31 : Electronics
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IEC TR 63340-1:2025
IEC TR 63340-1:2025 Electronic displays for special applications - Part 1: General introduction
1/9/2025 - PDF - English - IEC
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IEC 60825:2025 SER
IEC 60825:2025 SER Safety of laser products - ALL PARTS
1/6/2025 - PDF - English, French - IEC
Learn More€3,354.00 -
IEC 60191-2:2025 DB
IEC 60191-2:2025 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
1/1/2025 - PDF - English, French - IEC
Learn More€429.00 -
DIN EN IEC 63364-1:2025-01
Semiconductor devices - Semiconductor devices for IoT system - Part 1: Test method of sound variation detection (IEC 63364-1:2022), German version EN IEC 63364-1:2023
1/1/2025 - PDF - German - DIN
Learn More€82.00 -
DIN EN 60115-1:2025-01
Fixed resistors for use in electronic equipment - Part 1: Generic specification (IEC 60115-1:2020, modified), German version EN 60115-1:2023.
1/1/2025 - PDF - German - DIN
Learn More€353.00 -
VG 95319-2:2025-01
Electrical connectors and plug-and-socket devices - Part 2: Generic standard, Text in German and English
1/1/2025 - PDF - English, German - DIN
Learn More€180.00 -
VG 96938-1:2025-01
Electrical connectors and plug-and-socket devices - Ethernet connectors for data transmissions with threaded coupling (IP X7), up to 60 V - Part 1: Requirements, tests, detail standard, Text in German and English.
1/1/2025 - PDF - English, German - DIN
Learn More€88.00 -
VG 96938-3:2025-01
Electrical connectors and plug-and-socket devices - Ethernet connectors for data transmissions with threaded coupling (IP X7), up to 60 V - Part 3: Dimensions, mass, shielded, detail standard, Text in German and English.
1/1/2025 - PDF - English, German - DIN
Learn More€75.00 -
VG 96938-4:2025-01
Electrical connectors and plug-and-socket devices - Ethernet connectors for data transmissions with threaded coupling (IP X7), up to 60 V - Part 4: Dimensions, mass, non-shielded, detail standard, Text in German and English.
1/1/2025 - PDF - English, German - DIN
Learn More€68.00 -
VG 96949-3:2025-01
Electrical connectors and plug-and-socket devices - USB 3.0 connectors (Type A) for data transmissions with threaded coupling (IP 67), up to 5 V - Part 3: Dimensions, mass, detail standard, Text in German and English.
1/1/2025 - PDF - English, German - DIN
Learn More€82.00 -
DIN EN IEC 61189-2-720:2025-01
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (IEC 61189-2-720:2024), German version EN IEC 61189-2-720:2024
1/1/2025 - PDF - German - DIN
Learn More€75.00 -
DIN EN IEC 62813:2025-01
Lithium ion capacitors for use in electric and electronic equipment - Test methods for electrical characteristics (IEC 40/3115/CDV:2024), German and English version prEN IEC 62813:2024
1/1/2025 - PDF - English, German - DIN
Learn More€108.00 -
€559.00 -
25/30507775 DC:2024
BS IEC 62899-202-14 Printed electronics Part 202-14: Materials - Test methods of conductive ink suitability for screen printing
12/20/2024 - PDF - English - BSI
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BS EN ISO 13695:2024 + Redline
Tracked Changes. Optics and photonics. Lasers and laser-related equipment. Test methods for the spectral characteristics of lasers
12/17/2024 - PDF - English - BSI
Learn More€438.00 -
IEC 62595-1-2:2024
IEC 62595-1-2:2024 Display lighting unit - Part 1-2: Terminology and letter symbols
12/16/2024 - PDF - English - IEC
Learn More€290.00 -
€399.00 -
IEC 60747-5-4:2022/AMD1:2024
IEC 60747-5-4:2022/AMD1:2024 Amendment 1 - Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
12/13/2024 - PDF - English - IEC
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24/30502824 DC:2024
BS EN IEC 60749-22-1 Semiconductor devices - Mechanical and climatic test methods Part 22-1: Bond strength wire bond pull
12/13/2024 - PDF - English - BSI
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24/30502907 DC:2024
BS EN IEC 60749-22-2 Semiconductor devices - Mechanical and climatic test methods Part 22-2: Bond strength Wire bond shear
12/13/2024 - PDF - English - BSI
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24/30506674 DC:2024
BS EN IEC 63287-4 Semiconductor devices - Guidelines for reliability qualification plans Part 4: Early failure assessment
12/13/2024 - PDF - English - BSI
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24/30506691 DC:2024
BS IEC 62899-202-13 Printed electronics Part 202-13: Materials - Resistance measurement method for conductive layer in printed and in-mould
12/13/2024 - PDF - English - BSI
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24/30506688 DC:2024
BS EN IEC 62906-5-8 Laser displays Part 5-8: Measurement of scanning characteristics for raster-scanning laser display
12/13/2024 - PDF - English - BSI
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BS EN 63171-5:2022
Connectors for electrical and electronic equipment Detail specification 2-way m8 m12 circular connectors, shielded or unshielded, free fixed. Mechanical mating information, pin assignment additional requirements type 5
12/12/2024 - PDF - English - BSI
Learn More€312.00 -
BS IEC 62715-6-23:2024
Flexible displays devices Mechanical test methods. misaligned folding method
12/10/2024 - PDF - English - BSI
Learn More€191.00 -
IEEE 1658:2023
IEEE Standard for Terminology and Test Methods of Digital-to-Analog Converter Devices
12/10/2024 - PDF - English - IEEE
Learn More€118.00 -
IEEE 1658:2023
IEEE Standard for Terminology and Test Methods of Digital-to-Analog Converter Devices
12/10/2024 - Papier - English - IEEE
Learn More€148.00 -
IEC 61189-2-809:2024
IEC 61189-2-809:2024 Test methods for electrical materials, circuit boards and other interconnection structures and assemblies – Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA
12/9/2024 - PDF - English, French - IEC
Learn More€46.00 -
IEC 61188-6-3:2024
