31 : Electronics
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20/30420916 DC:2020
BS EN 60825-12. Safety of laser products Part 12. free space optical communication systems used for transmission information
5/21/2020 - PDF - English - BSI
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BS EN IEC 60384-11:2019
Fixed capacitors for use in electronic equipment Sectional specification. polyethylene-terephthalate film dielectric metal foil DC
5/20/2020 - PDF - English - BSI
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BS EN IEC 60384-26:2018
Fixed capacitors for use in electronic equipment Sectional specification. aluminium electrolytic with conductive polymer solid electrolyte
5/20/2020 - PDF - English - BSI
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BS EN IEC 62610-6:2020
Mechanical structures for electrical and electronic equipment. Thermal management cabinets in accordance with IEC 60297 60917 series Air recirculation bypass of indoor
5/20/2020 - PDF - English - BSI
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€215.67
-
BS EN IEC 61643-331:2020
Components for low-voltage surge protection Performance requirements and test methods metal oxide varistors (MOV)
5/13/2020 - PDF - English - BSI
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IEC 61643-341:2020
IEC 61643-341:2020 Components for low-voltage surge protection - Part 341: Performance requirements and test circuits for thyristor surge suppressors (TSS)
5/13/2020 - PDF - English, French - IEC
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IEC 62384:2020
IEC 62384:2020 DC or AC supplied electronic controlgear for LED modules - Performance requirements
5/13/2020 - PDF - English, French - IEC
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IEC 62384:2020 + Redline
IEC 62384:2020 (Redline version) DC or AC supplied electronic controlgear for LED modules - Performance requirements
5/13/2020 - PDF - English - IEC
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PD IEC TR 62396-8:2020
Process management for avionics. Atmospheric radiation effects Proton, electron, pion, muon, alpha-ray fluxes and single event in avionics electronic equipment. Awareness guidelines
5/12/2020 - PDF - English - BSI
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20/30405239 DC:2020
BS EN 63041-1 Ed.2.0. Piezoelectric sensors Part 1. Generic specifications
5/12/2020 - PDF - English - BSI
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IEC 61969-1:2020
IEC 61969-1:2020 Mechanical structures for electrical and electronic equipment - Outdoor enclosures - Part 1: Design guidelines
5/12/2020 - PDF - English, French - IEC
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IEC 61969-1:2020 + Redline
IEC 61969-1:2020 (Redline version) Mechanical structures for electrical and electronic equipment - Outdoor enclosures - Part 1: Design guidelines
5/12/2020 - PDF - English - IEC
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20/30407343 DC:2020
BS EN 60700-1 AMD1. Thyristor valves for high voltage direct current (HVDC) power transmission Part 1. Electrical testing
5/8/2020 - PDF - English - BSI
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IEC TR 62629-51-1:2020
IEC TR 62629-51-1:2020 3D display devices - Part 51-1: Generic introduction of aerial display
5/7/2020 - PDF - English - IEC
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€253.59
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BS EN IEC 61076-3-124:2019
Connectors for electrical and electronic equipment. Product requirements Rectangular connectors. Detail specification 10-way, shielded, free fixed connectors I/O data transmission with frequencies up to 500 MHz
5/6/2020 - PDF - English - BSI
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BS IEC 62906-5-6:2020
Laser displays Measuring methods for optical performance of projection screens
5/5/2020 - PDF - English - BSI
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20/30390865 DC:2020
BS EN ISO 11146-1. Lasers and laser-related equipment. Test methods for laser beam widths, divergence angles propagation ratios Part 1. Stigmatic simple astigmatic beams
5/5/2020 - PDF - English - BSI
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€61.17 -
20/30406252 DC:2020
BS EN 60444-6. Measurement of quartz crystal unit parameters Part 6. drive level dependence (DLD)
5/1/2020 - PDF - English - BSI
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€83.64
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€90.98
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€108.39
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20/30390868 DC:2020
BS ENISO 11146-2. Lasers and laser-related equipment. Test methods for laser beam widths, divergence angles propagation ratios Part 2. General astigmatic beams
