF - English -
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IEEE/ANSI N42.31:2003
American National Standard for Measurement Procedures for Resolution and Efficiency of Wide-Bandgap Semiconductor Detectors of Ionizing Radiation
8/20/2003 - Paper - English -
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IEC 60749-14:2003
IEC 60749-14:2003 Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
8/7/2003 - PDF - English, French -
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BS EN 60191-6-4:2003
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Measuring methods package dimensions ball grid array (BGA)
8/4/2003 - PDF - English -
Learn More€180.00 -
NF EN 60749-19, C96-022-19 (08/2003)
Semiconductor devices - Mechanical and climatic test methods - Part 19 : die shear strength - Dispositifs à semiconducteurs
8/1/2003 - Paper - French -
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NF EN 60749-36, C96-022-36 (08/2003)
Semiconductor devices - Mechanical and climatic test methods - Part 36 : acceleration steady state - Dispositifs à semiconducteurs
8/1/2003 - Paper - French -
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IEC 60749-25:2003
IEC 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
7/11/2003 - PDF - English, French -
Learn More€92.00 -
BS EN 60749-1:2003
Semiconductor devices. Mechanical and climatic test methods General
7/7/2003 - PDF - English -
Learn More€151.00 -
BS EN 60749-31:2003
Semiconductor devices. Mechanical and climatic test methods Flammability of plastic-encapsulated devices (internally induced)
7/4/2003 - PDF - English -
Learn More€151.00 -
BS EN 60749-22:2003
Semiconductor devices. Mechanical and climatic test methods Bond strength
7/4/2003 - PDF - English -
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BS EN 60749-8:2003
Semiconductor devices. Mechanical and climatic test methods Sealing
7/3/2003 - PDF - English -
Learn More€180.00 -
NF EN 60747-16-3, C96-016-3 (07/2003)
Semiconductor devices - Part 16-3 : microwave integrated circuits - Frequency converters
7/1/2003 - Paper - English -
Learn More€115.50 -
NF EN 60749-16, C96-022-16 (07/2003)
Semiconductor devices - Mechanical and climatic test methods - Part 16 : particle impact noise dectection (PIND) - Dispositifs à semiconducteurs
7/1/2003 - Paper - French -
Learn More€72.00 -
NF EN 60747-16-1, C96-016-1 (07/2003)
Semiconductor devices - Part 16-1 : microwave integrated circuits - Amplifiers
7/1/2003 - Paper - French -
Learn More€141.00 -
IEC 60191-2:1966/AMD8:2003
IEC 60191-2:1966/AMD8:2003 Amendment 8 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
6/27/2003 - PDF - English, French -
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BS EN 60749-36:2003
Semiconductor devices. Mechanical and climatic test methods Acceleration, steady state
6/19/2003 - PDF - English -
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IEC 60191-6-4:2003
IEC 60191-6-4:2003 Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
6/11/2003 - PDF - English, French -
Learn More€92.00 -
IEC 60191-6-4:2003
IEC 60191-6-4:2003 Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
6/11/2003 - PDF - English -
Learn More€92.00 -
UNE-EN 60749-10:2003
Semiconductor devices - Mechanical and climatic test methods -- Part 10: Mechanical shock.
5/30/2003 - PDF - Spanish -
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UNE-EN 60749-2:2003
Semiconductor devices - Mechanical and climatic test methods -- Part 2: Low air pressure.
5/30/2003 - PDF - Spanish -
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UNE-EN 60749-11:2003
Semiconductor devices - Mechanical and climatic test methods -- Part 11: Rapid change of temperature - Two-fluid-bath method.
5/30/2003 - PDF - Spanish -
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UNE-EN 60749-10:2003
Semiconductor devices - Mechanical and climatic test methods -- Part 10: Mechanical shock.
5/30/2003 - PDF - English -
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UNE-EN 60749-2:2003
Semiconductor devices - Mechanical and climatic test methods -- Part 2: Low air pressure.
