| Name | Support | Language | Availability | Edition date | Price | ||
|---|---|---|---|---|---|---|---|
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PDF |
English, German |
Available |
11/1/2018 |
€141.96 |
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Details
This part of series DIN EN 60749 applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture sensitive devices that are exposed to the ambient air. It provides standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs which have been classified to the levels defined in IEC 60749-20.
Additional Info
| Author | Deutsche Institut für Normung e.V. (DIN) |
|---|---|
| Published by | DIN |
| Document type | Draft standard |
| ICS | 31.080.01 : Semiconductor devices in general
|
| Number of pages | 79 |
| Cross references | prEN IEC 60749-20-1 (2018-07), IDT,IEC 47/2488/CDV (2018-07), IDT |
| Set | MYSTD-20STD |
| Document history | |
| Keyword | DIN EN IEC 60749-20-1 |