5/1/2020 - PDF - English - BSI
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20/30365093 DC:2020
BS IEC 62471-6. Photobiological Safety of Ultraviolet Lamp Products
5/1/2020 - PDF - English - BSI
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PD IEC TS 62686-1:2020
Process management for avionics. Electronic components aerospace, defence and high performance (ADHP) applications General requirements reliability integrated circuits discrete semiconductors
4/29/2020 - PDF - English - BSI
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IEC TR 62396-8:2020
IEC TR 62396-8:2020 Process management for avionics - Atmospheric radiation effects - Part 8: Proton, electron, pion, muon, alpha-ray fluxes and single event effects in avionics electronic equipment - Awareness guidelines
4/28/2020 - PDF - English - IEC
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IEC 62047-37:2020
IEC 62047-37:2020 Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application
4/28/2020 - PDF - English, French - IEC
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IEC 62906-5-6:2020
IEC 62906-5-6:2020 Laser displays - Part 5-6: Measuring methods for optical performance of projection screens
4/28/2020 - PDF - English - IEC
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IEC 63155:2020
IEC 63155:2020 Guidelines for the measurement method of power durability for surface acoustic wave (SAW) and bulk acoustic wave (BAW) devices in radio frequency (RF) applications
4/24/2020 - PDF - English, French - IEC
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IEC 60050-531:1974/AMD2:2020
IEC 60050-531:1974/AMD2:2020 Amendment 2 - International Electrotechnical Vocabulary (IEV) - Part 531: Electronic tubes
4/23/2020 - PDF - English, French - IEC
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BS EN IEC 62435-3:2020
Electronic components. Long-term storage of electronic semiconductor devices Data
4/22/2020 - PDF - English - BSI
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20/30409140 DC:2020
BS IEC 61189-2-807 Ed.1.0. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-807. materials structures. Decomposition Temperature (Td) using TGA
4/22/2020 - PDF - English - BSI
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IEC 61189-5-504:2020
IEC 61189-5-504:2020 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)
4/21/2020 - PDF - English, French - IEC
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IEC TS 62686-1:2020
IEC TS 62686-1:2020 Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
4/20/2020 - PDF - English - IEC
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IEC TS 62686-1:2020 + Redline
IEC TS 62686-1:2020 (Redline version) Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
4/20/2020 - PDF - English - IEC
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IEC 61076-8-102:2020
IEC 61076-8-102:2020 Connectors for electrical and electronic equipment - Product requirements - Part 8-102: Power connectors - Detail specification for 2-pole or 3-pole power plus 2-pole signal shielded and sealed connectors with plastic housing for rated current of 150 A
4/16/2020 - PDF - English, French - IEC
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IEC 63171-1:2020
IEC 63171-1:2020 Connectors for electrical and electronic equipment - Part 1: Detail specification for two-way, shielded or unshielded, free and fixed connectors - Mechanical mating information, pin assignment and additional requirements for Type 1 copper LC style
4/14/2020 - PDF - English, French - IEC
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IPC 4101E-WAM1
Specification for Base Materials for Rigid and Multilayer Printed Boards
4/14/2020 - PDF sécurisé - English - IPC
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20/30402071 DC:2020
BS EN IEC 63002. Interoperability specifications and communication method for external power supplies used with computing and consumer electronics devices (TA 18)
4/10/2020 - PDF - English - BSI
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20/30384001 DC:2020
BS ISO 13142. Optics and photonics. Lasers and laser-related equipment. Cavity ring-down method for high-reflectance and high-transmittance measurements
4/10/2020 - PDF - English - BSI
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IEC 61076-8-101:2020
IEC 61076-8-101:2020 Connectors for electrical and electronic equipment - Product requirements - Part 8-101: Power connectors - Detail specification for 2-pole or 3-pole power plus 2-pole signal shielded and sealed connectors with plastic housing for rated current of 40 A
4/9/2020 - PDF - English, French - IEC
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IEC 61076-8-100:2020
