31.080 : Semiconductor devices
-
NF EN IEC 60749-13, C96-022-13 (04/2018)
Semiconductor devices - Mechanical and climatic test methods - Part 13 : salt atmosphere
4/1/2018 - Paper - French - AFNOR
Learn More€88.33 -
UNE-EN IEC 60749-12:2018
Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (Endorsed by Asociación Española de Normalización in April of 2018.)
4/1/2018 - PDF - English - AENOR
Learn More€42.00 -
DIN EN 60747-16-4:2018-04
Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches (IEC 60747-16-4:2004 + A1:2009 + A2:2017), German version EN 60747-16-4:2004 + A1:2011 + A2:2017.
4/1/2018 - PDF - German - DIN
Learn More€110.00 -
DIN EN 60747-16-3:2018-04
Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (IEC 60747-16-3:2002 + A1:2009 + A2:2017), German version EN 60747-16-3:2002 + A1:2009 + A2:2017.
4/1/2018 - PDF - German - DIN
Learn More€136.82 -
IEC 60191-4:2013+AMD1:2018 Edition 3.1
IEC 60191-4:2013+AMD1:2018 (Consolidated version) Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
3/27/2018 - PDF - English, French - IEC
Learn More€345.00 -
IEC 60191-4:2013/AMD1:2018
IEC 60191-4:2013/AMD1:2018 Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
3/27/2018 - PDF - English, French - IEC
Learn More€92.00 -
BS EN 60747-16-4:2004+A2:2017
Semiconductor devices Microwave integrated circuits. Switches
3/16/2018 - PDF - English - BSI
Learn More€331.00 -
BS IEC 62047-29:2017
Semiconductor devices. Micro-electromechanical devices Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
3/15/2018 - PDF - English - BSI
Learn More€180.00 -
BS EN 61954:2011+A2:2017
Static var compensators (SVC). Testing of thyristor valves
3/14/2018 - PDF - English - BSI
Learn More€348.00 -
IEC 62031:2018
IEC 62031:2018 LED modules for general lighting - Safety specifications
3/8/2018 - PDF - English, French - IEC
Learn More€173.00 -
IEC 62969-2:2018
IEC 62969-2:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
3/8/2018 - PDF - English, French - IEC
Learn More€46.00 -
IEC 62031:2018 + Redline
IEC 62031:2018 (Redline version) LED modules for general lighting - Safety specifications
3/8/2018 - PDF - English - IEC
Learn More€224.00 -
NF EN IEC 60749-12, C96-022-12 (03/2018)
Semiconductor devices - Mechanical and climatic test methods - Part 12 : vibration, variable frequency
3/1/2018 - Paper - French - AFNOR
Learn More€54.67 -
NF EN IEC 60749-26, C96-022-26 (03/2018)
Semiconductor devices - Mechanical and climatic test methods - Part 26 : electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
3/1/2018 - Paper - French - AFNOR
Learn More€153.67 -
NF EN IEC 60191-1, C96-013-1 (03/2018)
Normalisation mécanique des dispositifs à semi-conducteurs - Partie 1 : règles générales pour la préparation des dessins d'encombrement des dispositifs discrets
3/1/2018 - Paper - French - AFNOR
Learn More€127.67 -
ASTM F1190-18
Standard Guide for Neutron Irradiation of Unbiased Electronic Components
3/1/2018 - PDF - English - ASTM
Learn More€54.00 -
ASTM F1190-18 + Redline
Standard Guide for Neutron Irradiation of Unbiased Electronic Components
3/1/2018 - PDF - English - ASTM
Learn More€65.00 -
UNE-EN IEC 62969-1:2018
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors (Endorsed by Asociación Española de Normalización in March of 2018.)