IEC 61188-6-3:2024 Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
12/9/2024 - PDF - English, French - IEC
Learn More€290.00 -
24/30506297 DC:2024
BS IEC 63145-20-10 Eyewear display Part: 20-10 Fundamental measurement methods. Optical properties
12/6/2024 - PDF - English - BSI
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€120.00 -
€149.00
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BS EN ISO 14880-2:2024
Optics and photonics. Microlens arrays Test methods for wavefront aberrations
12/6/2024 - PDF - English - BSI
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BS EN IEC 62471-7:2023
Photobiological safety of lamps and lamp systems Light sources luminaires primarily emitting visible radiation
12/6/2024 - PDF - English - BSI
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IEC 62715-6-23:2024
IEC 62715-6-23:2024 Flexible displays devices – Part 6-23: Mechanical test methods - Mechanical misaligned folding test method
12/5/2024 - PDF - English - IEC
Learn More€93.00 -
NBN EN ISO 13695:2024
Optics and photonics - Lasers and laser-related equipment - Test methods for the spectral characteristics of lasers (ISO 13695:2024)
12/5/2024 - - - NBN
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BS EN ISO 13695:2024
Optics and photonics. Lasers and laser-related equipment. Test methods for the spectral characteristics of lasers
12/5/2024 - PDF - English - BSI
Learn More€312.00 -
BS EN ISO 14880-2:2024 + Redline
Tracked Changes. Optics and photonics. Microlens arrays Test methods for wavefront aberrations
12/2/2024 - PDF - English - BSI
Learn More€438.00 -
PR NF EN IEC 63002, C97-292PR (12/2024)
Spécifications d'interopérabilité et méthode de communication pour les alimentations externes utilisées avec les dispositifs informatiques et les dispositifs électroniques grand public
12/1/2024 - Papier - English, French - AFNOR
Learn More€119.00 -
PR NF EN IEC 63287-3, C96-287-3PR (12/2024)
Dispositifs à semiconducteurs - Lignes directrices génériques concernant la qualification des semiconducteurs - Partie 3 : Lignes directrices pour les plans de qualification de la fiabilité des modules à semiconducteurs de puissance
12/1/2024 - Papier - English, French - AFNOR
Learn More€111.00 -
NF EN IEC 60352-2, C93-023-2 (12/2024)
Connexions sans soudure - Partie 2 : connexions serties - Exigences générales, méthodes d'essai et guide pratique
12/1/2024 - Papier - French - AFNOR
Learn More€211.00 -
DIN EN IEC 60352-9:2024-12
Solderless connections - Part 9: Ultrasonically welded connections - General requirements, test methods and practical guidance (IEC 60352-9:2024), German version EN IEC 60352-9:2024
12/1/2024 - PDF - German - DIN
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PR NF EN IEC 60115-2-10, C93-266-2-10PR (12/2024)
Résistances fixes utilisées dans les équipements électronique - Partie 2-10: Spécification particulière-cadre: Résistances à broches à couche, à faible dissipation, pour assemblage par trous traversants sur cartes de circuit imprimé (carte THT) pour des équipements électroniques généraux, niveau de classification G
12/1/2024 - Papier - English, French - AFNOR
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PR NF EN IEC 60115-2-10/AA, C93-266-2-10/AAPR (12/2024)
Résistances fixes utilisées dans les équipements électroniques - Partie 2-10: Spécification particulière-cadre: Résistances à broches à couche, à faible dissipation, pour assemblage par trous traversants sur cartes de circuit imprimé (carte THT) pour des équipements électroniques généraux, niveau de classification G
12/1/2024 - Papier - English, French - AFNOR
Learn More€46.50 -
PR NF EN IEC 61076-2-118, C93-406-2-118PR (12/2024)
Connecteurs circulaires - Spécification particulière relative aux fiches et embases écrantées ou non écrantées avec verrouillage à baïonnette, des tailles B12, B17, B23 et B40, pour la transmission de signaux, de puissance et de données
12/1/2024 - Papier - English, French - AFNOR
Learn More€194.50 -
PR NF EN IEC 61076-2, C93-406-2PR (12/2024)
Connecteurs pour équipements électroniques - Exigences de produit - Partie 2 : Spécification intermédiaire pour les connecteurs circulaires
12/1/2024 - Papier - English, French - AFNOR
Learn More€100.50 -
PR NF EN IEC 61076-2-104, C93-406-2-104PR (12/2024)
Connecteurs pour équipements électroniques - Exigences de produit - Partie 2-104 : connecteurs circulaires - Spécification particulière pour les connecteurs circulaires M8 à vis ou à encliquetage
12/1/2024 - Papier - English, French - AFNOR
Learn More€147.50 -
PR NF EN IEC 60115-8/AA, C93-266-8/AAPR (12/2024)
Résistances fixes utilisées dans les équipements électroniques - Partie 8 : spécification intermédiaire - Résistances fixes pour montage en surface
12/1/2024 - Papier - English, French - AFNOR
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DIN EN IEC 60384-9:2024-12
Fixed capacitors for use in electronic equipment - Part 9: Sectional specification: Fixed capacitors of ceramic dielectric, Class 2 (IEC 40/3069/CDV:2023), German and English version prEN IEC 60384-9:2023
12/1/2024 - PDF - English, German - DIN
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DIN EN IEC 60384-8:2024-12
Fixed capacitors for use in electronic equipment - Part 8: Sectional specification: Fixed capacitors of ceramic dielectric, Class 1 (IEC 40/3068/CDV:2023), German and English version prEN IEC 60384-8:2023
12/1/2024 - PDF - English, German - DIN
Learn More€157.00 -
DIN EN IEC 62563-3:2024-12
Medical electrical equipment - Medical image display systems - Part 3: Evaluation methods for colour displays (IEC/CDV 62563-3:2024), German and English version prEN IEC 62563-3:2024
12/1/2024 - PDF - English, German - DIN
Learn More€124.00 -
DIN EN IEC 62604-2:2024-12
Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality - Part 2: Guidelines for the use (IEC 62604-2:2022), German version EN IEC 62604-2:2022.