IEC 61076-8-100:2020 Connectors for electrical and electronic equipment - Product requirements - Part 8-100: Power connectors - Detail specification for 2-pole or 3-pole power plus 2-pole signal shielded and sealed connectors with plastic housing for rated current of 20 A
4/9/2020 - PDF - English, French - IEC
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20/30355224 DC:2020
BS EN ISO 11807-1. Integrated optics. Vocabulary Part 1. Optical waveguide basic terms and symbols
4/8/2020 - PDF - English - BSI
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20/30354221 DC:2020
BS EN ISO 14881. Integrated optics. Interfaces. Parameters relevant to coupling properties
4/8/2020 - PDF - English - BSI
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20/30354213 DC:2020
BS EN ISO 11807-2. Integrated optics. Vocabulary Part 2. Terms used in classification
4/8/2020 - PDF - English - BSI
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IPC WP-014A
Pb-free Electronics Risk Management (PERM) Council Position on the Use of Pb-free Electronics in the Aerospace and Defense Electronics Industries
4/7/2020 - Paper - English - IPC
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IPC WP-014A
Pb-free Electronics Risk Management (PERM) Council Position on the Use of Pb-free Electronics in the Aerospace and Defense Electronics Industries
4/7/2020 - PDF sécurisé - English - IPC
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€299.70
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€161.95
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20/30416273 DC:2020
BS EN IEC 61967-4. Integrated circuits. Measurement of electromagnetic emissions Part 4. conducted emissions, 1 ohm/150 ohm direct coupling method
4/3/2020 - PDF - English - BSI
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BS EN ISO 11554:2017
Optics and photonics. Lasers and laser-related equipment. Test methods for laser beam power, energy and temporal characteristics
4/3/2020 - PDF - English - BSI
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BS IEC 60191-2:1966+A21:2020
Mechanical standardization of semiconductor devices Dimensions
4/2/2020 - PDF - English - BSI
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20/30415914 DC:2020
BS IEC 62906-5-7. Laser displays Part 5-7. Measuring methods of visual quality for scanning laser
4/2/2020 - PDF - English - BSI
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ISO 11553-1:2020
ISO 11553-1:2020 Safety of machinery - Laser processing machines - Part 1: Laser safety requirements
4/2/2020 - PDF - English - ISO
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€90.98
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JEDEC JESD22-A113I:2020
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
4/1/2020 - PDF - English - JEDEC
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BS EN IEC 63171-6:2020
Connectors for electrical and electronic equipment Detail specification 2-way 4-way (data/power), shielded, free fixed connectors power data transmission with frequencies up to 600 MHz
4/1/2020 - PDF - English - BSI
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20/30409285 DC:2020
BS IEC 63284. Semiconductor devices. Reliability test method of on-stress reliability by inductive load switching for gallium nitride transistors
4/1/2020 - PDF - English - BSI
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20/30406234 DC:2020
BS IEC 63275-2 Ed.1.0. Semiconductor devices. Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors Part 2. Test bipolar degradation by body diode operating
4/1/2020 - PDF - English - BSI
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20/30406230 DC:2020
BS IEC 63275-1. Semiconductor devices. Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors Part 1. Test bias temperature instability
4/1/2020 - PDF - English - BSI
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€116.51
-
IPC 4101E-WAM1
Specification for Base Materials for Rigid and Multilayer Printed Boards
4/1/2020 - Paper - English - IPC
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20/30378652 DC:2020
BS ISO 22248. Lasers and laser-related equipment. Test methods for laser-induced damage threshold. Classification of medical beam delivery systems
3/31/2020 - PDF - English - BSI
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€300.99
-
IEC 62610-6:2020
IEC 62610-6:2020 Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 Series - Part 6: Air recirculation and bypass of indoor cabinets
3/25/2020 - PDF - English - IEC
Learn More€147.00 -
PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed
3/23/2020 - PDF - English - BSI
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20/30406248 DC:2020
BS EN IEC 61837-2 AMD1. Surface mounted piezoelectric devices for frequency control and selection. Standard outlines terminal lead connections Part 2. Ceramic enclosures
3/20/2020 - PDF - English - BSI