3/1/2018 - PDF - English - AENOR
Learn More€63.00 -
BS EN 60747-16-3:2002+A2:2017
Semiconductor devices Microwave integrated circuits. Frequency converters
2/23/2018 - PDF - English - BSI
Learn More€348.00 -
BS EN IEC 62969-1:2018
Semiconductor devices. interface for automotive vehicles General requirements of power vehicle sensors
2/22/2018 - PDF - English - BSI
Learn More€180.00 -
IEC 60749-13:2018
IEC 60749-13:2018 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
2/15/2018 - PDF - English, French - IEC
Learn More€92.00 -
€331.00
-
DIN EN 60749-28 VDE 0884-749-28:2018-02
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level (IEC 60749-28:2017), German version EN 60749-28:2017
2/1/2018 - Paper - German - VDE
Learn More€110.67 -
IEEE 1804:2017
IEEE Standard for Fault Accounting and Coverage Reporting(FACR) for Digital Modules
1/31/2018 - PDF - English - IEEE
Learn More€54.00 -
IEEE 1804:2017
IEEE Standard for Fault Accounting and Coverage Reporting(FACR) for Digital Modules
1/31/2018 - Paper - English - IEEE
Learn More€68.00 -
PD IEC/TR 63133:2017
Semiconductor devices. Scan based ageing level estimation for semiconductor devices
1/29/2018 - PDF - English - BSI
Learn More€180.00 -
IEC 60191-1:2018
IEC 60191-1:2018 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
1/23/2018 - PDF - English - IEC
Learn More€270.00 -
IEC 60191-1:2018
IEC 60191-1:2018 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
1/23/2018 - PDF - English, French - IEC
Learn More€270.00 -
IEC 60749-26:2018
IEC 60749-26:2018 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
1/15/2018 - PDF - English, French - IEC
Learn More€345.00 -
DIN EN 60749-3:2018-01
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (IEC 60749-3:2017), German version EN 60749-3:2017.
1/1/2018 - PDF - German - DIN
Learn More€79.72 -
DIN EN 60749-5:2018-01
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (IEC 60749-5:2017), German version EN 60749-5:2017.
1/1/2018 - PDF - German - DIN
Learn More€72.80 -
DIN EN 61954 VDE 0553-100:2018-01
Static VAR compensators (SVC) - Testing of thyristor valves (IEC 61954:2011 + A1:2013 + A2:2017), German version EN 61954:2011 + A1:2013 + A2:2017
1/1/2018 - Paper - German - VDE
Learn More€110.67 -
UNE-EN 60747-16-3:2002/A2:2017
Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (Endorsed by Asociación Española de Normalización in January of 2018.)
1/1/2018 - PDF - English - AENOR
Learn More€38.00 -
JIS C 8158:2017
Self-ballasted LED-lamps for general lighting services by voltage > 50 V
12/20/2017 - PDF - Japanese - JSA
Learn More€36.27 -
JIS C 8160:2017
Non-integrated linear LED lamps with GX16t-5 cap for general lighting services
12/20/2017 - PDF - Japanese - JSA
Learn More€25.00 -
IEC 60749-12:2017
IEC 60749-12:2017 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
12/13/2017 - PDF - English, French - IEC
Learn More€23.00 -
IEC 62969-1:2017
IEC 62969-1:2017 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
12/13/2017 - PDF - English - IEC
Learn More€92.00 -
IEC 62969-1:2017
IEC 62969-1:2017 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
12/13/2017 - PDF - English, French - IEC
Learn More€92.00 -
NF EN 60747-16-3/A2, C96-016-3/A2 (12/2017)
Semiconductor devices - Part 16-3 : microwave integrated circuits - Frequency converters
12/1/2017 - Paper - French - AFNOR
Learn More€116.33 -
UNE-EN 60747-16-4:2004/A2:2017
Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches (Endorsed by Asociación Española de Normalización in December of 2017.)
12/1/2017 - PDF - English - AENOR
Learn More€38.00 -
17/30366375 DC:2017
BS IEC 62373-1. Semiconductor devices. Bias-temperature stability test for metal-oxide semiconductor field-effect transistors (MOSFET) Part 1. Fast BTI Test method
11/30/2017 - PDF - English - BSI
Learn More€24.00 -
BS EN 60749-4:2017
Semiconductor devices. Mechanical and climatic test methods Damp heat, steady state, highly accelerated stress (HAST)
11/28/2017 - PDF - English - BSI
Learn More€180.00 -
BS EN 60749-9:2017
Semiconductor devices. Mechanical and climatic test methods Permanence of marking
11/27/2017 - PDF - English - BSI
Learn More€151.00 -
BS EN 60749-6:2017
Semiconductor devices. Mechanical and climatic test methods Storage at high temperature
11/24/2017 - PDF - English - BSI
Learn More€151.00 -
BS EN 60749-3:2017
Semiconductor devices. Mechanical and climatic test methods External visual examination
11/24/2017 - PDF - English - BSI
Learn More€180.00 -
IEC 62047-29:2017
IEC 62047-29:2017 Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
11/22/2017 - PDF - English - IEC
Learn More€92.00 -
DIN EN 60749-6:2017-11
Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature (IEC 60749-6:2017), German version EN 60749-6:2017.
11/1/2017 - PDF - German - DIN
Learn More€59.63 -
DIN EN 60749-4:2017-11
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (IEC 60749-4:2017), German version EN 60749-4:2017.
