29.045 : Semiconducting materials
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NF EN 62047-25, C96-050-25 (12/2016)
Semiconductor devices - Micro-electromechanical devices - Part 25 : silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
12/1/2016 - Paper - French -
Learn More€103.33 -
NF EN 62047-22, C96-050-22 (12/2014)
Semiconductor devices - Micro-electromechanical devices - Part 22 : electromechanical tensile test method for conductive thin films on flexible substrates - Dispositifs à semiconducteurs
12/1/2014 - Paper - French -
Learn More€72.00 -
NF EN 62047-11, C96-050-11 (03/2014)
Semiconductor devices - Micro-electromechanical devices - Part 11 : test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems - Dispositifs à semiconducteurs
3/1/2014 - Paper - French -
Learn More€103.33 -
NF EN 62047-18, C96-050-18 (02/2014)
Semiconductor devices - Micro-electromechanical devices - Part 18 : bend testing methods of thin film materials - Dispositifs à semiconducteurs
2/1/2014 - Paper - French -
Learn More€88.33 -
NF EN 62047-9, C96-050-9 (04/2012)
Semiconductor devices - Micro-electromechanical devices - Part 9 : wafer to wafer bonding strength measurement for MEMS - Dispositifs à semiconducteurs
4/1/2012 - Paper - French -
Learn More€103.33