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20/30404087 DC:2020
BS IEC 62906-5-7. Laser displays Part 5-7. Measuring methods of visual quality for scanning laser
3/20/2020 - PDF - English - BSI
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IEC 61643-331:2020
IEC 61643-331:2020 Components for low-voltage surge protection - Part 331: Performance requirements and test methods for metal oxide varistors (MOV)
3/19/2020 - PDF - English - IEC
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IEC 61643-331:2020 + Redline
IEC 61643-331:2020 (Redline version) Components for low-voltage surge protection - Part 331: Performance requirements and test methods for metal oxide varistors (MOV)
3/19/2020 - PDF - English - IEC
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€215.67
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IEC 60115-1:2020
IEC 60115-1:2020 Fixed resistors for use in electronic equipment - Part 1: Generic specification
3/18/2020 - PDF - English, French - IEC
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IPC J-STD-001GA/A-610GA:2020
Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G Acceptability of Electronic Assemblies
3/18/2020 - PDF sécurisé - English - IPC
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IPC J-STD-001GS-AM1:2020
Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G - Requirements for Soldered Electrical and Electronic Assemblies
3/17/2020 - Paper - English - IPC
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IPC J-STD-001GS-AM1:2020
Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G - Requirements for Soldered Electrical and Electronic Assemblies
3/17/2020 - PDF sécurisé - English - IPC
Learn More€41.00 -
20/30415103 DC:2020
BS EN IEC 60068-2-11. Basic environmental testing procedures Part 2-11. Tests. Test Ka. Salt mist
3/13/2020 - PDF - English - BSI
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IEEE 1838:2019
IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits
3/13/2020 - PDF - English - IEEE
Learn More€93.06 -
IEEE 1481:2019
IEEE Standard for Integrated Circuit (IC) Open Library Architecture (OLA)
3/13/2020 - PDF - English - IEEE
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IEEE 1481:2019
IEEE Standard for Integrated Circuit (IC) Open Library Architecture (OLA)
3/13/2020 - Paper - English - IEEE
Learn More€116.56 -
IEEE 1838:2019
IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits
3/13/2020 - Paper - English - IEEE
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20/30411003 DC:2020
BS EN 60286-1 AMD1. Packaging of components for automatic handling Part 1. Tape packaging with axial leads on continuous tapes
3/12/2020 - PDF - English - BSI
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20/30415081 DC:2020
BS EN 60947-9-2. Low-voltage switchgear and controlgear. Active arc-fault mitigation systems Part 9-2. Optical-based internal arc-detection devices
3/12/2020 - PDF - English - BSI
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IEC 61163-2:2020
IEC 61163-2:2020 Reliability stress screening - Part 2: Components
3/11/2020 - PDF - English, French - IEC
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IEC TR 61191-7:2020
IEC TR 61191-7:2020 Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
3/11/2020 - PDF - English - IEC
Learn More€335.00 -
SAE ARP 5293A:2020-03-10
Safety Considerations for Lasers Projected in the Navigable Airspace
3/10/2020 - PDF - English - SAE
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20/30406672 DC:2020
BS EN 60204-1 AMD1. Safety of machinery. Electrical equipment machines Part 1. General requirements
3/6/2020 - PDF - English - BSI
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20/30410215 DC:2020
BS EN IEC 63287-1. Semiconductor devices. Generic semiconductor qualification guidelines Part 1. Guidelines for LSI reliability
3/6/2020 - PDF - English - BSI
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20/30404574 DC:2020
BS EN IEC 62047-41. Semiconductor devices. Micro-electromechanical devices Part 41. RF MEMS Circulators and Isolators
3/6/2020 - PDF - English - BSI
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20/30414819 DC:2020
BS EN IEC 62906-5-1. Laser displays Part 5-1. Measurement of optical performance for laser front projection
3/6/2020 - PDF - English - BSI
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20/30414411 DC:2020
BS EN 60747-16-7. Semiconductor devices Part 16-7. Microwave integrated circuits. Attenuators
3/5/2020 - PDF - English - BSI
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20/30414415 DC:2020
BS EN 60747-16-8. Semiconductor devices Part 16-8. Microwave integrated circuits. Limiters
3/5/2020 - PDF - English - BSI
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€52.27
-
€129.70
-
€129.70
-
€90.98
-