11/1/2017 - PDF - German - DIN
Learn More€72.80 -
DIN EN 60749-9:2017-11
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking (IEC 60749-9:2017), German version EN 60749-9:2017.
11/1/2017 - PDF - German - DIN
Learn More€59.63 -
DIN EN 61975 VDE 0553-975:2017-11
High-voltage direct current (HVDC) installations - System tests (IEC 61975:2010 + A1:2016), German version EN 61975:2010 + A1:2017
11/1/2017 - Paper - German - VDE
Learn More€160.33 -
NF EN 60747-16-4/A2, C96-016-4/A2 (11/2017)
Semiconductor devices - Part 16-4 : microwave integrated circuits - Switches
11/1/2017 - Paper - French - AFNOR
Learn More€54.50 -
JIS C 5630-26:2017
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
10/20/2017 - PDF - Japanese - JSA
Learn More€36.27 -
IEC TR 63133:2017
IEC TR 63133:2017 Semiconductor devices - Scan based ageing level estimation for semiconductor devices
10/11/2017 - PDF - English - IEC
Learn More€132.00 -
BS IEC 62047-30:2017
Semiconductor devices. Micro-electromechanical devices Measurement methods of electro-mechanical conversion characteristics MEMS piezoelectric thin film
10/9/2017 - PDF - English - BSI
Learn More€250.00 -
UNE-EN 60749-43:2017
Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans (Endorsed by Asociación Española de Normalización in October of 2017.)
10/1/2017 - PDF - English - AENOR
Learn More€76.00 -
DIN EN 60747-16-1:2017-10
Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers (IEC 60747-16-1:2001 - A1:2007 - A2:2017), German version EN 60747-16-1:2002 + A1:2007 + A2:2017.
10/1/2017 - PDF - German - DIN
Learn More€158.04 -
DIN EN 62477-1 VDE 0558-477-1:2017-10
Safety requirements for power electronic converter systems and equipment - Part 1: General (IEC 62477-1:2012 + A1:2016), German version EN 62477-1:2012 + A11:2014 + A1:2017
10/1/2017 - Paper - German - VDE
Learn More€268.93 -
IEC 62047-30:2017
IEC 62047-30:2017 Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
9/15/2017 - PDF - English - IEC
Learn More€132.00 -
NF EN 60749-43, C96-022-43 (09/2017)
Semiconductor devices - Mechanical and climatic test methods - Part 43 : guidelines for IC reliability qualification plans - Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 43 : Directives concernant les plans de qualification de la fiabilité des CI
9/1/2017 - Paper - French - AFNOR
Learn More€127.67 -
UNE-EN 60700-2:2016/AC:2017-07
Thyristor valves for high voltage direct current (HVDC) power transmission - Part 2: Terminology (Endorsed by Asociación Española de Normalización in September of 2017.)
9/1/2017 - PDF - English - AENOR
Learn More€0.00 -
IEC 60050-521:2002/AMD1:2017
IEC 60050-521:2002/AMD1:2017 Amendment 1 - International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits
8/30/2017 - PDF - English, French - IEC
Learn More€12.00 -
IEC 62880-1:2017
IEC 62880-1:2017 Semiconductor devices - Stress migration test standard - Part 1: Copper stress migration test standard
8/23/2017 - PDF - English - IEC
Learn More€173.00 -
IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 Edition 1.2
IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 (Consolidated version) Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
8/16/2017 - PDF - English, French - IEC
Learn More€385.00 -
IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 Edition 1.2
IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 (Consolidated version) Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
8/16/2017 - PDF - English - IEC
Learn More€385.00 -
IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 Edition 1.2
IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 (Consolidated version) Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
8/16/2017 - PDF - English - IEC
Learn More€345.00 -
IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 Edition 1.2
IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 (Consolidated version) Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
8/16/2017 - PDF - English, French - IEC
Learn More€345.00 -
IEC 60747-16-4:2004/AMD2:2017
IEC 60747-16-4:2004/AMD2:2017 Amendment 2 - Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
8/16/2017 - PDF - English - IEC
Learn More€12.00 -
IEC 60747-16-3:2002/AMD2:2017
IEC 60747-16-3:2002/AMD2:2017 Amendment 2 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
8/16/2017 - PDF - English - IEC
Learn More€12.00 -
IEC 60747-16-3:2002/AMD2:2017
IEC 60747-16-3:2002/AMD2:2017 Amendment 2 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
8/16/2017 - PDF - English, French - IEC
Learn More€12.00 -
IEC 60747-16-4:2004/AMD2:2017
IEC 60747-16-4:2004/AMD2:2017 Amendment 2 - Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
8/16/2017 - PDF - English, French - IEC
Learn More€12.00 -
BS IEC 62830-2:2017
Semiconductor devices. devices for energy harvesting and generation Thermo power based thermoelectric
8/10/2017 - PDF - English - BSI
Learn More€180.00 -
UNE-EN 60749-28:2017
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level (Endorsed by Asociación Española de Normalización in August of 2017.)