5/30/2003 - PDF - English -
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UNE-EN 60749-11:2003
Semiconductor devices - Mechanical and climatic test methods -- Part 11: Rapid change of temperature - Two-fluid-bath method.
5/30/2003 - PDF - English -
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DIN EN 60749-11:2003-04
Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method (IEC 60749-11:2002); German version EN 60749-11:2002
4/1/2003 - PDF - German -
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DIN EN 60749-2:2003-04
Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure (IEC 60749-2:2002); German version EN 60749-2:2002
4/1/2003 - PDF - German -
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BS EN 60191-6-2:2002
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide 1,50 mm, 1,27 mm and 1,00 pitch ball column terminal
3/4/2003 - PDF - English -
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UNE-EN 61643-321:2003
Components for low-voltage surge protective devices -- Part 321: Specifications for Avalanche Breakdown Diode (ABD).
2/28/2003 - PDF - Spanish -
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UNE-EN 61643-321:2003
Components for low-voltage surge protective devices -- Part 321: Specifications for Avalanche Breakdown Diode (ABD).
2/28/2003 - PDF - English -
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IEC 60749-36:2003
IEC 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
2/13/2003 - PDF - English, French -
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IEC 60749-19:2003
IEC 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
2/13/2003 - PDF - English, French -
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DIN EN 61643-321 VDE 0845-5-2:2003-02
Components for low-voltage surge protection devices - Part 321: Specifications for avalanche breakdown diodes (ABD) (IEC 61643-321:2001); German version EN 61643-321:2002
2/1/2003 - Paper - German -
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BS EN 60747-5-3:2001
Discrete semiconductor devices and integrated circuits. Optoelectronic Measuring methods
1/20/2003 - PDF - English -
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IEC 60749-16:2003
IEC 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
1/17/2003 - PDF - English, French -
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BS EN 60747-5-2:2001
Discrete semiconductor devices and integrated circuits. Optoelectronic Essential ratings characteristics
1/17/2003 - PDF - English -
Learn More€293.00 -
NF EN 60749-10, C96-022-10 (12/2002)
Semiconductor devices - Mechanical and climatic test methods - Part 10 : mechanical shock - Dispositifs à semiconducteurs
12/1/2002 - Paper - French -
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NF EN 60749-11, C96-022-11 (12/2002)
Semiconductor devices - Mechanical and climatic test methods - Part 11 : rapid change of temperature - Two-fluid-bath method - Dispositifs à semiconducteurs
12/1/2002 - Paper - French -
Learn More€72.00 -
UNE-EN 60747-16-3:2002
Semiconductor devices -- Part 16-3: Microwave integrated circuits - Frequency converters. (Endorsed by AENOR in December of 2002.)
12/1/2002 - PDF - English -
Learn More€76.00 -
NF EN 60749-2, C96-022-2 (12/2002)
Semiconductor devices - Mechanical and climatic test methods - Part 2 : low air pressure - Dispositifs à semiconducteurs
12/1/2002 - Paper - French -
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DIN EN 61643-341 VDE 0845-5-4:2002-11
Components for low-voltage surge protection devices - Part 341: Specification for thyristor surge suppressors (TSS) (IEC 61643-341:2001); German version EN 61643-341:2001
11/1/2002 - Paper - German -
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BS EN 60749-2:2002
Semiconductor devices. Mechanical and climatic test methods Low air pressure
9/24/2002 - PDF - English -
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IEC 60749-22:2002
IEC 60749-22:2002 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
9/12/2002 - PDF - English, French -
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IEC 60749-1:2002
IEC 60749-1:2002 Semiconductor devices - Mechanical and climatic test methods - Part 1: General
8/30/2002 - PDF - English, French -
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IEC 60749-32:2002
IEC 60749-32:2002 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
8/30/2002 - PDF - English, French -
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IEC 60749-8:2002
IEC 60749-8:2002 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
8/30/2002 - PDF - English, French -
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IEC 60749-31:2002
IEC 60749-31:2002 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
8/30/2002 - PDF - English, French -
Learn More€23.00 -
NF EN 60191-6-6, C96-013-6-6 (08/2002)
Mechanical standardization of semiconductor devices - Part 6-6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
8/1/2002 - Paper - English -
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NF EN 60191-6-1, C96-013-6-1 (08/2002)
Mechanical standardization of semiconductor devices - Part 6-1 : general rules for the preparation of outline drawings of surface mounted semiconductor device parkages - Design guide for gull-wing lead terminals
8/1/2002 - Paper - English -
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UNE-EN 60747-16-1:2002
Semiconductor devices -- Part 16-1: Microwave integrated circuits - Amplifiers (Endorsed by AENOR in July of 2002.)