12/1/2024 - PDF - German - DIN
Learn More€113.00 -
PR NF EN IEC 61189-3-302, C93-733-302PR (12/2024)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 3-302 : détection des défauts de métallisation dans les cartes de circuits imprimés nus par tomographie informatisée (TI)
12/1/2024 - Papier - English, French - AFNOR
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PR NF EN IEC 61249-2-52, C93-780-2-52PR (12/2024)
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-52 : matériaux de base renforcés, métallisés et non métallisés - Feuilles stratifiées renforcées en tissu de verre de type E avec système de résines hydrocarbonées thermodurcissables, d'inflammabilité définie (essai de combustion verticale), plaquées cuivre
12/1/2024 - Papier - English, French - AFNOR
Learn More€83.00 -
PR NF EN IEC 61249-2-53, C93-780-2-53PR (12/2024)
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-53 : matériaux de base renforcés, métallisés et non métallisés - Feuilles stratifiées non chargées en PTFE d'inflammabilité définie (essai de combustion verticale), plaquées cuivre
12/1/2024 - Papier - English, French - AFNOR
Learn More€83.00 -
€170.50
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NF EN ISO 13695, S10-126 (12/2024)
Optique et photonique - Lasers et équipement associé aux lasers - Méthodes d'essai des caractéristiques spectrales des lasers
12/1/2024 - Papier - French - AFNOR
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24/30501951 DC:2024
BS EN IEC 60749-26 Semiconductor devices - Mechanical and climatic test methods Part 26: Electrostatic discharge (ESD) sensitivity testing Human body model (HBM)
11/29/2024 - PDF - English - BSI
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BS IEC 62908-22-10:2024
Touch and interactive displays Measuring methods of fingerprint recognition performance. Under-display optical imaging sensing
11/28/2024 - PDF - English - BSI
Learn More€266.00 -
IEC 61076-2-101:2024
IEC 61076-2-101:2024 Connectors for electrical and electronic equipment - Product requirements - Part 2-101: Circular connectors - Detail specification for M12 connectors with screw-locking
11/27/2024 - PDF - English, French - IEC
Learn More€423.00 -
NBN EN ISO 14880-2:2024
Optics and photonics - Microlens arrays - Part 2: Test methods for wavefront aberrations (ISO 14880-2:2024)
11/27/2024 - - - NBN
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BS EN ISO 14880-3:2024
Optics and photonics. Microlens arrays Test methods for optical properties other than wavefront aberrations
11/26/2024 - PDF - English - BSI
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BS EN ISO 14880-4:2024 + Redline
Tracked Changes. Optics and photonics. Microlens arrays Test methods for geometrical properties
11/25/2024 - PDF - English - BSI
Learn More€373.00 -
BS EN ISO 14880-3:2024 + Redline
Tracked Changes. Optics and photonics. Microlens arrays Test methods for optical properties other than wavefront aberrations
11/25/2024 - PDF - English - BSI
Learn More€373.00 -
24/30501823 DC:2024
BS IEC 60617-C00292 IEC 60617 SDB classic procedure for change request C00292, IEC 60617-S01931 Bi-mode Insulated Gate Transistor
11/22/2024 - PDF - English - BSI
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24/30505492 DC:2024
BS EN IEC 62047-51 Semiconductor Devices - Micro-electromechanical Part 51: Test method of electrical characteristics under two-directional cyclic bending deformation for flexible microelectromechanical devices
11/22/2024 - PDF - English - BSI
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24/30505500 DC:2024
BS EN IEC 63041-2 Piezoelectric sensors Part 2: Chemical and biochemical
11/22/2024 - PDF - English - BSI
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ISO 13695:2024
Optics and photonics — Lasers and laser-related equipment — Test methods for the spectral characteristics of lasers
11/22/2024 - - - ISO
Learn More€152.00 -
BS EN ISO 14880-4:2024
Optics and photonics. Microlens arrays Test methods for geometrical properties
11/21/2024 - PDF - English - BSI
Learn More€266.00 -
BS EN IEC 60512-28-100:2024
Connectors for electrical and electronic equipment. Tests measurements Signal integrity tests up to 2 000 MHz. 28a 28g
11/20/2024 - PDF - English - BSI
Learn More€370.00 -
BS EN IEC 60747-16-9:2024
Semiconductor devices Microwave integrated circuits. Phase shifters
11/20/2024 - PDF - English - BSI
Learn More€312.00 -
NBN EN ISO 14880-3:2024
Optics and photonics - Microlens arrays - Part 3: Test methods for optical properties other than wavefront aberrations (ISO 14880-3:2024)
11/20/2024 - - - NBN
Learn More€92.00 -
NBN EN ISO 14880-4:2024
Optics and photonics - Microlens arrays - Part 4: Test methods for geometrical properties (ISO 14880-4:2024)
11/20/2024 - - - NBN
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IEC 62908-22-10:2024