8/1/2017 - PDF - English - AENOR
Learn More€80.00 -
UNE-EN 60749-5:2017
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (Endorsed by Asociación Española de Normalización in August of 2017.)
8/1/2017 - PDF - English - AENOR
Learn More€42.00 -
UNE-EN 61954:2011/A2:2017
Static VAR compensators (SVC) - Testing of thyristor valves (Endorsed by Asociación Española de Normalización in August of 2017.)
8/1/2017 - PDF - English - AENOR
Learn More€24.00 -
NF EN 60747-16-1/A2, C96-016-1/A2 (08/2017)
Semiconductor devices - Part 16-1 : microwave integrated circuits - Amplifiers
8/1/2017 - Paper - French - AFNOR
Learn More€72.00 -
NF EN 60749-5, C96-022-5 (07/2017)
Semiconductor devices - Mechanical and climatic test methods - Part 5 : steady-state temperature humidity bias life test
7/1/2017 - Paper - French - AFNOR
Learn More€72.00 -
UNE-EN 60749-3:2017
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (Endorsed by Asociación Española de Normalización in July of 2017.)
7/1/2017 - PDF - English - AENOR
Learn More€57.00 -
UNE-EN 60749-4:2017
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (Endorsed by Asociación Española de Normalización in July of 2017.)
7/1/2017 - PDF - English - AENOR
Learn More€42.00 -
UNE-EN 60749-6:2017
Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature (Endorsed by Asociación Española de Normalización in July of 2017.)
7/1/2017 - PDF - English - AENOR
Learn More€38.00 -
UNE-EN 60749-9:2017
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking (Endorsed by Asociación Española de Normalización in July of 2017.)
7/1/2017 - PDF - English - AENOR
Learn More€42.00 -
UNE-EN 60747-16-1:2002/A2:2017
Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers (Endorsed by Asociación Española de Normalización in July of 2017.)
7/1/2017 - PDF - English - AENOR
Learn More€35.00 -
NF EN 60749-3, C96-022-3 (06/2017)
Semiconductor devices - Mechanical and climatic test methods - Part 3 : external visual examination
6/1/2017 - Paper - French - AFNOR
Learn More€72.00 -
NF EN 60749-4, C96-022-4 (06/2017)
Semiconductor devices - Mechanical and climatic test methods - Part 4 : Damp Heat, steady state, highly accelerated stress test (HAST)
6/1/2017 - Paper - French - AFNOR
Learn More€72.00 -
NF EN 60749-6, C96-022-6 (06/2017)
Semiconductor devices - Mechanical and climatic test methods - Part 6 : storage at high temperature
6/1/2017 - Paper - French - AFNOR
Learn More€54.67 -
NF EN 60749-9, C96-022-9 (06/2017)
Semiconductor devices - Mechanical and climatic test methods - Part 9 : permanence of marking
6/1/2017 - Paper - French - AFNOR
Learn More€72.00 -
NF EN 60749-28, C96-022-28 (06/2017)
Semiconductor devices - Mechanical and climatic test methods - Part 28 : Electrostatic Discharge (ESD) Sensitivity Testing - Direct contact charged device model (DC-CDM)
6/1/2017 - Paper - French - AFNOR
Learn More€153.67 -
DIN EN 60700-2 VDE 0553-2:2017-06
Thyristor valves for high voltage direct current (HVDC) power transmission - Part 2: Terminology (IEC 60700-2:2016), German version EN 60700-2:2016
6/1/2017 - Paper - German - VDE
Learn More€69.60 -
BS EN 62830-3:2017
Semiconductor devices. devices for energy harvesting and generation Vibration based electromagnetic
4/30/2017 - PDF - English - BSI
Learn More€250.00 -
IEC 62951-1:2017
IEC 62951-1:2017 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates
4/10/2017 - PDF - English - IEC
Learn More€92.00 -
DIN EN 60749-44:2017-04
Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (IEC 60749-44:2016), German version EN 60749-44:2016
4/1/2017 - PDF - German - DIN
Learn More€99.35 -
NF EN 61975/A1, C53-975/A1 (04/2017)
High-voltage direct current (HVDC) installations - System tests
4/1/2017 - Paper - French - AFNOR
Learn More€99.97 -
DIN EN 62047-25:2017-04
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016), German version EN 62047-25:2016
4/1/2017 - PDF - German - DIN
Learn More€99.35 -
IEC 62830-3:2017
IEC 62830-3:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting
3/28/2017 - PDF - English, French - IEC
Learn More€173.00 -
JIS C 5630-1:2017
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
3/21/2017 - PDF - Japanese - JSA
Learn More€41.86 -
IEC 60749-3:2017
IEC 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