7/1/2002 - PDF - English -
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UNE-EN 60191-6-1:2002
Mechanical standardization of semiconductor devices -- Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals.
6/28/2002 - PDF - Spanish -
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UNE-EN 60191-6-8:2002
Mechanical standardization of semiconductor devices -- Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP).
6/28/2002 - PDF - English -
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UNE-EN 60191-6-5:2002
Mechanical standardization of semiconductor devices -- Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device package - Design guide for fine -pitch ball grid array (FBGA).
6/28/2002 - PDF - English -
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UNE-EN 60191-6-1:2002
Mechanical standardization of semiconductor devices -- Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals.
6/28/2002 - PDF - English -
Learn More€58.80 -
UNE-EN 60191-6-8:2002
Mechanical standardization of semiconductor devices -- Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP).
6/28/2002 - PDF - Spanish -
Learn More€57.00 -
UNE-EN 60191-6-5:2002
Mechanical standardization of semiconductor devices -- Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device package - Design guide for fine -pitch ball grid array (FBGA).
6/28/2002 - PDF - Spanish -
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BS EN 60512-2-6:2002
Connectors for electronic equipment. Tests and measurements. Electrical continuity contact resistance tests Test 2f. Housing (shell) electrical
5/24/2002 - PDF - English -
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IEC 60050-521:2002
IEC 60050-521:2002 International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits
5/22/2002 - PDF - English, French -
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IEC 60191-2:1966/AMD7:2002
IEC 60191-2:1966/AMD7:2002 Amendment 7 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
5/10/2002 - PDF - English, French -
Learn More€173.00 -
IEC 60747-16-3:2002
IEC 60747-16-3:2002 Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
5/7/2002 - PDF - English, French -
Learn More€270.00 -
IEC 60747-16-3:2002
IEC 60747-16-3:2002 Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
5/7/2002 - PDF - English -
Learn More€270.00 -
NF EN 60191-4/A1, C96-013-4/A1 (05/2002)
Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages
5/1/2002 - Paper - French -
Learn More€51.00 -
IEC 60191-2:1966/AMD6:2002
IEC 60191-2:1966/AMD6:2002 Amendment 6 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
5/1/2002 - PDF - English, French -
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IEC 60749-11:2002
IEC 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
4/12/2002 - PDF - English, French -
Learn More€23.00 -
IEC 60749-2:2002
IEC 60749-2:2002 Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
4/12/2002 - PDF - English, French -
Learn More€23.00 -
BS EN 60191-6-1:2001
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide gull-wing lead terminals
3/29/2002 - PDF - English -
Learn More€151.00 -
BS EN 61643-321:2002
Low voltage surge protective devices Specifications for avalanche breakdown diode (ABD)
3/21/2002 - PDF - English -
Learn More€180.00 -
UNE-EN 60191-6-6:2002
Mechanical standardization of semiconductor devices -- Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA).
3/21/2002 - PDF - Spanish -
Learn More€58.00 -
UNE-EN 60191-6-6:2002
Mechanical standardization of semiconductor devices -- Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA).