€98.42
-
€61.17
-
19/30381469 DC:2020
BS EN IEC 63171-2. Connectors for electrical and electronic equipment Part 2. Detail specification 2-way, shielded or unshielded, free fixed connectors: mechanical mating information, pin assignment additional requirements type
2/28/2020 - PDF - English - BSI
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BS EN ISO 11551:2019
Optics and photonics. Lasers and laser-related equipment. Test method for absorptance of optical laser components
2/28/2020 - PDF - English - BSI
Learn More€215.67 -
PD IEC/TR 62240-1:2018 + Redline
Tracked Changes. Process management for avionics. Electronic components capability in operation Temperature uprating
2/27/2020 - PDF - English - BSI
Learn More€391.29 -
BS EN 60286-1:2017 + Redline
Tracked Changes. Packaging of components for automatic handling Tape packaging with axial leads on continuous tapes
2/27/2020 - PDF - English - BSI
Learn More€200.27 -
BS IEC 62396-2:2017 + Redline
Tracked Changes. Process management for avionics. Atmospheric radiation effects Guidelines single event testing avionics systems
2/27/2020 - PDF - English - BSI
Learn More€369.72 -
BS EN IEC 60512-8-3:2018 + Redline
Tracked Changes. Connectors for electrical and electronic equipment. Tests measurements Static load tests (fixed connectors). Test 8c: Robustness of actuating lever
2/27/2020 - PDF - English - BSI
Learn More€200.27 -
BS EN 60749-5:2017 + Redline
Tracked Changes. Semiconductor devices. Mechanical and climatic test methods Steady-state temperature humidity bias life
2/27/2020 - PDF - English - BSI
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BS EN IEC 60749-26:2018 + Redline
Tracked Changes. Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)
2/27/2020 - PDF - English - BSI
Learn More€391.29 -
BS EN IEC 60512-15-2:2018 + Redline
Tracked Changes. Connectors for electrical and electronic equipment. Tests measurements Connector tests (mechanical). Test 15b: Insert retention in housing (axial)
2/27/2020 - PDF - English - BSI
Learn More€169.46 -
BS EN IEC 60512-1:2018 + Redline
Tracked Changes. Connectors for electrical and electronic equipment. Tests measurements Generic specification
2/27/2020 - PDF - English - BSI
Learn More€200.27 -
BS IEC 60747-6:2016 + Redline
Tracked Changes. Semiconductor devices Discrete devices. Thyristors
2/27/2020 - PDF - English - BSI
Learn More€483.72 -
BS EN IEC 61051-1:2018 + Redline
Tracked Changes. Varistors for use in electronic equipment Generic specification
2/27/2020 - PDF - English - BSI
Learn More€391.29 -
PD IEC TS 61994-4-1:2018 + Redline
Tracked Changes. Piezoelectric, dielectric and electrostatic devices associated materials for frequency control, selection detection. Glossary Piezoelectric materials. Synthetic quartz crystal
2/27/2020 - PDF - English - BSI
Learn More€169.46 -
PD IEC TS 61994-4-4:2018 + Redline
Tracked Changes. Piezoelectric, dielectric and electrostatic devices associated materials for frequency control, selection detection. Glossary Piezoelectric materials. Single crystal wafers surface acoustic wave (SAW)
2/27/2020 - PDF - English - BSI
Learn More€200.27 -
BS EN IEC 61191-1:2018 + Redline
Tracked Changes. Printed board assemblies Generic specification. Requirements for soldered electrical and electronic using surface mount related assembly technologies
2/27/2020 - PDF - English - BSI
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BS EN IEC 61190-1-3:2018 + Redline
Tracked Changes. Attachment materials for electronic assembly Requirements grade solder alloys and fluxed non-fluxed solid soldering applications
2/27/2020 - PDF - English - BSI
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NBN EN ISO 15902:2020
Optics and photonics - Diffractive optics - Vocabulary (ISO 15902:2019)
2/27/2020 - PDF - English - NBN
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NBN EN ISO 15902:2020
Optics and photonics - Diffractive optics - Vocabulary (ISO 15902:2019)
2/27/2020 - PDF - French - NBN
Learn More€30.00 -
BS EN ISO 11145:2018 + Redline
Tracked Changes. Optics and photonics. Lasers and laser-related equipment. Vocabulary and symbols
2/27/2020 - PDF - English - BSI
Learn More€280.37 -
BS EN ISO 13694:2018 + Redline
Tracked Changes. Optics and photonics. Lasers and laser-related equipment. Test methods for laser beam power (energy) density distribution
2/27/2020 - PDF - English - BSI
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NBN EN ISO 15902:2020
Optics and photonics - Diffractive optics - Vocabulary (ISO 15902:2019)
2/27/2020 - PDF - German - NBN
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PD IEC/TS 62564-1:2016 + Redline
Tracked Changes. Process management for avionics. Aerospace qualified electronic components (AQEC) Integrated circuits and discrete semiconductors
