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01.100.25 : Electrical and electronics engineering drawings

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  • VG 95001-8:2022-11

    VG 95001-8:2022-11

    Drawing set - Part 8: Code letters for type of documents, Text in German and English
    11/1/2022 - PDF - English, German - DIN
    Learn More
    €59.63

  • DIN EN IEC 61837-2:2021-06

    DIN EN IEC 61837-2:2021-06

    Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2018 + A1:2020), German version EN IEC 61837-2:2018 + A1:2020.
    6/1/2021 - PDF - German - DIN
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    €246.73

  • BS IEC 60191-2:1966+A21:2020

    BS IEC 60191-2:1966+A21:2020

    Mechanical standardization of semiconductor devices Dimensions
    4/2/2020 - PDF - English - BSI
    Learn More
    €449.00

  • DIN EN IEC 60191-1:2018-10

    DIN EN IEC 60191-1:2018-10

    Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018), German version EN IEC 60191-1:2018.
    10/1/2018 - PDF - German - DIN
    Learn More
    €131.96

  • VG 95340-1:2017-10

    VG 95340-1:2017-10

    Complete circuit diagram - Part 1: Installation of power installations in cabins and motorcar box bodies, 400/230 V, 50 Hz, 32 A, interface standard, Text in German and English
    10/1/2017 - PDF - English, German - DIN
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    €45.98

  • VG 95340-2:2017-10

    VG 95340-2:2017-10

    Complete circuit diagram - Part 2: Installation of power installations in cabins and motorcar box bodies, 230 V, 50 Hz, 16 A, interface standard, Text in German and English
    10/1/2017 - PDF - English, German - DIN
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    €45.98

  • DIN EN 61240:2017-08

    DIN EN 61240:2017-08

    Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules (IEC 61240:2016), German version EN 61240:2017).
    8/1/2017 - PDF - German - DIN
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    €92.62

  • 13/30290470 DC:2013

    13/30290470 DC:2013

    BS EN 60191-2/F71. Proposed new package outline. P-ZMP-P89
    9/11/2013 - PDF - English - BSI
    Learn More
    €24.00

  • DIN EN 60191-6-22:2013-08

    DIN EN 60191-6-22:2013-08

    Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012), German version EN 60191-6-22:2013
    8/1/2013 - PDF - German - DIN
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    €92.62

  • BS EN 60848:2013

    BS EN 60848:2013

    GRAFCET specification language for sequential function charts
    7/31/2013 - PDF - English - BSI
    Learn More
    €348.00

  • DIN EN 60191-6-12:2011-12

    DIN EN 60191-6-12:2011-12

    Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011), German version EN 60191-6-12:2011.
    12/1/2011 - PDF - German - DIN
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    €92.62

  • DIN EN 60191-6-17:2011-09

    DIN EN 60191-6-17:2011-09

    Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011), German version EN 60191-6-17:2011
    9/1/2011 - PDF - German - DIN
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    €110.00

  • BS EN 60191-6-12:2011

    BS EN 60191-6-12:2011

    Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages. Design guidelines fine-pitch land grid array (FLGA)
    8/31/2011 - PDF - English - BSI
    Learn More
    €250.00

  • BS EN 60191-6-17:2011

    BS EN 60191-6-17:2011

    Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages. Design guide stacked Fine-pitch ball grid array and fine-pitch land (P-PFBGA P-PFLGA)
    6/30/2011 - PDF - English - BSI
    Learn More
    €250.00

  • DIN EN 60191-6-20:2011-03

    DIN EN 60191-6-20:2011-03

    Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010), German version EN 60191-6-20:2010
    3/1/2011 - PDF - German - DIN
    Learn More
    €79.72

  • DIN EN 60191-6-21:2011-03

    DIN EN 60191-6-21:2011-03

    Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010), German version EN 60191-6-21:2010
    3/1/2011 - PDF - German - DIN
    Learn More
    €92.62

  • DIN EN 60191-6-18:2010-08

    DIN EN 60191-6-18:2010-08

    Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010), German version EN 60191-6-18:2010
    8/1/2010 - PDF - German - DIN
    Learn More
    €99.35

  • DIN EN 60191-6:2010-06

    DIN EN 60191-6:2010-06

    Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009), German version EN 60191-6:2009.
    6/1/2010 - PDF - German - DIN
    Learn More
    €131.96

  • ASME Y14.44-2008 (R2014)

    ASME Y14.44-2008 (R2014)

    Reference Designations for Electrical and Electronics Parts and Equipment
    1/1/2008 - PDF DRM - English - ASME
    Learn More
    €45.00