3/21/2002 - PDF - English -
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IEC 60191-2:1966/AMD5:2002
IEC 60191-2:1966/AMD5:2002 Amendment 5 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
2/12/2002 - PDF - English, French -
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IEC 60191-6-2:2001
IEC 60191-6-2:2001 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
12/11/2001 - PDF - English -
Learn More€46.00 -
IEC 60191-6-2:2001
IEC 60191-6-2:2001 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
12/11/2001 - PDF - English, French -
Learn More€46.00 -
PD ES 59008-5-3:2001
Data requirements for semiconductor die. Particular and recommendations die types Minimally-packaged
12/5/2001 - PDF - English -
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IEC 61643-321:2001
IEC 61643-321:2001 Components for low-voltage surge protective devices - Part 321: Specifications for avalanche breakdown diode (ABD)
12/4/2001 - PDF - English, French -
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UNE-EN 60146-2:2000
Semiconductor converters -- Part 2: Self-commutated semiconductor converters including direct d.c. converters (Endorsed by AENOR in December of 2001.)
12/1/2001 - PDF - English -
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UNE-EN 60191-6-3:2000
Mechanical standardization of semiconductor devices -- Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) (Endorsed by AENOR in December of 2001.)
12/1/2001 - PDF - English -
Learn More€63.00 -
IEC 60191-2:1966/AMD4:2001
IEC 60191-2:1966/AMD4:2001 Amendment 4 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
11/27/2001 - PDF - English, French -
Learn More€92.00 -
IEC 60747-16-1:2001
IEC 60747-16-1:2001 Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
11/20/2001 - PDF - English, French -
Learn More€311.00 -
IEC 60747-16-1:2001
IEC 60747-16-1:2001 Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
11/20/2001 - PDF - English -
Learn More€311.00 -
BS EN 60191-6-8:2001
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide glass sealed ceramic quad flatpack (G-QFP)
11/16/2001 - PDF - English -
Learn More€151.00 -
BS EN 60191-6-5:2001
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide fine-pitchball grid array (FBGA)
11/15/2001 - PDF - English -
Learn More€151.00 -
IEC 60191-6-1:2001
IEC 60191-6-1:2001 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
10/30/2001 - PDF - English -
Learn More€23.00 -
BS EN 60191-6-6:2001
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide fine pitch land grid array (FLGA) Proposed amendment on terminology
9/5/2001 - PDF - English -
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IEC 60191-2:1966/AMD3:2001
IEC 60191-2:1966/AMD3:2001 Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
8/28/2001 - PDF - English, French -
Learn More€92.00 -
IEC 60191-6-8:2001
IEC 60191-6-8:2001 Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
8/27/2001 - PDF - English -
Learn More€46.00 -
IEC 60191-6-8:2001
IEC 60191-6-8:2001 Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
8/27/2001 - PDF - English, French -
Learn More€46.00 -
IEC 60191-6-5:2001
IEC 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
8/27/2001 - PDF - English -
Learn More€46.00 -
PD ES 59008-5-1:2001
Data requirements for semiconductor die. Particular and recommendations die types Bare
7/15/2001 - PDF - English -
Learn More€151.00 -
IEC 60191-2:1966/AMD2:2001
IEC 60191-2:1966/AMD2:2001 Amendment 2 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
6/20/2001 - PDF - English, French -
Learn More€23.00 -
PD ES 59008-5-2:2001
Data requirements for semiconductor die. Particular and recommendations die types Bare with added connection structures
6/15/2001 - PDF - English -
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PD ES 59008-6-2:2001
Data requirements for semiconductor die. Exchange data formats and dictionary
6/15/2001 - PDF - English -
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BS EN 60191-6-3:2001
Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Measuring methods package dimensions quad flat packs (QFP)
5/15/2001 - PDF - English -
Learn More€180.00 -
BS IEC 60747-14-2:2000
Discrete semiconductor devices and integrated circuits. Semiconductor devices. sensors Hall elements
5/15/2001 - PDF - English -
Learn More€180.00 -
NF EN 60191-6-3, C96-013-6-3 (04/2001)
Mechnical standardization of semiconductor devices - Part 6-3 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
4/1/2001 - Paper - English -
Learn More€79.50 -
IEC 60747-16-2:2001
IEC 60747-16-2:2001 Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers
3/22/2001 - PDF - English -
Learn More€219.00 -
IEC 60191-6-6:2001
IEC 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
3/22/2001 - PDF - English, French -
Learn More€92.00 -
IEC 60191-6-6:2001
IEC 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
3/22/2001 - PDF - English -
Learn More€92.00 -
PD ES 59008-4-1:2001
Data requirements for semiconductor die. Specific and recommendations Test quality
3/15/2001 - PDF - English -
Learn More€151.00 -
IEC 60191-2:1966/AMD1:2001
IEC 60191-2:1966/AMD1:2001 Amendment 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
3/15/2001 - PDF - English, French -
Learn More€23.00 -
DIN IEC 60747-2:2001-02
Semiconductor devices - Discrete devices and integrated circuits - Part 2: Rectifier diodes (IEC 60747-2:2000)
2/1/2001 - PDF - German -
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UNE-EN 60191-3:2001
Mechanical standardization of semiconductor devices -- Part 3: General rules for the preparation of outline drawings of integrated circuits.
1/31/2001 - PDF - Spanish -
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UNE-EN 60191-3:2001
Mechanical standardization of semiconductor devices -- Part 3: General rules for the preparation of outline drawings of integrated circuits.
1/31/2001 - PDF - English -
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IEC 60747-14-2:2000
IEC 60747-14-2:2000 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
11/9/2000 - PDF - English -
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IEC 60191-6-3:2000
IEC 60191-6-3:2000 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
9/29/2000 - PDF - English -
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IEC 60191-2Z:2000
IEC 60191-2Z:2000 Twenty-fourth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions
9/29/2000 - PDF - English, French -
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IEC 60191-6-3:2000
IEC 60191-6-3:2000 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
9/29/2000 - PDF - English, French -
Learn More€132.00 -
NF EN 60191-4, C96-013-4 (09/2000)
Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages
9/1/2000 - Paper - French -
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BS EN 60146-2:2000
Semiconductor convertors. General requirements and line commutated convertors Self-commutated semiconductor converters including direct d.c.
8/15/2000 - PDF - English -
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IEC 60191-2Y:2000
IEC 60191-2Y:2000 Twenty-third supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions
6/16/2000 - PDF - English, French -
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BS EN 60191-3:2000
Mechanical standardization of semiconductor devices General rules for the preparation outline drawings integrated circuits
6/15/2000 - PDF - English -
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IEC 60146-2:1999
IEC 60146-2:1999 Semiconductor converters - Part 2: Self-commutated semiconductor converters including direct d.c. converters
11/18/1999 - PDF - English, French -
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IEC 60191-3:1999
IEC 60191-3:1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
10/29/1999 - PDF - English, French -
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IEC 60191-2X:1999
IEC 60191-2X:1999 Mechanical standardization of semiconductor devices - Part 2: Dimensions