3/3/2017 - PDF - English, French - IEC
Learn More€46.00 -
IEC 60749-9:2017
IEC 60749-9:2017 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
3/3/2017 - PDF - English, French - IEC
Learn More€46.00 -
IEC 60749-6:2017
IEC 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
3/3/2017 - PDF - English, French - IEC
Learn More€23.00 -
IEC 60749-4:2017
IEC 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
3/3/2017 - PDF - English, French - IEC
Learn More€46.00 -
IEC 60749-3:2017
IEC 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
3/3/2017 - PDF - English - IEC
Learn More€46.00 -
IEC 60749-4:2017
IEC 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
3/3/2017 - PDF - English - IEC
Learn More€46.00 -
IEC 60749-6:2017
IEC 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
3/3/2017 - PDF - English - IEC
Learn More€23.00 -
IEC 60749-9:2017
IEC 60749-9:2017 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
3/3/2017 - PDF - English - IEC
Learn More€46.00 -
IEC 62830-1:2017
IEC 62830-1:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting
3/3/2017 - PDF - English, French - IEC
Learn More€173.00 -
DIN EN 62779-3 VDE 0884-79-3:2017-03
Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions (IEC 62779-3:2016), German version EN 62779-3:2016
3/1/2017 - Paper - German - VDE
Learn More€49.48 -
UNE-EN 61975:2010/A1:2017
High-voltage direct current (HVDC) installations - System tests (Endorsed by Asociación Española de Normalización in March of 2017.)
3/1/2017 - PDF - English - AENOR
Learn More€65.00 -
UNE-EN 60700-1:2015/AC:2017-02
Thyristor valves for high voltage direct current (HVDC) power transmission - Part 1: Electrical testing (Endorsed by Asociación Española de Normalización in March of 2017.)
3/1/2017 - PDF - English - AENOR
Learn More€0.00 -
IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 Edition 1.2
IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 (Consolidated version) Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
2/15/2017 - PDF - English, French - IEC
Learn More€610.00 -
IEC 60747-16-1:2001/AMD2:2017
IEC 60747-16-1:2001/AMD2:2017 Amendment 2 - Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
2/15/2017 - PDF - English, French - IEC
Learn More€23.00 -
IEC 60747-4:2007+AMD1:2017 Edition 2.1
IEC 60747-4:2007+AMD1:2017 (Consolidated version) Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors
1/30/2017 - PDF - English, French - IEC
Learn More€610.00 -
IEC 60747-4:2007/AMD1:2017
IEC 60747-4:2007/AMD1:2017 Amendment 1 - Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors
1/30/2017 - PDF - English, French - IEC
Learn More€23.00 -
IEC 62830-2:2017
IEC 62830-2:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
1/20/2017 - PDF - English, French - IEC
Learn More€92.00 -
IEC 62047-28:2017
IEC 62047-28:2017 Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices
1/20/2017 - PDF - English - IEC
Learn More€132.00 -
IEC 62047-27:2017
IEC 62047-27:2017 Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
1/20/2017 - PDF - English - IEC
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DIN EN 62779-1 VDE 0884-79-1:2017-01
Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements (IEC 62779-1:2016), German version EN 62779-1:2016
1/1/2017 - Paper - German - VDE
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DIN EN 62779-2 VDE 0884-79-2:2017-01
Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances (IEC 62779-2:2016), German version EN 62779-2:2016
1/1/2017 - Paper - German - VDE
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UNE-EN 60191-6-13:2016
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (Endorsed by Asociación Española de Normalización in January of 2017.)
1/1/2017 - PDF - English - AENOR
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NF EN 60191-6-13, C96-013-6-13 (01/2017)
Mechanical standardization of semiconductor devices - Part 6-13 : design guideline of open-top-type sockets for fine-pitch ball grid array (FBGA) and fine-pitch land grid array (FLGA)
1/1/2017 - Paper - French - AFNOR
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UNE-EN 60700-2:2016
Thyristor valves for high voltage direct current (HVDC) power transmission - Part 2: Terminology (Endorsed by Asociación Española de Normalización in January of 2017.)