IEC 62908-22-10:2024 Touch and interactive displays - Part 22-10: Measuring methods of fingerprint recognition performance - Under-display optical imaging fingerprint sensing
11/19/2024 - PDF - English - IEC
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BS EN IEC 60384-14:2023
Fixed capacitors for use in electronic equipment Sectional specification. electromagnetic interference suppression and connection to the supply mains
11/15/2024 - PDF - English - BSI
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24/30505074 DC:2024
BS EN IEC 63596 Replay Tools for radioactive material detection systems
11/15/2024 - PDF - English - BSI
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24/30505090 DC:2024
BS IEC 62908-12-10 Touch and interactive displays Part 12-10: Measurement methods of touch - electrical performance
11/15/2024 - PDF - English - BSI
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€152.00
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€113.00
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€152.00
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24/30504592 DC:2024
BS EN IEC 61643-361 Low-voltage surge protective components Part 361: Surge isolation transformers (SITs) connected to low-voltage distribution system – Requirements and test methods
11/8/2024 - PDF - English - BSI
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ISO/DIS 13060:2024
An adhesion evaluation method for microcircuits on PCB (Printed Circuit Board) by scratch test
11/2/2024 - Papier - English - ISO
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VG 95212:2024-11
Lists of approved components (LZB), Text in German and English.
11/1/2024 - PDF - English, German - DIN
Learn More€306.26 -
NF EN IEC 60747-15, C96-015 (11/2024)
Dispositifs à semiconducteurs - Partie 15 : dispositifs discrets - Dispositifs de puissance à semiconducteurs isolés
11/1/2024 - Papier - French - AFNOR
Learn More€149.00 -
PR NF EN IEC 60749-21, C96-022-21PR (11/2024)
Dispositifs à semiconducteur - Méthodes d'essai mécaniques et climatiques - Partie 21 : brasabilité
11/1/2024 - Papier - English, French - AFNOR
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PR NF EN IEC 60749-24, C96-022-24PR (11/2024)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 24 : résistance à l'humidité accélérée - HAST sans polarisation
11/1/2024 - Papier - English, French - AFNOR
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PR NF EN IEC 60749-7, C96-022-7PR (11/2024)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 7 : mesure de la teneur en humidité interne et analyse des autres gaz résiduels
11/1/2024 - Papier - English, French - AFNOR
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VG 95319-100:2024-11
Electrical connectors and plug-and-socket devices - Part 100: Expanded beam free connector (MIL-DTL-83526/20C with amendment 2), detail standard, Text in German and English
11/1/2024 - PDF - English, German - DIN
Learn More€130.00 -
VG 95319-101:2024-11
Electrical connectors and plug-and-socket devices - Part 101: Expanded beam free connector (MIL-DTL-83526/21C with Amendment 2), detail standard, Text in German and English
11/1/2024 - PDF - English, German - DIN
Learn More€130.00 -
PR NF EN IEC 61076-2-111, C93-406-2-111PR (11/2024)
Connecteurs pour équipements électriques et électroniques - Exigences de produit - Partie 2-111 : Connecteurs circulaires - Spécification particulière pour les connecteurs d'alimentation à vis M12
11/1/2024 - Papier - English, French - AFNOR
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NF EN IEC 60747-16-9, C96-016-9 (11/2024)
Dispositifs à semiconducteurs - Partie 16-9 : circuits intégrés hyperfréquences - Déphaseurs
11/1/2024 - Papier - French - AFNOR
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24/30503297 DC:2024
BS EN IEC 63541 Lithium tantalate and lithium niobate crystal for surface acoustic wave (SAW) device applications - Specifications and measuring method
11/1/2024 - PDF - English - BSI
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PR NF EN IEC 60068-2-83, C20-783PR (11/2024)
Essais d'environnement - Partie 2-83 : Essais - Essai Tf: Essai de brasabilité des composants électroniques pour les composants montés en surface (CMS) par la méthode de la balance de mouillage utilisant de la pâte à braser
11/1/2024 - Papier - English, French - AFNOR
Learn More€111.00 -
NF EN ISO 14880-2, S10-132-2 (11/2024)
Optique et photonique - Réseaux de microlentilles - Partie 2 : méthodes d'essai pour les aberrations du front d'onde
11/1/2024 - Papier - French - AFNOR
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NF EN ISO 14880-4, S10-132-4 (11/2024)
Optique et photonique - Réseaux de microlentilles - Partie 4 : méthodes d'essai pour les propriétés géométriques
11/1/2024 - Papier - French - AFNOR
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NF EN ISO 14880-3, S10-132-3 (11/2024)
