29.045 : Semiconducting materials

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  • DIN 50453-1:2023-08

    Testing of materials for semiconductor technology - Determination of etch rates of etching mixtures - Part 1: Silicium monocrystals, gravimetric method
    8/1/2023 - PDF - German - DIN
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    €45.98

  • DIN 50453-2:2023-08

    Testing of materials for semiconductor technology - Determination of etch rates of etching mixtures - Part 2: Silicon-dioxide coating, optical method
    8/1/2023 - PDF - German - DIN
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    €45.98

  • DIN 50451-8:2022-08

    Testing of materials for semiconductor technology - Determination of traces of elements in liquids - Part 8: Determination of 33 elements in high-purity sulfuric acid by ICP-MS
    8/1/2022 - PDF - German - DIN
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    €52.90

  • DIN 50451-5:2022-08

    Testing of materials for semiconductor technology - Determination of trace elements in liquids - Part 5: Guideline for the selection of materials and testing of their suitability for apparatus for sampling and sample preparation for the determination of trace elements in the range of micrograms per kilogram and nanograms per kilogram
    8/1/2022 - PDF - German - DIN
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    €52.90

  • BS IEC 62899-503-3:2021

    Printed electronics Quality assessment. Measuring method of contact resistance for the printed thin film transistor. Transfer length
    9/8/2021 - PDF - English - BSI
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    €180.00

  • IEC 62899-503-3:2021

    IEC 62899-503-3:2021 Printed electronics - Part 503-3: Quality assessment - Measuring method of contact resistance for the printed thin film transistor - Transfer length method
    8/24/2021 - PDF - English - IEC
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    €92.00

  • DIN 50450-9:2021-07

    Testing of materials for semiconductor technology - Determination of impurities in carrier gases and dopant gases - Part 9: Determination of oxygen, nitrogen, carbonmonoxide, carbondioxide, hydrogen and C<(Index)1>-C<(Index)3>-hydrocarbons in gaseous hydrogen chloride by gaschromatography
    7/1/2021 - PDF - German - DIN
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    €39.35

  • BS IEC 62899-503-1:2020

    Printed electronics Quality assessment. Test method of displacement current measurement for printed thin-film transistor
    9/25/2020 - PDF - English - BSI
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    €180.00

  • IEC 62899-503-1:2020

    IEC 62899-503-1:2020 Printed electronics - Part 503-1: Quality assessment - Test method of displacement current measurement for printed thin-film transistor
    5/27/2020 - PDF - English - IEC
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    €92.00

  • PD IEC TR 60146-1-2:2019

    Semiconductor converters. General requirements and line commutated converters Application guide
    11/13/2019 - PDF - English - BSI
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    €398.00

  • IEC TR 60146-1-2:2019

    IEC TR 60146-1-2:2019 Semiconductor converters - General requirements and line commutated converters - Part 1-2: Application guidelines
    10/22/2019 - PDF - English - IEC
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    €431.00

  • IEC TR 60146-1-2:2019 + Redline

    IEC TR 60146-1-2:2019 (Redline version) Semiconductor converters - General requirements and line commutated converters - Part 1-2: Application guidelines
    10/22/2019 - PDF - English - IEC
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    €561.00

  • BS IEC 62899-203:2018

    Printed electronics Materials. Semiconductor ink
    10/10/2018 - PDF - English - BSI
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    €250.00

  • IEC 62899-203:2018

    IEC 62899-203:2018 Printed electronics - Part 203: Materials - Semiconductor ink
    9/28/2018 - PDF - English - IEC
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    €173.00

  • DIN 50451-7:2018-04

    Testing of materials for semiconductor technology - Determination of traces of elements in liquids - Part 7: Determination of 31 elements in high-purity hydrochloric acid by ICP-MS
    4/1/2018 - PDF - German - DIN
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    €59.63

  • DIN SPEC 1994:2017-02

    Testing of materials for semiconductor technology - Determination of anions in weak acids
    2/1/2017 - PDF - German - DIN
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    €42.43

  • NF EN 62047-25, C96-050-25 (12/2016)

    Semiconductor devices - Micro-electromechanical devices - Part 25 : silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
    12/1/2016 - Paper - French - AFNOR
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    €103.33

  • ASTM F980-16(2024)

    Standard Guide for Measurement of Rapid Annealing of Neutron-Induced Displacement Damage in Silicon Semiconductor Devices
    12/1/2016 - PDF - English - ASTM
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    €60.00

  • ASTM F980-16(2024) + Redline

    Standard Guide for Measurement of Rapid Annealing of Neutron-Induced Displacement Damage in Silicon Semiconductor Devices
    12/1/2016 - PDF - English - ASTM
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    €72.00

  • NF EN 62047-22, C96-050-22 (12/2014)

    Semiconductor devices - Micro-electromechanical devices - Part 22 : electromechanical tensile test method for conductive thin films on flexible substrates - Dispositifs à semiconducteurs
    12/1/2014 - Paper - French - AFNOR
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    €72.00