  • DIN EN 60191-3 Beiblatt 1:2006-08

    DIN EN 60191-3 Beiblatt 1:2006-08

    Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms
    8/1/2006 - PDF - German - DIN
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    €52.90

  • DIN EN 60191-6-10:2004-05

    DIN EN 60191-6-10:2004-05

    Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON (IEC 60191-6-10:2003); German version EN 60191-6-10:2003
    5/1/2004 - PDF - German - DIN
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    €72.80

  • DIN EN 60191-6-4:2004-01

    DIN EN 60191-6-4:2004-01

    Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003
    1/1/2004 - PDF - German - DIN
    Learn More
    €85.79

  • BS EN 60191-6-2:2002

    BS EN 60191-6-2:2002

    Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide 1,50 mm, 1,27 mm and 1,00 pitch ball column terminal
    3/4/2003 - PDF - English - BSI
    Learn More
    €151.00

  • DIN 1304-9:2003-01

    DIN 1304-9:2003-01

    Letter symbols for physical quantities - Part 9: Symbols for equivalent circuits of piezoelectric crystals
    1/1/2003 - PDF - German - DIN
    Learn More
    €45.98

  • DIN EN 60191-6-2:2002-09

    DIN EN 60191-6-2:2002-09

    Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages, Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001), German version EN 60191-6-2:2002
    9/1/2002 - PDF - German - DIN
    Learn More
    €72.80

  • DIN EN 60191-6-1:2002-08

    DIN EN 60191-6-1:2002-08

    Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages, Design guide for gull-wing lead terminals (IEC 60191-6-1:2001), German version EN 60191-6-1:2001
    8/1/2002 - PDF - German - DIN
    Learn More
    €52.90

  • DIN EN 60191-6-5:2002-05

    DIN EN 60191-6-5:2002-05

    Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages, Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001), German version EN 60191-6-5:2001
    5/1/2002 - PDF - German - DIN
    Learn More
    €72.80

  • DIN EN 60191-6-8:2002-05

    DIN EN 60191-6-8:2002-05

    Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages, Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001), German version EN 60191-6-8:2001
    5/1/2002 - PDF - German - DIN
    Learn More
    €72.80

  • BS EN 60191-6-1:2001

    BS EN 60191-6-1:2001

    Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide gull-wing lead terminals
    3/29/2002 - PDF - English - BSI
    Learn More
    €151.00

  • DIN EN 60191-6-6:2002-02

    DIN EN 60191-6-6:2002-02

    Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages, Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001), German version EN 60191-6-6:2001
    2/1/2002 - PDF - German - DIN
    Learn More
    €72.80

  • BS EN 60191-6-8:2001

    BS EN 60191-6-8:2001

    Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide glass sealed ceramic quad flatpack (G-QFP)
    11/16/2001 - PDF - English - BSI
    Learn More
    €151.00

  • BS EN 60191-6-5:2001

    BS EN 60191-6-5:2001

    Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide fine-pitchball grid array (FBGA)
    11/15/2001 - PDF - English - BSI
    Learn More
    €151.00

  • DIN EN 60139:2001-10

    DIN EN 60139:2001-10

    Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges (IEC 60139:2000), German version EN 60139:2001
    10/1/2001 - PDF - German - DIN
    Learn More
    €110.00

  • BS EN 60191-6-6:2001

    BS EN 60191-6-6:2001

    Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide fine pitch land grid array (FLGA) Proposed amendment on terminology
    9/5/2001 - PDF - English - BSI
    Learn More
    €180.00

  • BS EN 60139:2001

    BS EN 60139:2001

    Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges
    8/15/2001 - PDF - English - BSI
    Learn More
    €293.00

  • DIN EN 60191-6-3:2001-06

    DIN EN 60191-6-3:2001-06

    Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages, Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000), German version EN 60191-6-3:2000
    6/1/2001 - PDF - German - DIN
    Learn More
    €59.63

  • BS EN 60191-6-3:2001

    BS EN 60191-6-3:2001

    Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Measuring methods package dimensions quad flat packs (QFP)
    5/15/2001 - PDF - English - BSI
    Learn More
    €180.00

  • DIN EN 60191-3:2000-07

    DIN EN 60191-3:2000-07

    Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999), German version EN 60191-3:1999
    7/1/2000 - PDF - German - DIN
    Learn More
    €136.82

  • BS EN 60191-3:2000

    BS EN 60191-3:2000

    Mechanical standardization of semiconductor devices General rules for the preparation outline drawings integrated circuits
    6/15/2000 - PDF - English - BSI
    Learn More
    €348.00

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Published by
  1. ASME (1)
  2. BSI (13)
  3. DIN (25)
Document type
  1. Draft standard (1)
  2. Norms amendments (1)
  3. Standard (37)

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