Optique et photonique - Réseaux de microlentilles - Partie 3 : méthodes d'essai pour les propriétés optiques autres que les aberrations du front d'onde
11/1/2024 - Papier - French - AFNOR
Learn More€68.50 -
BS IEC 63378-2-1:2024
Thermal standardization on semiconductor packages 3D thermal simulation models of for steady-state analysis. Discrete
10/29/2024 - PDF - English - BSI
Learn More€191.00 -
BS EN 62668-1:2019+A1:2024
Process management for avionics. Counterfeit prevention Avoiding the use of counterfeit, fraudulent and recycled electronic components
10/22/2024 - PDF - English - BSI
Learn More€399.00 -
IEC 63378-2-1:2024
IEC 63378-2-1:2024 Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages
10/22/2024 - PDF - English - IEC
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IEC 60747-15:2024
IEC 60747-15:2024 Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
10/22/2024 - - - IEC
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ISO/DIS 24298:2024
Intelligent transport systems — Public transport — Light emitting diode (LED) destination board system for public transport buses
10/18/2024 - Papier - English - ISO
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24/30502381 DC:2024
BS EN IEC 61760-4 Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices ED2
10/18/2024 - PDF - English - BSI
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24/30501877 DC:2024
BS EN IEC 60115-8 Fixed resistors for use in electronic equipment Part 8: Sectional specification - surface mount
10/11/2024 - PDF - English - BSI
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24/30501926 DC:2024
BS EN IEC 60444-11 Measurement of quartz crystal unit parameters Part 11: Standard method for the determination load resonance frequency fL and effective capacitance CLeff using automatic network analyzer techniques error correction
10/11/2024 - PDF - English - BSI
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IEC 60747-16-9:2024
IEC 60747-16-9:2024 Semiconductor devices - Part 16-9: Microwave integrated circuits - Phase shifters
10/9/2024 - PDF - English, French - IEC
Learn More€290.00 -
BS IEC 62341-6-7:2024
Organic light emitting diode (OLED) display Measuring methods of optical characteristics for with under-screen feature
10/8/2024 - PDF - English - BSI
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24/30501865 DC:2024
BS EN IEC 60115-2 Fixed resistors for use in electronic equipment Part 2: Sectional specification: Low-power film with leads throughhole assembly on circuit boards (THT)
10/4/2024 - PDF - English - BSI
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24/30501867 DC:2024
BS EN IEC 60115-2-10 Fixed resistors for use in electronic equipment Part 2-10: Blank detail specification: Low-power film with leads through-hole assembly on circuit boards (THT), general equipment, classification level G
10/4/2024 - PDF - English - BSI
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24/30501871 DC:2024
BS EN IEC 60115-4 Fixed resistors for use in electronic equipment Part 4: Sectional specification: Power through hole assembly on circuit boards (THT) or chassis
10/4/2024 - PDF - English - BSI
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24/30499092 DC:2024
BS EN IEC 63601 Guideline for Evaluating Bias Temperature Instability of Silicon Carbide Metal-Oxide-Semiconductor Devices for Power Electronic Conversion (Fast track)
10/4/2024 - PDF - English - BSI
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24/30499096 DC:2024
BS EN IEC 63602 Guidelines for Representing Switching Losses of SIC MOSFETs in Datasheets (Fast track)
10/4/2024 - PDF - English - BSI
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IEC 62341-6-7:2024
IEC 62341-6-7:2024 Organic light emitting diode (OLED) displays - Part 6-7: Measuring methods of optical characteristics for display with under-screen feature
10/3/2024 - PDF - English - IEC
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NF EN IEC 62668-1/A1, C90-668-1/A1 (10/2024)
Gestion des processus pour l'avionique - Prévention de la contrefaçon - Partie 1 : prévention de l'utilisation de composants électroniques contrefaits, frauduleux et recyclés
10/1/2024 - Papier - French - AFNOR
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DIN EN IEC 63287-2:2024-10
Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile (IEC 63287-2:2023), German version EN IEC 63287-2:2023.
10/1/2024 - PDF - German - DIN
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DIN EN IEC 61076-3-106:2024-10
Connectors for electrical and electronic equipment - Product requirements - Part 3-106: Rectangular connectors - Detail specification for protective housings for use with 8-way shielded and unshielded connectors for industrial environments incorporating the IEC 60603-7 series interface (IEC 61076-3-106:2023), German version EN IEC 61076-3-106:2023.