  • DIN 50451-3:2014-11

    Testing of materials for semiconductor technology - Determination of traces of elements in liquids - Part 3: Determination of 31 elements in high-purity nitric acid by ICP-MS
    11/1/2014 - PDF - German - DIN
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    €72.80

  • DIN 50451-6:2014-11

    Testing of materials for semiconductor technology - Determination of traces of elements in liquids - Part 6: Determination of 36 elements in a high-purity ammonium fluoride solution (NH<(Index)4>F) and in etching mixtures of high-purity ammonium fluoride solution containing hydrofluoric acid
    11/1/2014 - PDF - German - DIN
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    €59.63

  • NF EN 62047-11, C96-050-11 (03/2014)

    Semiconductor devices - Micro-electromechanical devices - Part 11 : test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems - Dispositifs à semiconducteurs
    3/1/2014 - Paper - French - AFNOR
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    €103.33

  • NF EN 62047-18, C96-050-18 (02/2014)

    Semiconductor devices - Micro-electromechanical devices - Part 18 : bend testing methods of thin film materials - Dispositifs à semiconducteurs
    2/1/2014 - Paper - French - AFNOR
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    €88.33

  • ASTM D6095-12(2023)

    Standard Test Method for Longitudinal Measurement of Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
    11/1/2012 - PDF - English - ASTM
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    €48.00

  • NF EN 62047-9, C96-050-9 (04/2012)

    Semiconductor devices - Micro-electromechanical devices - Part 9 : wafer to wafer bonding strength measurement for MEMS - Dispositifs à semiconducteurs
    4/1/2012 - Paper - French - AFNOR
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    €103.33

  • ASTM D6095-12(2023) + Redline

    Standard Test Method for Longitudinal Measurement of Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
    1/1/2012 - PDF - English - ASTM
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    €57.00

  • ASTM E1438-11(2019)

    Standard Guide for Measuring Widths of Interfaces in Sputter Depth Profiling Using SIMS
    1/1/2011 - PDF - English - ASTM
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    €46.00

  • ASTM E1438-11(2019) + Redline

    Standard Guide for Measuring Widths of Interfaces in Sputter Depth Profiling Using SIMS
    1/1/2011 - PDF - English - ASTM
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    €53.00

  • BS EN 60146-1-1:2010

    Semiconductor converters. General requirements and line commutated converters Specification of basic
    8/31/2010 - PDF - English - BSI
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    €377.00

  • GB/T 1558-2009

    Test method for substitutional atomic carbon concent of silicon by infrared absorption
    10/30/2009 - PDF - English - CODCHI
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    €165.00

  • DIN 50455-1:2009-10

    Testing of materials for semiconductor technology - Methods for characterizing photoresists - Part 1: Determination of coating thickness with optical methods
    10/1/2009 - PDF - German - DIN
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    €39.35

  • DIN 50452-2:2009-10

    Testing of materials for semiconductor technology - Test method for particle analysis in liquids - Part 2: Determination of particles by optical particle counters
    10/1/2009 - PDF - German - DIN
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    €52.90

  • IEC 60146-1-1:2009

    IEC 60146-1-1:2009 Semiconductor converters - General requirements and line commutated converters - Part 1-1: Specification of basic requirements
    6/29/2009 - PDF - English, French - IEC
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    €431.00

  • ASTM D3004-08(2020)

    Standard Specification for Crosslinked and Thermoplastic Extruded Semi-Conducting, Conductor, and Insulation Shielding Materials
    1/1/2008 - PDF - English - ASTM
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    €46.00

  • ASTM D3004-08(2020) + Redline

    Standard Specification for Crosslinked and Thermoplastic Extruded Semi-Conducting, Conductor, and Insulation Shielding Materials
    1/1/2008 - PDF - English - ASTM
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    €53.00

  • DIN 50451-4:2007-02

    Testing of materials for semiconductor technology - Determination of trace elements in liquids - Part 4: Determination of 34 elements in ultra pure water by mass spectrometry with inductively coupled plasma (ICP-MS)
    2/1/2007 - PDF - German - DIN
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    €59.63

  • BS EN 62226-2-1:2005

    Exposure to electric or magnetic fields in the low and intermediate frequency range. Methods for calculating current density internal field induced human body 2D models
    2/11/2005 - PDF - English - BSI
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    €348.00

  • JIS R 1650-1:2002 (R2016)

    Testing method for fine ceramics thermoelectric materials Part 1: Thermoelectric power
    3/20/2002 - PDF - Japanese - JSA
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    €25.00

  • JIS R 1650-2:2002 (R2016)

    Testing method for fine ceramics thermoelectric materials Part 2: Resistivity
    3/20/2002 - PDF - Japanese - JSA
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    €25.00

  • JIS R 1650-3:2002 (R2016)

    Method for measurement of fine ceramics thermoelectric materials Part 3: Thermal diffusivity, specific heat capacity, and thermal conductivity
    3/20/2002 - PDF - Japanese - JSA
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    €25.00

