EIA-364-61A:2014 (R2019)

EIA-364-61A:2014 (R2019)

TP-61A Resistance to Soldering Heat from Rework Test Procedure for Electrical Connectors and Sockets Mounted on Printed Circuit Boards

€86.10

Details

This standard establishes a test method for determining if connectors or sockets can withstand exposure to solder rework conditions using either soldering iron, solder pot / fountain / wave solder, or hot gas / vapor techniques. It is important to note that compliant pin connectors or sockets can be affected by solder rework if they are in close proximity to other connectors or sockets undergoing solder rework.

Additional Info

Author Electronic Components Industry Association (ECIA)
Published by EIA
Document type Standard
Confirmation date 2019-12-01
ICS 29.120.20 : Connecting devices
Number of pages 18
Replace EIA-364-61 (2013-02)
Cross references ANSI/EIA-364-61-A (2014), IDT
Document history EIA-364-61A (2014-05),EIA-364-61 (2013-02)
Keyword EIA 364,EIA 364.61A,EIA-364,364