10/1/2024 - PDF - German - DIN
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DIN EN IEC 60393-3:2024-10
Potentiometers for use in electronic equipment - Part 3: Sectional specification: Rotary precision potentiometers (IEC 60393-3:2023), German version EN IEC 60393-3:2023
10/1/2024 - PDF - German - DIN
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PR NF EN IEC 60122-2, C93-618-2PR (10/2024)
Quartz pour le contrôle et la sélection de la fréquence - Partie 2: Guide pour l'emploi des résonateurs à quartz pour le contrôle et la sélection de la fréquence
10/1/2024 - Papier - English, French - AFNOR
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DIN EN IEC 61189-2-804:2024-10
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 (IEC 61189-2-804:2023), German version EN IEC 61189-2-804:2023
10/1/2024 - PDF - German - DIN
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24/30501110 DC:2024
BS EN IEC 62132-8 Integrated circuits - Measurement of electromagnetic immunity Part 8: radiated IC stripline method
9/27/2024 - PDF - English - BSI
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BS IEC 60747-5-14:2022
Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of the surface temperature based on thermoreflectance
9/26/2024 - PDF - English - BSI
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24/30500231 DC:2024
BS EN IEC 63550-3 Semiconductor devices. Neuromorphic devices Part 3. Evaluation method of spike dependent plasticity in memristor
9/13/2024 - PDF - English - BSI
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24/30500235 DC:2024
BS EN IEC 62047-53 Semiconductor devices. Micro-electromechanical devices Part 53. MEMS electrothermal transfer device
9/13/2024 - PDF - English - BSI
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24/30500239 DC:2024
BS EN IEC 62047-52 Semiconductor devices. Micro-electromechanical devices Part 52. Biaxial tensile testing method for stretchable MEMS
9/13/2024 - PDF - English - BSI
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24/30500247 DC:2024
BS IEC 62715-6-42 Flexible display devices Part 6-42: Flattening force measurement methods for rollable
9/13/2024 - PDF - English - BSI
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IPC 7095E:2024
Design and Assembly Process Guidance for Ball Grid Arrays (BGAs)
9/12/2024 - Papier - English - IPC
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IPC 7095E:2024
Design and Assembly Process Guidance for Ball Grid Arrays (BGAs)
9/12/2024 - PDF sécurisé - English - IPC
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IEC 62668-1:2019/AMD1:2024
IEC 62668-1:2019/AMD1:2024 Amendment 1 - Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components
9/11/2024 - PDF - English, French - IEC
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IEC 62668-1:2019+AMD1:2024 Edition 1.1
IEC 62668-1:2019+AMD1:2024 (Consolidated version) Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components
9/11/2024 - - - IEC
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24/30497538 DC:2024
BS EN IEC 60749-7 Semiconductor devices. Mechanical and climatic test methods Part 7. Internal moisture content measurement the analysis of other residual gases
9/6/2024 - PDF - English - BSI
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24/30497542 DC:2024
BS EN IEC 60749-21 Semiconductor devices. Mechanical and climatic test methods Part 21. Solderability
9/6/2024 - PDF - English - BSI
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24/30500166 DC:2024
BS EN IEC 63550-4 Semiconductor devices. Neuromorphic devices Evaluation method of asymmetry in neuromorphic memristor
9/6/2024 - PDF - English - BSI
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24/30500170 DC:2024
BS EN IEC 62228-7 Integrated circuits. EMC evaluation of transceivers Part 7. CXPI
9/6/2024 - PDF - English - BSI
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BS EN IEC 60384-22:2024 + Redline
Tracked Changes. Fixed capacitors for use in electronic equipment Part 22: Sectional specification - surface mount multilayer of ceramic dielectric, Class 2
9/5/2024 - PDF - English - BSI
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BS EN IEC 60384-21:2024 + Redline
Tracked Changes. Fixed capacitors for use in electronic equipment Sectional specification. surface mount multilayer of ceramic dielectric, Class 1
9/2/2024 - PDF - English - BSI
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PR NF EN IEC 62007-2, C93-801-2PR (09/2024)
Dispositifs optoélectroniques à semiconducteurs pour application dans les systèmes fibroniques - Partie 2 : méthodes de mesure
9/1/2024 - Papier - English, French - AFNOR
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NF EN IEC 60384-8, C93-112-8 (09/2024)
Condensateurs fixes utilisés dans les équipements électroniques - Partie 8 : spécification intermédiaire - Condensateurs fixes à diélectrique en céramique, Classe 1
9/1/2024 - Papier - French - AFNOR
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NF EN IEC 60384-9, C93-112-9 (09/2024)
Condensateurs fixes utilisés dans les équipements électroniques - Partie 9 : spécification intermédiaire - Condensateurs fixes à diélectrique en céramique, Classe 2
9/1/2024 - Papier - French - AFNOR
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DIN EN IEC 60539-1:2024-09
Directly heated negative temperature coefficient thermistors - Part 1: Generic specification (IEC 60539-1:2022), German version EN IEC 60539-1:2023.
9/1/2024 - PDF - German - DIN
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DIN EN ISO 13695:2024-09
Optics and photonics - Lasers and laser-related equipment - Test methods for the spectral characteristics of lasers (ISO/FDIS 13695:2024), German and English version prEN ISO 13695:2024
9/1/2024 - PDF - English, German - DIN
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24/30499668 DC:2024
BS EN IEC 63550-1 Semiconductor devices - Neuromorphic Part 1: Evaluation method of basic characteristics in memristor
8/30/2024 - PDF - English - BSI
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24/30499672 DC:2024
BS EN IEC 63550-2 Semiconductor devices - Neuromorphic Part 2: Evaluation method of linearity in memristor
8/30/2024 - PDF - English - BSI
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BS IEC 62047-47:2024
Semiconductor devices. Micro-electromechanical devices Silicon based MEMS fabrication technology. Measurement method of bending strength microstructures
8/28/2024 - PDF - English - BSI
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IEC 62047-47:2024