  • JIS R 1651:2002 (R2016)

    Method for measurement of pyroelectric coefficient of fine ceramics
    3/20/2002 - PDF - Japanese - JSA
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    €25.00

  • JIS R 1801:2002 (R2016)

    Method of measuring spectral emissivity of ceramic radiating materials for infrared heaters by using FTIR
    3/20/2002 - PDF - Japanese - JSA
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    €25.00

  • DIN 50455-2:1999-11

    Testing of materials for semiconductor technology - Methods for the characterisation photoresists - Part 2: Determination of photosensitivity of positive photoresists
    11/1/1999 - PDF - German - DIN
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    €32.34

  • DIN 50455-2:1999-11

    Characterization of photoresists used in semiconductor technology - Part 2: Determination of photosensitivity of positive photoresists
    11/1/1999 - PDF - English - DIN
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    €40.56

  • JIS H 0614:1996 (R2015)

    Visual inspection for silicon wafers with specular surfaces
    1/1/1996 - PDF - Japanese - JSA
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    €25.00

  • DIN 50452-1:1995-11

    Testing of materials for semiconductor technology - Test method for particle analysis in liquids - Part 1: Microscopic determination of particles
    11/1/1995 - PDF - German - DIN
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    €32.34

  • DIN 50452-1:1995-11

    Testing of materials for semiconductor technology - Test method for particle analysis in liquids - Part 1: Microscopic determination of particles
    11/1/1995 - PDF - English - DIN
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    €40.56

  • JIS H 0602:1995 (R2015)

    Testing method of resistivity for silicon crystals and silicon wafers with four-point probe
    11/1/1995 - PDF - Japanese - JSA
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    €25.00

  • DIN 50452-3:1995-10

    Testing of materials for semiconductor technology - Test method for particle analysis in liquids - Part 3: Calibration of optical particle counters
    10/1/1995 - PDF - German - DIN
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    €39.35

  • DIN 50452-3:1995-10

    Testing of materials for semiconductor technology - Test method for particle analysis in liquids - Part 3: Calibration of optical particle counters
    10/1/1995 - PDF - English - DIN
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    €49.16

  • JIS H 0604:1995 (R2014)

    Measuring of minority-carrier lifetime in silicon single crystal by photoconductive decay method
    7/1/1995 - PDF - Japanese - JSA
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    €25.00

  • JIS H 0611:1994 (R2015)

    Methods of measurement of thickness, thickness variation and bow for silicon wafer
    1/1/1994 - PDF - Japanese - JSA
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    €25.00

  • DIN 50450-4:1993-09

    Testing of materials for semiconductor technology; determination of impurities in carrier gases and dopant gases; determination of C1-C3-hydrocarbons in nitrogen by gas-chromatography
    9/1/1993 - PDF - German - DIN
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    €32.34

  • DIN 50450-2:1991-03

    Testing of materials for semiconductor technology; determination of impurities in carrier gases and doping gases; determination of oxygen impurity in N2, Ar, He, Ne and H2 by using a galvanic cell
    3/1/1991 - PDF - German - DIN
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    €32.34

  • DIN 50450-1:1987-08

    Testing of materials for semiconductor technology; determination of impurities in carrier gases and doping gases; determination of water impurity in hydrogen, oxygen, nitrogen, argon and helium by using a diphosphorus pentoxide cell
    8/1/1987 - PDF - German - DIN
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    €32.34

  • DIN 1715-1:1983-11

    Thermostat metals, technical delivery conditions
    11/1/1983 - PDF - German - DIN
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    €45.98

  • DIN 1715-1:1983-11

    Thermostat metals, technical delivery conditions
    11/1/1983 - PDF - English - DIN
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    €57.57

  • DIN 1715-2:1983-11

    Thermostat metals, testing the specific thermal curvature
    11/1/1983 - PDF - German - DIN
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    €32.34

  • DIN 1715-2:1983-11

    Thermostat metals, testing the specific thermal curvature
    11/1/1983 - PDF - English - DIN
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    €40.56

  • JIS H 0603:1978 (R2014)

    Measurement of minority carrier life time in germanium by photoconductive decay method
    3/1/1978 - PDF - Japanese - JSA
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    €25.00

  • JIS H 0607:1978 (R2014)

    Determination of conductivity type in germanium by thermoelectromotive method
    3/1/1978 - PDF - Japanese - JSA
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    €25.00

  • JIS H 0613:1978 (R2014)

    Visual inspection for sliced and lapped silicon wafers
    1/1/1978 - PDF - Japanese - JSA
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    €25.00

  • JIS H 0610:1966 (R2014)

    Method of measurement of etch pit density of germanium crystal
    12/1/1966 - PDF - Japanese - JSA
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    €25.00

  • JIS H 0601:1962 (R2014)

    Testing methods of resistivity for germanium
    6/1/1962 - PDF - Japanese - JSA
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    €25.00

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