9/30/1999 - PDF - English, French -
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BS EN 60068-2-77:1999
Environmental testing. Test methods Body strength and impact shock
9/15/1999 - PDF - English -
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BS EN 60068-2-13:1999
Environmental testing. Test methods Tests. M. Low air pressure
9/15/1999 - PDF - English -
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BS EN 61223-3-1:1999
Evaluation and routine testing in medical imaging departments Acceptance tests Imaging performance of X-ray equipment for radiographic radiscopic systems
8/15/1999 - PDF - English -
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€92.00
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IEC 60821:1991/AMD1:1999
IEC 60821:1991/AMD1:1999 Amendment 1 - VMEbus - Microprocessor system bus for 1 byte to 4 byte data
1/29/1999 - PDF - English -
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DIN EN 153000:1999-01
Generic specification: Discrete pressure contact power semiconductor devices (Qualification approval), German version EN 153000:1998
1/1/1999 - PDF - German -
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€46.00
-
€87.40 -
BS EN 153000:1998
Harmonized system of quality assessment for electronic components. Generic specification: discrete pressure contact power semiconductor devices (qualification approval)
7/15/1998 - PDF - English -
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BS 3934-5:1997
Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) integrated circuits
9/15/1997 - PDF - English -
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DIN EN 60617-5:1997-08
Graphical symbols for diagrams - Part 5: Semiconductors and electron tubes (IEC 60617-5:1996); German version EN 60617-5:1996
8/1/1997 - PDF - English, German -
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€23.00
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IEC 60191-5:1997
IEC 60191-5:1997 Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
4/23/1997 - PDF - English, French -
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€12.00
-
BS QC 750114:1996
Harmonized system of quality assessment for electronic components. Semiconductor devices. Discrete devices. Field-effect transistors. Blank detail specification for case-rated field-effect transistors for switching applications
12/15/1996 - PDF - English -
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DIN EN 120003:1996-11
Blank detail specification - Phototransistors, photodarlington transistors, phototransistor arrays; German version EN 120003:1992
11/1/1996 - PDF - German -
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UNE-EN 120004:1992
BDS: AMBIENT RATED PHOTOCOUPLERS WITH PHOTOTRANSISTORS OUTPUT. (Endorsed by AENOR in September of 1996.)
9/1/1996 - PDF - English -
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UNE-EN 120005:1992
BDS: PHOTODIODES, PHOTODIODE ARRAYS (NOT INTENDED FOR FIBRE OPTIC APPLICATIONS). (Endorsed by AENOR in September of 1996.)
9/1/1996 - PDF - English -
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UNE-EN 120006:1992
BDS: PIN-PHOTODIODES FOR FIBRE OPTIC APPLICATIONS. (Endorsed by AENOR in September of 1996.)
9/1/1996 - PDF - English -
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UNE-EN 120003:1992
BDS: PHOTOTRANSISTORS, PHOTOCARLINGTON TRANSISTORS, PHOTOTRANSISTOR ARRAYS. (Endorsed by AENOR in September of 1996.)
9/1/1996 - PDF - English -
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UNE-EN 120001:1992
BDS: LIGHT EMITTING DIODES, LIGHT EMITTING DIODE ARRAYS, LIGHT EMITTING DIODE DISPLAYS WITHOUT INTERNAL LOGIC AND RESISTOR. (Endorsed by AENOR in September of 1996.)
9/1/1996 - PDF - English -
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UNE-EN 120008:1993
BDS: LIGHT EMITTING DIODES AND INFRARED EMITTING DIODES FOR FIBRE OPTIC SYSTEM OR SUB-SYSTEM. (Endorsed by AENOR in September of 1996.)