IEC 62047-47:2024 Semiconductor devices - Micro-electromechanical devices - Part 47: Silicon based MEMS fabrication technology - Measurement method of bending strength of microstructures
8/23/2024 - PDF - English - IEC
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24/30499551 DC:2024
BS EN IEC 63516 Fixed folding durability test method for flexible opto-electric circuit boards
8/23/2024 - PDF - English - BSI
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24/30499009 DC:2024
BS IEC 63581-1 Semiconductor devices - The recognition criteria of defects in polished indium phosphide wafers Part 1: Classification
8/16/2024 - PDF - English - BSI
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24/30499026 DC:2024
BS EN IEC 61249-2-54 Materials for printed boards and other interconnecting structures Part 2-54. Reinforced base materials clad unclad. Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) flammability (vertical burning test), copper-clad high speed applications
8/16/2024 - PDF - English - BSI
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IEC 60384-9:2024
IEC 60384-9:2024 Fixed capacitors for use in electronic equipment - Part 9: Sectional specification - Fixed capacitors of ceramic dielectric, Class 2
8/14/2024 - - - IEC
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IEC 60384-8:2024
IEC 60384-8:2024 Fixed capacitors for use in electronic equipment - Part 8: Sectional specification - Fixed capacitors of ceramic dielectric, Class 1
8/14/2024 - - - IEC
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PD IEC TR 62715-5-61:2024
Flexible displays Overview of measurement and application scenarios stretchable
8/13/2024 - PDF - English - BSI
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IEC TR 62715-5-61:2024
IEC TR 62715-5-61:2024 Flexible displays - Part 5-61: Overview of measurement and application scenarios of stretchable displays
8/9/2024 - PDF - English - IEC
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24/30477141 DC:2024
BS ISO 13060 An adhesion evaluation method for microcircuits on PCB (Printed Circuit Board) by scratch test
8/9/2024 - PDF - English - BSI
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€438.00 -
BS EN IEC 60384-21:2024
Fixed capacitors for use in electronic equipment Sectional specification. surface mount multilayer of ceramic dielectric, Class 1
8/8/2024 - PDF - English - BSI
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BS EN IEC 60384-22:2024
Fixed capacitors for use in electronic equipment Sectional specification. surface mount multilayer of ceramic dielectric, Class 2
8/8/2024 - PDF - English - BSI
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€312.00 -
IEC 60512-28-100:2024
IEC 60512-28-100:2024 Connectors for electrical and electronic equipment - Tests and measurements - Part 28-100: Signal integrity tests up to 2 000 MHz - Tests 28a to 28g
8/2/2024 - PDF - English, French - IEC
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24/30498367 DC:2024
BS IEC 63145-201-10 Eyewear display Part 201-10: Measurement methods for VR type. Optical properties of a singlet lens used eyepieces
8/2/2024 - PDF - English - BSI
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DIN EN IEC 60749-34-1:2024-08
Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module (IEC 47/2759/CD:2022), Text in German and English
8/1/2024 - PDF - English, German - DIN
Learn More€102.00 -
NF EN IEC 60384-21, C93-112-21 (08/2024)
Condensateurs fixes utilisés dans les équipements électroniques - Partie 21 : spécification intermédiaire - Condensateurs multicouches fixes à diélectriques en céramique pour montage en surface, de Classe 1
8/1/2024 - Papier - French - AFNOR
Learn More€141.33 -
NF EN IEC 60384-22, C93-112-22 (08/2024)
Condensateurs fixes utilisés dans les équipements électroniques - Partie 22 : spécification intermédiaire - Condensateurs multicouches fixes à diélectriques en céramique pour montage en surface, de Classe 2
8/1/2024 - Papier - French - AFNOR
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PR NF EN IEC 60512-99-002/A1, C93-400-99-002/A1PR (08/2024)
Amendement 1 - Connecteurs pour équipements électriques et électroniques - Essais et mesures - Partie 99-002: Programmes d'essais d'endurance - Essai 99b: Programme d'essai pour le désaccouplement sous charge électrique
8/1/2024 - Papier - English, French - AFNOR
Learn More€36.50 -
DIN EN IEC 60393-4:2024-08
Potentiometers for use in electronic equipment - Part 4: Sectional specification: Single-turn rotary power potentiometers (IEC 60393-4:2023), German version EN IEC 60393-4:2023
8/1/2024 - PDF - German - DIN
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DIN IEC 63150-3:2024-08
Semiconductor devices - Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment - Part 3: Human foot impact motion (IEC 47/2758/CD:2022), Text in German and English
8/1/2024 - PDF - English, German - DIN
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24/30497861 DC:2024
BS EN IEC 63551-1. Semiconductor devices. Detection modules of autonomous land vehicle Part 1. Testing methods detection performance for LiDAR
8/1/2024 - PDF - English - BSI
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DIN EN IEC 61189-2-801:2024-08
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (IEC 61189-2-801:2023), German version EN IEC 61189-2-801:2023
8/1/2024 - PDF - German - DIN
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DIN EN IEC 61189-2-803:2024-08
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (IEC 61189-2-803:2023), German version EN IEC 61189-2-803:2023
8/1/2024 - PDF - German - DIN
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ISO/DIS 21254-1:2024
Lasers and laser-related equipment — Test methods for laser-induced damage threshold
7/30/2024 - - - ISO
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BS EN IEC 61643-332:2024
Components for low-voltage surge protection Selection and application principles metal oxide varistors (MOV)
7/26/2024 - PDF - English - BSI
Learn More€370.00 -
24/30497845 DC:2024
BS EN IEC 63553 Fully flexible Organic Light Emitting Diode (OLED) panels for general lighting - Performance requirements
7/26/2024 - PDF - English - BSI
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24/30497891 DC:2024
BS EN IEC 63211-3-3 Durability test methods for electronic displays Part 3-3. Mechanical tests. Dynamic stress
7/26/2024 - PDF - English - BSI
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24/30497917 DC:2024
BS EN IEC 62977-1-2 Electronic displays Part 1-2: Generic - Terminology and letter symbols
7/26/2024 - PDF - English - BSI
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24/30492549 DC:2024
