Name | Support | Language | Availability | Edition date | Price | ||
---|---|---|---|---|---|---|---|
PDF sécurisé |
English |
Active |
5/1/2014 |
€86.10 |
|
Details
This standard establishes a test method for determining if connectors or sockets can withstand exposure to solder rework conditions using either soldering iron, solder pot / fountain / wave solder, or hot gas / vapor techniques. It is important to note that compliant pin connectors or sockets can be affected by solder rework if they are in close proximity to other connectors or sockets undergoing solder rework.
Additional Info
Author | Electronic Components Industry Association (ECIA) |
---|---|
Published by | EIA |
Document type | Standard |
Confirmation date | 2019-12-01 |
ICS | 29.120.20 : Connecting devices
|
Number of pages | 18 |
Replace | EIA-364-61 (2013-02) |
Cross references | ANSI/EIA-364-61-A (2014), IDT |
Document history | EIA-364-61A (2014-05),EIA-364-61 (2013-02) |
Keyword | EIA 364,EIA 364.61A,EIA-364,364 |