9/1/1996 - PDF - English -
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EIA-318-B:1996 (R1999)
Measurement of Reverse Recovery Time for Semiconductor Signal Diodes
7/1/1996 - PDF sécurisé - English -
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ASTM E431-96(2022)
Standard Guide to Interpretation of Radiographs of Semiconductors and Related Devices
1/1/1996 - PDF - English -
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ASTM E431-96(2022) + Redline
Standard Guide to Interpretation of Radiographs of Semiconductors and Related Devices
1/1/1996 - PDF - English -
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BS QC 750113:1994
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: reverse blocking triode thyristors, ambient and case-rated, for currents greater than 100 A
3/15/1994 - PDF - English -
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BS QC 750109:1993
Specification for harmonized system of quality assessment for electronic components. Blank detail specification. Rectifier diodes (including avalanche rectifier diodes), ambient and case-rated, for currents greater than 100 A
2/15/1994 - PDF - English -
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€156.00
-
€187.20
-
BS QC 750106:1993
Specification for harmonized system of quality assessment for electronic components. Semiconductor discrete devices. Blank detail specification. Field-effect transistors for case-rated power amplifier applications
7/15/1993 - PDF - English -
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NF EN 120003, C93-120-003 (07/1992)
Blank detail specification : phototransistors, photodarlington transistors, phototransistor arrays
7/1/1992 - Paper - French -
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NF EN 120004, C93-120-004 (07/1992)
Blank detail specification : ambient rated photocouplers with phototransistor output
7/1/1992 - Paper - French -
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DIN IEC 60747-11:1992-04
Semiconductor devices; sectional specification for semiconductor devices; identical with IEC 60747-11:1985
4/1/1992 - PDF - German -
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€103.33
-
€233.67
-
IEC 60821:1991
IEC 60821:1991 VMEbus - Microprocessor system bus for 1 byte to 4 byte data
12/17/1991 - PDF - English, French -
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UNE 20700-11:1991
SEMICONDUCTOR DEVICES. PART 11: SECTIONAL SPECIFICATION FOR DISCRETE DEVICES.
9/12/1991 - PDF - Spanish -
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BS IEC 796-1:1990
Microprocessor system bus. 8-bit and 16-bit data MULTIBUS I Functional description with electrical timing specifications
2/28/1991 - PDF - English -
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€103.33
-
IEC 60796-2:1990
IEC 60796-2:1990 Microprocessor system bus - 8-bit and 16-bit data (MULTIBUS I) - Part 2: Mechanical and pin descriptions for the system BUS configuration, with edge connectors (direct)
10/15/1990 - PDF - English, French -
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IEC 60796-1:1990
IEC 60796-1:1990 Microprocessor system bus - 8-bit and 16-bit data (MULTIBUS I) - Part 1: Functional description with electrical and timing specifications
10/10/1990 - PDF - English, French -
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BS 7241:1989
Specification for IEC 822 VSB: parallel sub-system bus of the IEC 821 VME bus
3/30/1990 - PDF - English -
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IEC 60796-3:1990
IEC 60796-3:1990 Microprocessor system bus - 8-bit and 16-bit data (MULTIBUS I) - Part 3: Mechanical and pin descriptions for the Eurocard configuration with pin and socket (indirect) connectors
2/15/1990 - PDF - English, French -
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NF C96-007 (06/1989) (R2014)
Semiconductor devices. Discrete devices and integrated circuits. Part 7 : bipolar transistors. - Composants électroniques
6/1/1989 - Paper - French -
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IEC 60822:1988
IEC 60822:1988 VSB - Parallel Sub-system Bus of the IEC 60821 VMEbus
12/30/1988 - PDF - English, French -
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UTE C96-315, C96-315U (12/1988)
Microcircuits. Microwave devices. Attenuators. General article sheets. - Dispositifs hyperfréquences
12/1/1988 - Paper - French -
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DIN 4000-18:1988-12
Tabular layouts of article characteristics for semiconductor diodes
12/1/1988 - PDF - German -
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DIN 4000-19:1988-12
Tabular layouts of article characteristics for transistors and thyristors
12/1/1988 - PDF - German -
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IEC TR 60828:1988
IEC TR 60828:1988 Pin allocations for microprocessor systems using the IEC 60603-2 connector
5/15/1988 - PDF - English, French -
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BS EN 120004:1993
Specification for harmonized system of quality assessment for electronic components. Blank detail specification. Ambient rated photocouplers with phototransistor output
5/15/1988 - PDF - English -
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BS CECC 50000:1987
Harmonized system of quality assessment for electronic components. Generic specification: discrete semiconductor devices
10/30/1987 - PDF - English -
Learn More€377.00 -
€72.00
-
BS EN 120003:1993
Specification for harmonized system of quality assessment for electronic components. Blank detail specification. Phototransistors, photodarlington transistors, phototransistor arrays
11/15/1986 - PDF - English -
Learn More€180.00 -
€127.67
-
NF C96-001 (07/1984) (R2014)
Electronic components. Semiconductor devices. Discrete devices and integrated circuits. Part 1 : general.