2/26/2020 - PDF - English - BSI
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BS EN 61360-1:2017 + Redline
Tracked Changes. Standard data element types with associated classification scheme Definitions. Principles and methods
2/26/2020 - PDF - English - BSI
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BS EN 60286-2:2015 + Redline
Tracked Changes. Packaging of components for automatic handling with unidirectional leads on continuous tapes
2/26/2020 - PDF - English - BSI
Learn More€329.67 -
BS EN 60384-9:2015 + Redline
Tracked Changes. Fixed capacitors for use in electronic equipment Sectional specification: of ceramic dielectric, Class 2
2/26/2020 - PDF - English - BSI
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BS EN 60384-3:2016 + Redline
Tracked Changes. Fixed capacitors for use in electronic equipment Sectional specification. Surface mount fixed tantalum electrolytic with solid (MnO2) electrolyte
2/26/2020 - PDF - English - BSI
Learn More€329.67 -
BS EN 60758:2016 + Redline
Tracked Changes. Synthetic quartz crystal. Specifications and guidelines for use
2/26/2020 - PDF - English - BSI
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BS EN 61191-3:2017 + Redline
Tracked Changes. Printed board assemblies Sectional specification. Requirements for through-hole mount soldered
2/26/2020 - PDF - English - BSI
Learn More€280.37 -
PD IEC/TR 60825-17:2015 + Redline
Tracked Changes. Safety of laser products aspects for use passive optical components and cables in high power fibre communication systems
2/26/2020 - PDF - English - BSI
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BS EN 61709:2017 + Redline
Tracked Changes. Electric components. Reliability. Reference conditions for failure rates and stress models for conversion
2/25/2020 - PDF - English - BSI
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BS EN 60384-1:2016 + Redline
Tracked Changes. Fixed capacitors for use in electronic equipment Generic specification
2/25/2020 - PDF - English - BSI
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BS EN 60793-1-33:2017 + Redline
Tracked Changes. Optical fibres Measurement methods and test procedures - Stress corrosion susceptibility
2/25/2020 - PDF - English - BSI
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IPC 6012E:2020
Qualification and Performance Specification for Rigid Printed Boards
2/25/2020 - Paper - English - IPC
Learn More€226.80 -
PD IEC TS 62686-2:2019 + Redline
Tracked Changes. Process management for avionics. Electronic components aerospace, defence and high performance (ADHP) applications General requirements passive
2/24/2020 - PDF - English - BSI
Learn More€391.29 -
BS EN IEC 62474:2019 + Redline
Tracked Changes. Material declaration for products of and for the electrotechnical industry
2/24/2020 - PDF - English - BSI
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BS EN 61340-5-1:2016 + Redline
Tracked Changes. Electrostatics Protection of electronic devices from electrostatic phenomena. General requirements
2/24/2020 - PDF - English - BSI
Learn More€280.37 -
BS EN IEC 60286-3:2019 + Redline
Tracked Changes. Packaging of components for automatic handling surface mount on continuous tapes
2/24/2020 - PDF - English - BSI
Learn More€369.72 -
BS EN IEC 60749-18:2019 + Redline
Tracked Changes. Semiconductor devices. Mechanical and climatic test methods Ionizing radiation (total dose)
2/24/2020 - PDF - English - BSI
Learn More€280.37 -
BS EN IEC 60749-17:2019 + Redline
Tracked Changes. Semiconductor devices. Mechanical and climatic test methods Neutron irradiation
2/24/2020 - PDF - English - BSI
Learn More€169.46 -
BS EN IEC 60512-23-3:2019 + Redline
Tracked Changes. Connectors for electrical and electronic equipment. Tests measurements Screening filtering tests. Test 23c: Shielding effectiveness of connectors accessories. Line injection method
2/24/2020 - PDF - English - BSI
Learn More€200.27 -
BS EN IEC 61020-1:2019 + Redline
Tracked Changes. Electromechanical switches for use in electrical and electronic equipment Generic specification
2/24/2020 - PDF - English - BSI
Learn More€422.10 -
BS EN IEC 60384-17:2019 + Redline
Tracked Changes. Fixed capacitors for use in electronic equipment Sectional specification. metallized polypropylene film dielectric AC and pulse
2/24/2020 - PDF - English - BSI
Learn More€369.72 -
BS IEC 61747-40-1:2019 + Redline
Tracked Changes. Liquid crystal display devices Mechanical testing of cover glass for mobile devices. Guidelines
2/24/2020 - PDF - English - BSI
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BS EN IEC 60068-2-82:2019 + Redline
Tracked Changes. Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
2/24/2020 - PDF - English - BSI
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BS EN IEC 61967-1:2019 + Redline
