31.020 : Electronic components in general
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JIS C 61760-4:2016
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
12/20/2016 - PDF - Japanese - JSA
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JIS C 62137-4:2016
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
3/22/2016 - PDF - Japanese - JSA
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JIS C 62137-3:2014
Electronics Assembly Technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
9/22/2014 - PDF - Japanese - JSA
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JIS C 0806-3:2014
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
2/20/2014 - PDF - Japanese - JSA
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JIS C 9912:2014
The marking for identification of plastic parts for electrical and electronic equipment
2/20/2014 - PDF - Japanese - JSA
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€58.50
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JIS C 62137-1-3:2011 (R2016)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
12/20/2011 - PDF - Japanese - JSA
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JIS C 62137-1-4:2011 (R2016)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
12/20/2011 - PDF - Japanese - JSA
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JIS C 62137-1-5:2011 (R2016)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
12/20/2011 - PDF - Japanese - JSA
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JIS C 9910:2011 (R2015)
Environmentally conscious design for electrical and electronic products
3/22/2011 - PDF - Japanese - JSA
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JIS C 62137-1-1:2010 (R2015)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
5/20/2010 - PDF - Japanese - JSA
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JIS C 62137-1-2:2010 (R2015)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
5/20/2010 - PDF - Japanese - JSA
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JIS C 5070:2009 (R2014)
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
12/21/2009 - PDF - Japanese - JSA
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JIS B 9960-1:2008
Safety of machinery - Electrical equipment of machines - Part 1: General requirements
5/25/2008 - PDF - Japanese - JSA
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JIS C 5750-4-1:2008 (R2017)
Dependability management - Part 4-1: Application guide - Dependability of products containing reused parts - Requirements for functionality and test
3/20/2008 - PDF - Japanese - JSA
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JIS C 5750-3-5:2006 (R2015)
Dependability management - Part 3-5: Application guide - Reliability test conditions and statistical test principles
3/25/2006 - PDF - Japanese - JSA
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JIS C 0806-6:2006 (R2015)
Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components
3/25/2006 - PDF - Japanese - JSA
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JIS C 60050-551:2005 (R2015)
International Electrotechnical Vocabulary - Part 551: Power electronics
12/20/2005 - PDF - Japanese - JSA
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JIS C 0806-1:1999 (R2014)
Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes
2/20/1999 - PDF - Japanese - JSA
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€41.86
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€25.00
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JIS C 5003:1974 (R2014)
General test procedure of failure rate for electronic components
7/1/1974 - PDF - Japanese - JSA
Learn More€25.00