1/1/2017 - PDF - English - AENOR
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DIN VDE V 0884-11 VDE V 0884-11:2017-01
Semiconductor devices - Part 11: Magnetic and capacitive coupler for basic and reinforced isolation
1/1/2017 - Paper - German - VDE
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UNE-EN 62047-25:2016
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (Endorsed by Asociación Española de Normalización in January of 2017.)
1/1/2017 - PDF - English - AENOR
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BS EN 60191-6-13:2016
Mechanical standardization of semiconductor devices Design guideline open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Land (FLGA)
12/31/2016 - PDF - English - BSI
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DIN EN 62047-26:2016-12
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 62047-26:2016), German version EN 62047-26:2016
12/1/2016 - PDF - German - DIN
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DIN EN 62047-1:2016-12
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 62047-1:2016), German version EN 62047-1:2016.
12/1/2016 - PDF - German - DIN
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NF EN 60749-44, C96-022-44 (12/2016)
Semiconductor devices - Mechanical and climatic test methods - Part 44 : neutron beam irradiated single event effect (SEE) test method for semiconductor devices
12/1/2016 - Paper - French - AFNOR
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UNE-EN 60749-44:2016
Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (Endorsed by AENOR in December of 2016.)
12/1/2016 - PDF - English - AENOR
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DIN EN 62477-2 VDE 0558-477-2:2016-12
Safety requirements for power electronic converter systems and equipment - Part 2: Power electronic converters from 1000 V a.c. or 1500 V d.c. up to 36 kV a.c. or 54 kV d.c. (IEC 22/275/CDV:2016), German version prEN 62477-2:2016
12/1/2016 - Paper - German - VDE
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NF EN 62047-25, C96-050-25 (12/2016)
Semiconductor devices - Micro-electromechanical devices - Part 25 : silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
12/1/2016 - Paper - French - AFNOR
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BS EN 60749-44:2016
Semiconductor devices. Mechanical and climatic test methods Neutron beam irradiated single event effect (SEE) method for semiconductor devices
11/30/2016 - PDF - English - BSI
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BS EN 62047-25:2016
Semiconductor devices. Micro-electromechanical devices Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength micro bonding area
11/30/2016 - PDF - English - BSI
Learn More€250.00 -
IEC 60191-6-13:2016
IEC 60191-6-13:2016 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
9/27/2016 - PDF - English, French - IEC
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IEC 61975:2010+AMD1:2016 Edition 1.1
IEC 61975:2010+AMD1:2016 (Consolidated version) High-voltage direct current (HVDC) installations - System tests
9/12/2016 - PDF - English, French - IEC
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IEC 61975:2010/AMD1:2016
IEC 61975:2010/AMD1:2016 Amendment 1 - High-voltage direct current (HVDC) installations - System tests
9/12/2016 - PDF - English, French - IEC
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€174.00 -
IEC 62047-25:2016
IEC 62047-25:2016 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
8/29/2016 - PDF - English, French - IEC
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IEC 60749-44:2016
IEC 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
7/21/2016 - PDF - English, French - IEC
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UNE-EN 62779-2:2016
Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances (Endorsed by AENOR in July of 2016.)
7/1/2016 - PDF - English - AENOR
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UNE-EN 62779-1:2016
Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements (Endorsed by AENOR in July of 2016.)
7/1/2016 - PDF - English - AENOR
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UNE-EN 62779-3:2016
Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions (Endorsed by AENOR in July of 2016.)
7/1/2016 - PDF - English - AENOR
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DIN EN 60700-1 VDE 0553-1:2016-07
Thyristor valves for high voltage direct current (HVDC) power transmission - Part 1: Electrical testing (IEC 60700-1:2015), German version EN 60700-1:2015
7/1/2016 - Paper - German - VDE
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BS EN 62779-1:2016
Semiconductor devices. interface for human body communication General requirements
6/30/2016 - PDF - English - BSI
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BS EN 62779-2:2016
Semiconductor devices. interface for human body communication Characterization of interfacing performances
6/30/2016 - PDF - English - BSI
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BS EN 62779-3:2016
Semiconductor devices. interface for human body communication Functional type and its operational conditions
6/30/2016 - PDF - English - BSI
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UNE-EN 62047-26:2016
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (Endorsed by AENOR in June of 2016.)
6/1/2016 - PDF - English - AENOR
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BS EN 62047-26:2016
Semiconductor devices. Micro-electromechanical devices Description and measurement methods for micro trench needle structures
5/31/2016 - PDF - English - BSI
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UNE-EN 62047-1:2016
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (Endorsed by AENOR in May of 2016.)