Tracked Changes. Integrated circuits. Measurement of electromagnetic emissions General conditions and definitions
2/24/2020 - PDF - English - BSI
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BS EN ISO 14880-1:2019 + Redline
Tracked Changes. Optics and photonics. Microlens arrays Vocabulary
2/24/2020 - PDF - English - BSI
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BS IEC 60747-18-2:2020
Semiconductor devices bio sensors. Evaluation process of lens-free CMOS photonic array sensor package modules
2/21/2020 - PDF - English - BSI
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IPC 1791A:2020
Trusted Electronic Designer, Fabricator and Assembler Requirements
2/20/2020 - PDF sécurisé - English - IPC
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20/30414127 DC:2020
BS EN IEC 63203-406-1. Wearable electronic devices and technologies Part 406-1. Test method for measuring contact surface temperature of wrist worn wearable
2/19/2020 - PDF - English - BSI
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20/30414125 DC:2020
BS EN IEC 62228-5. Integrated circuits. EMC evaluation of transceivers Part 5. Ethernet
2/19/2020 - PDF - English - BSI
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IEC 62435-3:2020
IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data
2/18/2020 - PDF - English, French - IEC
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BS EN 50614:2020
Requirements for the preparing for re-use of waste electrical and electronic equipment
2/17/2020 - PDF - English - BSI
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PD IEC TR 63211-2-12:2020
Durability test methods for electronic displays Environmental tests. conditions of use, storage and transportation
2/14/2020 - PDF - English - BSI
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IEC 60191-2:1966/AMD21:2020
IEC 60191-2:1966/AMD21:2020 Amendment 21 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
2/13/2020 - PDF - English - IEC
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20/30387889 DC:2020
BS EN IEC 63203-201-1. Wearable electronic devices and technologies Part 201-1. Electronic Textile. Measurement methods for basic properties of conductive yarns
2/13/2020 - PDF - English - BSI
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IEC 60747-18-2:2020
IEC 60747-18-2:2020 Semiconductor devices - Part 18-2: Semiconductor bio sensors - Evaluation process of lens-free CMOS photonic array sensor package modules
2/7/2020 - PDF - English - IEC
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IEC 62779-4:2020
IEC 62779-4:2020 Semiconductor devices - Semiconductor interface for human body communication - Part 4: Capsule endoscope
2/7/2020 - PDF - English, French - IEC
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20/30404083 DC:2020
BS IEC 62047-38. Semiconductor devices. Micro-electromechanical devices Part 38. Test method for adhesion strength of metal powder paste in MEMS interconnection
2/7/2020 - PDF - English - BSI
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IEC TR 63211-2-12:2020
IEC TR 63211-2-12:2020 Durability test methods for electronic displays - Part 2-12: Environmental tests - Environmental conditions of use, storage and transportation of electronic displays
2/7/2020 - PDF - English - IEC
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IPC J-STD-001GA/A-610GA:2020
Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G Acceptability of Electronic Assemblies
2/2/2020 - Paper - English - IPC
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€107.86
-
€52.27
-
UNE-EN IEC 62430:2019
Environmentally Conscious Design (ECD) - Principles, requirements and guidance (Endorsed by Asociación Española de Normalización in February of 2020.)
2/1/2020 - PDF - English - AENOR
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€107.86
-
UNE-EN IEC 60512-28-100:2019
Connectors for electrical and electronic equipment - Tests and measurements - Part 28-100: Signal integrity tests up to 2 000 MHz - Tests 28a to 28g (Endorsed by Asociación Española de Normalización in February of 2020.)
2/1/2020 - PDF - English - AENOR
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€108.39
-
ASTM E1855-20
Standard Test Method for Use of 2N2222A Silicon Bipolar Transistors as Neutron Spectrum Sensors and Displacement Damage Monitors
2/1/2020 - PDF - English - ASTM
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ASTM E1855-20 + Redline
Standard Test Method for Use of 2N2222A Silicon Bipolar Transistors as Neutron Spectrum Sensors and Displacement Damage Monitors
2/1/2020 - PDF - English - ASTM
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UNE-EN ISO 15902:2020
Optics and photonics - Diffractive optics - Vocabulary (ISO 15902:2019) (Endorsed by Asociación Española de Normalización in February of 2020.)