BS ISO 24298 Intelligent transport systems - Public transport - Light emitting diode (LED) destination board system for public transport buses
7/25/2024 - PDF - English - BSI
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€196.00 -
IEEE 605:2023
IEEE Guide for Bus Design in Air Insulated Substations
7/24/2024 - Papier - English - IEEE
Learn More€320.00 -
€265.00
-
24/30497095 DC:2024
BS EN 62146-1 Capacitors for high-voltage alternating current circuit-breakers Part 1. General and grading capacitors
7/12/2024 - PDF - English - BSI
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24/30497104 DC:2024
BS EN IEC 60384-14/AMD1 Amendment 1. Fixed capacitors for use in electronic equipment Part 14. Sectional specification. electromagnetic interference suppression and connection to the supply mains
7/12/2024 - PDF - English - BSI
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24/30497109 DC:2024
BS EN IEC 63068-5 Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices Part 5. Test method using X-ray topography
7/12/2024 - PDF - English - BSI
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24/30497113 DC:2024
BS EN IEC 63567-1 Semiconductor devices. Performance evaluation of semiconductor processing components and inspection equipment Part 1. Transmittance method EUV pellicle
7/12/2024 - PDF - English - BSI
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24/30497132 DC:2024
BS IEC 62715-6-22 Flexible display devices Part 6-22: Crease and waviness measurement methods for foldable displays
7/12/2024 - PDF - English - BSI
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FD C96-029-1, C96-029-1U (07/2024)
Groupe obsolescence des équipements électroniques - Guide méthodologique de dimensionnement des stocks de fin de vie des composants et sous-ensembles électroniques
7/1/2024 - Papier - French - AFNOR
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PR NF EN IEC 63378-3, C86-378PR (07/2024)
Normalisation thermique des boîtiers de semiconducteurs - Partie 3 : modèles de simulation de circuits thermiques de boîtiers de semiconducteurs discrets pour analyse transitoire
7/1/2024 - Papier - English, French - AFNOR
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PR NF EN IEC 62680-1-3, C97-203-1-3PR (07/2024)
Interfaces de bus universel en série pour les données et l'alimentation électrique - Partie 1-3 : composants communs - Spécification des câbles et des connecteurs USB Type-C®
7/1/2024 - Papier - English, French - AFNOR
Learn More€348.00 -
FD C96-042 (07/2024)
Composants et systèmes électroniques - Guide d'achats hors circuits franchisés
7/1/2024 - Papier - French - AFNOR
Learn More€103.00 -
IEEE/IEC 62529:2024
IEEE/IEC International Standard for Signal and Test Definition
6/28/2024 - PDF - English - IEEE
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24/30493174 DC:2024
BS EN IEC 63489 DB. Common data concepts for smart manufacturing
6/28/2024 - PDF - English - BSI
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IEEE/IEC 62529:2024
IEEE/IEC International Standard for Signal and Test Definition
6/28/2024 - Papier - English - IEEE
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24/30495544 DC:2024
BS EN IEC 60384-14-1 Fixed capacitors for use in electronic equipment Part 14-1. Blank detail specification. electromagnetic interference suppression and connection to the supply mains. Assessment level DZ
6/21/2024 - PDF - English - BSI
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IEC 60384-21:2024 + Redline
IEC 60384-21:2024 (Redline version Commented) Fixed capacitors for use in electronic equipment - Part 21: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1
6/21/2024 - - - IEC
Learn MoreFrom: €325.00 -
IEC 60384-22:2024 + Redline
IEC 60384-22:2024 (Redline version Commented) Fixed capacitors for use in electronic equipment - Part 22: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2
6/21/2024 - - - IEC
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IEC 62522:2024 + Redline
IEC 62522:2024 (Redline version) Calibration of tuneable laser sources
6/20/2024 - - - IEC
Learn MoreFrom: €290.00 -
24/30495068 DC:2024
BS EN IEC 62906-5-8 Laser displays Part 5-8: Measurement of scanning characteristics for raster-scanning laser display
6/14/2024 - PDF - English - BSI
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BS IEC 62047-48:2024
Semiconductor devices. Micro-electromechanical devices Test method for determining solution concentration by optical absorption using MEMS fluidic device
6/11/2024 - PDF - English - BSI
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IEC 62047-48:2024
IEC 62047-48:2024 Semiconductor devices - Micro-electromechanical devices - Part 48: Test method for determining solution concentration by optical absorption using MEMS fluidic device
6/7/2024 - PDF - English - IEC
Learn More€93.00 -
BS EN IEC 61755-3-2:2024 + Redline
Tracked Changes. Fibre optic interconnecting devices and passive components. Connector optical interfaces Connector parameters of dispersion unshifted single-mode physically contacting fibres. Angled 2,5 mm 1,25 diameter cylindrical full zirconia ferrules
6/4/2024 - PDF - English - BSI
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BS EN IEC 61755-3-1:2024 + Redline
Tracked Changes. Fibre optic interconnecting devices and passive components. Connector optical interfaces parameters of dispersion unshifted single-mode physically contacting fibres. Non-angled 2,5 mm 1,25 diameter cylindrical full zirconia ferrules
6/4/2024 - PDF - English - BSI
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BS EN IEC 61189-2-808:2024
Test methods for electrical materials, printed board and other interconnection structures assemblies Thermal resistance of an assembly by thermal transient method
6/4/2024 - PDF - English - BSI
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DIN 50003:2024-06
Adhesive bondings in electronic applications - Determination of thermal conductivity of materials for heat dissipation
6/1/2024 - PDF - German - DIN
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DIN EN IEC 60747-15:2024-06
Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices (IEC 47E/812/CDV:2023), German and English version prEN IEC 60747-15:2023
6/1/2024 - PDF - English, German - DIN
Learn More€163.00 -
PR NF EN IEC 62391-2, C93-120-2PR (06/2024)
Condensateurs électriques fixes à double couche utilisés dans les équipements électroniques - Partie 2 : Spécification intermédiaire - Condensateurs électriques à double couche pour application de puissance
6/1/2024 - Papier - English, French - AFNOR
Learn More€100.50