5/1/2016 - PDF - English - AENOR
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€430.00
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BS EN 62047-1:2016
Semiconductor devices. Micro-electromechanical devices Terms and definitions
4/30/2016 - PDF - English - BSI
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IEC 62779-3:2016
IEC 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
4/26/2016 - PDF - English, French - IEC
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IEC 60747-2:2016
IEC 60747-2:2016 Semiconductor devices - Part 2: Discrete devices - Rectifier diodes
4/13/2016 - PDF - English, French - IEC
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IEC 60747-6:2016
IEC 60747-6:2016 Semiconductor devices - Part 6: Discrete devices - Thyristors
4/13/2016 - PDF - English, French - IEC
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JIS C 6790:2016
Load test of a bolt-clamped Langevin vibrator using wattmeter method
3/22/2016 - PDF - Japanese - JSA
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IEC 60747-5-7:2016
IEC 60747-5-7:2016 Semiconductor devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors
2/23/2016 - PDF - English, French - IEC
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IEC 62779-2:2016
IEC 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
2/18/2016 - PDF - English, French - IEC
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IEC 62779-1:2016
IEC 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
2/18/2016 - PDF - English, French - IEC
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IEC 62047-26:2016
IEC 62047-26:2016 Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
1/7/2016 - PDF - English, French - IEC
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IEC 62047-1:2016
IEC 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
1/6/2016 - PDF - English, French - IEC
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DIN EN 60747-17 VDE 0884-17:2016-01
Semiconductor devices - Magnetic and capacitive coupler for basic and reinforced insulation (IEC 47E/511/CD:2015)
1/1/2016 - Paper - German - VDE
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DIN EN 62047-16:2015-12
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 62047-16:2015), German version EN 62047-16:2015
12/1/2015 - PDF - German - DIN
Learn More€79.72 -
DIN EN 62047-17:2015-12
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films (IEC 62047-17:2015), German version EN 62047-17:2015
12/1/2015 - PDF - German - DIN
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JIS C 5630-20:2015
Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
11/20/2015 - PDF - Japanese - JSA
Learn More€46.02 -
UNE-EN 60700-1:2015
Thyristor valves for high voltage direct current (HVDC) power transmission - Part 1: Electrical testing (Endorsed by AENOR in November of 2015.)
11/1/2015 - PDF - English - AENOR
Learn More€81.00 -
NF EN 62047-16, C96-050-16 (11/2015)
Semiconductor devices - Micro-electromechanical devices - Part 16 : test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
11/1/2015 - Paper - French - AFNOR
Learn More€88.33 -
NF EN 62047-17, C96-050-17 (11/2015)
Semiconductor devices - Micro-electromechanical devices - Part 17 : bulge test method for measuring mechanical properties of thin films - Dispositifs à semiconducteurs
11/1/2015 - Paper - French - AFNOR
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UNE-EN 62007-1:2015
Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics (Endorsed by AENOR in August of 2015.)
8/1/2015 - PDF - English - AENOR
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UNE-EN 62047-16:2015
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods (Endorsed by AENOR in August of 2015.)
8/1/2015 - PDF - English - AENOR
Learn More€57.00 -
UNE-EN 62047-17:2015
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films (Endorsed by AENOR in August of 2015.)
8/1/2015 - PDF - English - AENOR
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BS EN 62047-15:2015
Semiconductor devices. Micro-electromechanical devices Test method of bonding strength between PDMS and glass
7/31/2015 - PDF - English - BSI
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BS EN 62047-17:2015
Semiconductor devices. Micro-electromechanical devices Bulge test method for measuring mechanical properties of thin films
7/31/2015 - PDF - English - BSI
Learn More€293.00 -
BS EN 62047-16:2015
Semiconductor devices. Micro-electromechanical devices Test methods for determining residual stresses of MEMS films. Wafer curvature and cantilever beam deflection
7/31/2015 - PDF - English - BSI
Learn More€180.00 -
DIN EN 60749-42:2015-05
Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage (IEC 60749-42:2014), German version EN 60749-42:2014
5/1/2015 - PDF - German - DIN
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BS IEC 60747-3:2013
Semiconductor devices Discrete devices: Signal, switching and regulator diodes
4/30/2015 - PDF - English - BSI
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DIN EN 62047-20:2015-04
Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (IEC 62047-20:2014), German version EN 62047-20:2014