7/1/1984 - Paper - French -
Learn More€153.67 -
BS CECC 50000:Supplement No. 1:1983
Harmonized system of quality assessment for electronic components. Generic specification: discrete semiconductor devices. CECC assessed process average
5/31/1983 - PDF - English -
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BS CECC 50009:1982
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: case-rated rectifier diodes
8/15/1982 - PDF - English -
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BS CECC 50008:1982
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: ambient-rated rectifier diodes
4/15/1982 - PDF - English -
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UTE C86-614/A8, C86-614/A8U (05/1981)
ELECTRONIC COMPONENTS. BIPOLAR TRANSISTORS FOR SWITCHING APPLICATIONS. COLLECTION OF DETAILS SPECIFICATIONS WITHIN THE SCOPE OF THE FRENCH STANDARDS NF C 86-010 AND NF C 86-614 (CECC 50 000 AND CECC 50 004).
5/1/1981 - Paper - French -
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€31.00
-
€87.15
-
€88.33
-
€88.33
-
UTE C86-614/A2, C86-614/A2U (11/1978)
ELECTRONIC COMPONENTS. BIPOLAR TRANSISTORS FOR SWITCHING APPLICATIONS. COLLECTION OF DETAIL SPECIFICATION WITHIN THE SCOPE OF THE FRENCH STANDARDS NF C 86-010 AND NF C 86-614.
11/1/1978 - Paper - French -
Learn More€116.50 -
UNE 21321:1978
LETTER SYMBOLS FOR SEMICONDUCTOR DEVICES AND INTEGRATED MICROCIRCUITS.
6/15/1978 - PDF - Spanish -
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UTE C86-614/A1, C86-614/A1U (04/1978)
ELECTRONIC COMPONENTS. BIPOLAR TRANSISTORS FOR SWITCHING APPLICATIONS. COLLECTION OF DETAIL SPECIFICATION WITHIN THE SCOPE OF THE FRENCH STANDARDS NF C 86-010 AND NF C 86-614.
4/1/1978 - Paper - French -
Learn More€72.00 -
UTE C86-614, C86-614U (02/1977)
Electronic components. Bipolar transistors for switching applications. Manual of detail specifications within the scope of the french standards NF C 86-010 and NF C 86-614 (CECC 50 000 and CECC 50 004). - Composants électroniques
2/1/1977 - Paper - French -
Learn More€88.33 -
€185.85
-
EIA CB-5-1:1971
Recommended Test Procedure for Semiconductor Thermal Dissipating Devices
5/1/1971 - PDF sécurisé - English -
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EIA CB-5:1969
Recommended Test Procedure for Semiconductor Thermal Dissipating Devices
7/1/1969 - PDF sécurisé - English -
Learn More€86.10 -
EIA-323:1966 (R2002)
Air-Convection-Cooled Life Test Environment for Lead-Mounted Semiconductor Devices
3/1/1966 - PDF sécurisé - English -
Learn More€42.00 -
IEC 60191-2:1966
IEC 60191-2:1966 Mechanical standardization of semiconductor devices. Part 2: Dimensions
1/1/1966 - PDF - Russian -
Learn More€489.00 -
IEC 60191-2:1966
IEC 60191-2:1966 Mechanical standardization of semiconductor devices. Part 2: Dimensions
1/1/1966 - PDF - English, French -
Learn More€489.00 -
UNE-EN IEC 60749-5:2024
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (Endorsed by Asociación Española de Normalización in March of 2024.)
4/24/2024 - PDF - English -
Learn More€58.00