2/1/2020 - PDF - English - AENOR
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IEEE 2401:2019
IEEE Standard Format for LSI-Package-Board Interoperable Design
1/27/2020 - PDF - English - IEEE
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IEEE 2401:2019 + Redline
IEEE Standard Format for LSI-Package-Board Interoperable Design
1/27/2020 - PDF - English - IEEE
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IEEE 2401:2019
IEEE Standard Format for LSI-Package-Board Interoperable Design
1/27/2020 - Paper - English - IEEE
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IPC 2223E:2020
Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
1/24/2020 - Paper - English - IPC
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IPC 2223E:2020
Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
1/24/2020 - PDF sécurisé - English - IPC
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BS EN IEC 60384-16:2019
Fixed capacitors for use in electronic equipment Sectional specification. metallized polypropylene film dielectric DC
1/23/2020 - PDF - English - BSI
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BS IEC 63145-22-10:2020
Eyewear display Specific measurement methods for AR type. Optical properties
1/23/2020 - PDF - English - BSI
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€215.67
-
IEC 63171-6:2020
IEC 63171-6:2020 Connectors for electrical and electronic equipment - Part 6: Detail specification for 2-way and 4-way (data/power), shielded, free and fixed connectors for power and data transmission with frequencies up to 600 MHz.
1/20/2020 - PDF - English, French - IEC
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€237.60
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€180.40
-
20/30387893 DC:2020
BS EN IEC 63203-201-2. Wearable electronic devices and technologies Part 201-2. Electronic Textile. Measurement methods for basic properties of conductive fabric insulation materials
1/17/2020 - PDF - English - BSI
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BS IEC 60747-18-3:2019
Semiconductor devices bio sensors. Fluid flow characteristics of lens-free CMOS photonic array sensor package modules with fluidic system
1/14/2020 - PDF - English - BSI
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BS IEC 60747-5-9:2019
Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of the internal quantum efficiency based on temperature-dependent electroluminescence
1/14/2020 - PDF - English - BSI
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BS IEC 60747-5-11:2019
Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of radiative and nonradiative currents light diodes
1/14/2020 - PDF - English - BSI
Learn More€154.05 -
BS IEC 60747-5-10:2019
Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of the internal quantum efficiency based on room-temperature reference point
1/14/2020 - PDF - English - BSI
Learn More€154.05 -
BS EN IEC 60512-28-100:2019
Connectors for electrical and electronic equipment. Tests measurements Signal integrity tests up to 2 000 MHz. 28a 28g
1/13/2020 - PDF - English - BSI
Learn More€300.99 -
IEC 63145-22-10:2020
IEC 63145-22-10:2020 Eyewear display - Part 22-10: Specific measurement methods for AR type - Optical properties
1/10/2020 - PDF - English - IEC
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BS EN IEC 60904-4:2019
Photovoltaic devices Reference solar devices. Procedures for establishing calibration traceability
1/9/2020 - PDF - English - BSI
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BS EN IEC 62430:2019
Environmentally conscious design (ECD). Principles, requirements and guidance
1/7/2020 - PDF - English - BSI
Learn More€253.59 -
IEC 60825:2020 SER
IEC 60825:2020 SER Safety of laser products - ALL PARTS
1/6/2020 - PDF - English, French - IEC
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20/30409180 DC:2020
BS EN IEC 60352-7. Solderless connections Part 7. Spring clamp connections. General requirements, test methods and practical guidance
1/3/2020 - PDF - English - BSI
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19/30386053 DC:2020
BS EN IEC 62595-2-4. Display Lighting Unit Part 2-4. Electro-optical measuring methods of laser module
1/3/2020 - PDF - English - BSI
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€130.35
-
€68.89
-
€30.00 -
€108.39
-
€100.66
-
UNE-EN IEC 62878-1:2019
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (Endorsed by Asociación Española de Normalización in January of 2020.)
1/1/2020 - PDF - English - AENOR
Learn More€70.00 -
UNE-EN ISO 11551:2019
Optics and photonics - Lasers and laser-related equipment - Test method for absorptance of optical laser components (ISO 11551:2019, Corrected version 2020-01)
1/1/2020 - PDF - English - AENOR
Learn More€70.00 -
€52.27
-
€64.01