4/1/2015 - PDF - German - DIN
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DIN EN 62047-21:2015-04
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (IEC 62047-21:2014), German version EN 62047-21:2014
4/1/2015 - PDF - German - DIN
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DIN EN 62047-22:2015-04
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014), German version EN 62047-22:2014
4/1/2015 - PDF - German - DIN
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IEC 62007-1:2015
IEC 62007-1:2015 Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics
3/30/2015 - PDF - English, French - IEC
Learn More€270.00 -
IEC 62047-17:2015
IEC 62047-17:2015 Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
3/5/2015 - PDF - English, French - IEC
Learn More€219.00 -
IEC 62047-16:2015
IEC 62047-16:2015 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
3/5/2015 - PDF - English, French - IEC
Learn More€46.00 -
NF EN 60749-42, C96-022-42 (03/2015)
Semiconductor devices - Mechanical and climatic test methods - Part 42 : temperature humidity storage - Dispositifs à semiconducteurs
3/1/2015 - Paper - French - AFNOR
Learn More€72.00 -
JIS C 5630-18:2014
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
12/22/2014 - PDF - Japanese - JSA
Learn More€25.00 -
NF EN 62047-22, C96-050-22 (12/2014)
Semiconductor devices - Micro-electromechanical devices - Part 22 : electromechanical tensile test method for conductive thin films on flexible substrates - Dispositifs à semiconducteurs
12/1/2014 - Paper - French - AFNOR
Learn More€72.00 -
NF EN 62047-21, C96-050-21 (12/2014)
Semiconductor devices - Micro-electromechanical devices - Part 21 : test method for Poisson's ratio of thin film MEMS materials - Dispositifs à semiconducteurs
12/1/2014 - Paper - French - AFNOR
Learn More€88.00 -
NF EN 62047-20, C96-050-20 (12/2014)
Semiconductor devices - Micro-electromechanical devices - Part 20 : gyroscopes
12/1/2014 - Paper - French - AFNOR
Learn More€153.67 -
PD CLC/TR 62258-4:2013
Semiconductor die products Questionnaire for users and suppliers
11/30/2014 - PDF - English - BSI
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UNE-EN 60749-42:2014
Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage (Endorsed by AENOR in November of 2014.)
11/1/2014 - PDF - English - AENOR
Learn More€42.00 -
UNE-EN 62047-20:2014
Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (Endorsed by AENOR in November of 2014.)
11/1/2014 - PDF - English - AENOR
Learn More€90.00 -
UNE-EN 62047-21:2014
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (Endorsed by AENOR in November of 2014.)
11/1/2014 - PDF - English - AENOR
Learn More€59.00 -
UNE-EN 62047-22:2014
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (Endorsed by AENOR in November of 2014.)
11/1/2014 - PDF - English - AENOR
Learn More€57.00 -
BS EN 60749-42:2014
Semiconductor devices. Mechanical and climatic test methods Temperature humidity storage
10/31/2014 - PDF - English - BSI
Learn More€151.00 -
BS EN 62047-20:2014
Semiconductor devices. Micro-electromechanical devices Gyroscopes
10/31/2014 - PDF - English - BSI
Learn More€348.00 -
BS EN 62047-21:2014
Semiconductor devices. Micro-electromechanical devices Test method for Poisson's ratio of thin film MEMS materials
10/31/2014 - PDF - English - BSI
Learn More€180.00 -
BS EN 62047-22:2014
Semiconductor devices. Micro-electromechanical devices Electromechanical tensile test method for conductive thin films on flexible substrates
10/31/2014 - PDF - English - BSI
Learn More€151.00 -
IEC 60749-42:2014
IEC 60749-42:2014 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
8/12/2014 - PDF - English, French - IEC
Learn More€23.00 -
NF EN 60191-4, C96-013-4 (08/2014)
Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages
8/1/2014 - Paper - French - AFNOR
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14/30309496 DC:2014
BS EN 62612 AMD1. Self-ballasted LED lamps for general lighting services with supply voltages = 50V. Performance requirements
7/1/2014 - PDF - English - BSI
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IEC 62047-20:2014
IEC 62047-20:2014 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
6/26/2014 - PDF - English, French - IEC
Learn More€345.00 -
IEC 62047-21:2014
IEC 62047-21:2014 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
6/19/2014 - PDF - English, French - IEC
Learn More€92.00 -
IEC 62047-22:2014
IEC 62047-22:2014 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
6/19/2014 - PDF - English, French - IEC
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UNE-EN 60191-4:2014
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (Endorsed by AENOR in May of 2014.)
5/1/2014 - PDF - English - AENOR
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DIN EN 62047-11:2014-04
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (IEC 62047-11:2013), German version EN 62047-11:2013
4/1/2014 - PDF - German - DIN
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DIN EN 62047-18:2014-04
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013), German version EN 62047-18:2013
4/1/2014 - PDF - German - DIN
Learn More€85.79
